10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel
MPN: 10M25DCF484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $61.27 | $61.27 |
| 10 | $57.5 | $575.00 |
| 100 | $52.1 | $5,210.00 |
| 500 | $47.8 | $23,900.00 |
| 1,000 | $44.95 | $44,950.00 |
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View Datasheet →10M25DCF484I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory (Kbits) | 1,728 |
| User I/O Count | 360 |
| Package | 484-BGA (FineLine BGA, F484) |
| Operating Temperature | -40C to +100C (industrial I7 grade) |
| Supply Voltage | 1.2 V core |
| Process Technology | 55 nm TSMC non-volatile flash |
| On-chip Flash Configuration | 5 Mb (dual-image support) |
| PLLs | Up to 4 |
| Global Clock Networks | 20 |
| Multipliers (18x18) | 55 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Programming Interface | JTAG / Active Serial (AS) |
10M25DCF484I7G 484-bga (fineline bga, f484) Pin Configuration Guide
Complete pinout information for 10M25DCF484I7G (484-bga (fineline bga, f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DCF484I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DCF484I7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, LED Display Controllers, Sensor Aggregation Hubs, Portable Medical Instrumentation, Automotive Body Electronics.
Industrial Motor Control
The 10M25DCF484I7G suits industrial motor control designs because its 25,000 logic elements and 360 GPIO can drive multi-axis stepper and BLDC controllers while the integrated flash stores commutation tables and field-upgradeable firmware. The I7 industrial temperature grade (-40C to +100C) tolerates factory-floor heat near drives and inverters, and the 4 PLLs generate the precise PWM-aligned clocks required for sinusoidal commutation at 20-50 kHz. Dual-configuration flash enables fail-safe field firmware rollback if a motor-tuning update fails. A typical reference design uses 30-40% of the 25K LE for PWM generators, encoder counters, and protection state machines, leaving room for Ethernet/IP or Modbus TCP integration.
Recommended
Factory Automation I/O Expansion
The 10M25DCF484I7G works well as a programmable I/O expander and protocol bridge in factory automation racks where it can convert between Profinet, EtherCAT, RS-485, and 24 V discrete signals. With 360 user I/O available on the 484-BGA, designers can implement 32-channel isolated digital input modules plus 16-channel PWM/analog outputs in a single chip. The integrated ADC blocks sample 4-20 mA analog inputs directly, eliminating external ADC ICs. The non-volatile on-chip flash allows instant-on startup without external boot delays, critical for deterministic PROFINET IRT cycle times below 1 ms.
Recommended
LED Display Controllers
The 10M25DCF484I7G drives large LED video walls and signage displays because its 360 GPIO can sustain hundreds of PWM channels for color-mixing and brightness control without external LED drivers. With 55 18x18 multipliers and 1,728 Kbits of embedded RAM, it can perform real-time gamma correction, color-space conversion, and refresh-rate doubling at 60-120 Hz. The 484-BGA package supports the high pin count required for parallel RGB/HUB75 interfaces to LED panels. Designers typically consume 40% of the LE fabric for pixel pipelines and 30% of M9K memory for frame buffers in dual-buffered scan-mode displays.
Recommended
Sensor Aggregation Hubs
The 10M25DCF484I7G functions as a multi-sensor aggregation node that collects data from SPI, I2C, UART, and LVDS sensors and forwards preprocessed streams over Ethernet or USB. The 25K LE fabric supports hardware-accelerated filtering, FFT pre-processing, and threshold detection, offloading the host processor. The integrated 1.2 V core and I7 industrial temperature range suit outdoor IoT gateway deployments. Dual-configuration flash enables OTA firmware updates that revert automatically if validation fails, a critical reliability feature for remote sensor installations.
Recommended
Portable Medical Instrumentation
The 10M25DCF484I7G suits portable medical devices such as patient monitors, infusion pumps, and handheld ultrasound probes because its integrated flash eliminates external boot devices, reducing PCB area and BOM cost. The 25K LE fabric can implement custom DSP filters for ECG, SpO2, and pulse-oximetry signal conditioning while the 55 multipliers accelerate FFT-based heart-rate-variability analysis. Industrial-grade temperature tolerance ensures stable operation in clinical environments from cold-stored reagents to body-worn warm enclosures. Non-volatile configuration supports FDA 21 CFR Part 11 audit trails when paired with secure bootloaders.
Recommended
Automotive Body Electronics
The 10M25DCF484I7G can be deployed in body-control modules, instrument clusters, and lighting controllers where its 25K LE density handles LIN/CAN gateway logic, LED matrix driving, and stepper-motor gauge control. With 360 GPIO available, designers can interface directly with discrete body-electronics sensors and actuators without external muxing. While the I7 industrial grade (-40C to +100C) suits most cabin applications, designs targeting under-hood deployment should migrate to the A7 automotive grade (-40C to +125C) variant such as 10M25DCF484A7G, which uses the same silicon die and 484-FBGA footprint.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DCF484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DCF484C8G | 10M25DCF484A7G | 10M25DAF484I7G | 10M25DAF484C8G | 10M25DAF484A7G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (FineLine BGA, F484) | 484-BGA (FineLine BGA, F484) - same | 484-BGA (FineLine BGA, F484) - same | 484-BGA (FineLine BGA, F484) - same | 484-BGA (FineLine BGA, F484) - same | 484-BGA (FineLine BGA, F484) - same |
| Logic Elements | 25,000 | 25,000 (same) | 25,000 (same) | 25,000 (same) | 25,000 (same) | 25,000 (same) |
| Configuration Flash | 5 Mb dual-image | 5 Mb dual-image (same) | 5 Mb dual-image (same) | 5 Mb single-image | 5 Mb single-image | 5 Mb single-image |
| User I/O | 360 | 360 (same) | 360 (same) | 360 (same) | 360 (same) | 360 (same) |
| Temperature Grade | -40C to +100C (I7 industrial) | 0C to +85C (C8 commercial) | -40C to +125C (A7 automotive) | -40C to +100C (I7 industrial) | 0C to +85C (C8 commercial) | -40C to +125C (A7 automotive) |
| Embedded Memory (Kbits) | 1,728 | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) |
| Multipliers (18x18) | 55 | 55 (same) | 55 (same) | 55 (same) | 55 (same) | 55 (same) |
| PLLs | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
Key Differentiators
- Dual-image on-chip flash for fail-safe field upgrades (vs 10M25DAF484I7G)
- Industrial -40C to +100C temperature grade (vs 10M25DCF484C8G)
- Integrated 5 Mb configuration flash eliminates external boot PROM (vs Lattice ECP5 LFE5U-25F)
- 360 user I/O in 484-BGA for high-density parallel interfaces (vs Lattice LCMXO2-7000HE)
Design Notes
Decoupling is critical for MAX 10 FPGAs: place 100 nF ceramic X7R capacitors on every VCCIO and VCCA supply pin within 100 mils (2.5 mm) of the BGA ball, and add 10 uF bulk tantalum or polymer capacitors at each supply rail entry point. The 484-FBGA package draws up to 1.5 A transient current during configuration flash writes, so power-rail bandwidth must support at least 3 A per supply. Estimated: with 360 GPIO toggling at 50 MHz and typical 25% switching activity, dynamic current reaches approximately 800 mA on VCCINT - verify with the Quartus Prime PowerPlay analyzer before finalizing the PDN design.
The 484-BGA FineLine package uses 1.0 mm ball pitch, requiring microvia or via-in-pad PCB technology for reliable fanout. Use a 4-6 layer stack-up with dedicated ground and power planes beneath the device; signal layers should escape diagonally to avoid via congestion. Match trace lengths within 150 mils for DDR3/Quads interfaces if implemented. The exposed die-attach pad under the BGA should be soldered to the PCB thermal pad with an array of thermal vias (0.3 mm drill, 0.5 mm pitch) tied to the internal ground plane for heatsinking. Estimated: theta_JA drops from 22 C/W (no thermal pad) to 8 C/W (thermal pad with 16 vias).
Three common pitfalls when bringing up the 10M25DCF484I7G: (1) Forgetting that JTAG and Active Serial modes share TCK/TMS pins - if both are connected, add 4.7 kohm resistors for isolation; (2) Configuring I/O banks at 3.3 V when adjacent banks need 2.5 V - VCCIO must match I/O standard per bank; (3) Using dual-image mode without reserving sufficient flash space - the bitstream image can grow up to 4 Mb for 25K LE designs, leaving only 1 Mb for the second image. Verify all configuration settings in Quartus Prime before generating the final POF file.
When routing high-speed LVDS or DDR interfaces from the 10M25DCF484I7G, target 100 ohm differential impedance and 50 ohm single-ended impedance on the PCB stack-up. Keep series-termination resistors within 200 mils of the FPGA driver pins, and avoid stubs by using proper layer transitions with ground-return vias adjacent to signal vias. For multi-gigabit LVDS pairs, use length matching within 25 mils and skew compensation at the receiver. The MAX 10 PLL output jitter is typically 250 ps p-p; budget no more than 50% of your timing margin to PLL-induced jitter.
Compliance Information
RoHS and REACH compliance confirmed via Intel product page. I7 grade is industrial temperature, not AEC-Q100; choose 10M25DCF484A7G (A7 suffix) for AEC-Q100 automotive qualification. Halogen-free status not explicitly stated in verified data; conflict minerals compliance declared by Intel.
