5M2210ZF256I5 - MAX V CPLD, 1700 LE, FBGA-256 | Intel
MPN: 5M2210ZF256I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.45 | $13,225.00 |
| 1,000 | $23.9 | $23,900.00 |
Drop-in alternatives for 5M2210ZF256I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M2210ZF256C5N
✅ Drop-In✓ In Stock
$5.49 / Unit
View Datasheet →5M2210ZF256A5N
✅ Drop-In✓ In Stock
$20.9 / Unit
View Datasheet →5M2210ZF256I5N
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$17.5 / Unit
View Datasheet →5M1270ZF256I5N
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$7.55 / Unit
View Datasheet →5M1270ZF256C5N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →5M2210ZF256I5 Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device | 5M2210Z |
| Logic Elements (Macro Cells) | 1700 |
| Maximum Internal Frequency (fMAX) | 201.1 MHz |
| Core Supply Voltage | 1.8 V |
| User I/O (max, package-dependent) | 212 |
| Package | FBGA-256 (256-ball FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Configuration Memory | Non-volatile flash |
| Operating Temperature (Industrial) | -40C to +100C |
| Programming Interface | JTAG (IEEE 1149.1) / in-system |
| I/O Bank Voltages Supported | 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Tray Standard Quantity | 119 |
5M2210ZF256I5 Pin Configuration
| Pin A1 | I/O — General-purpose user I/O (bank 1) |
| Pin B1 | I/O — General-purpose user I/O (bank 1) |
| Pin C1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin D1 | I/O — General-purpose user I/O (bank 1) |
| Pin E1 | I/O — General-purpose user I/O (bank 1) |
| Pin F1 | GND — Ground |
| Pin G1 | I/O — General-purpose user I/O (bank 1) |
| Pin H1 | I/O — General-purpose user I/O (bank 1) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M2210ZF256I5 is suitable for 7 applications: Industrial Bus-Interface Bridging, Telecom Line-Card Glue Logic, Automotive Infotainment Display Timing, Motor-Control Signal Conditioning, Consumer LED-Matrix Multiplexing, Medical Device I/O Expansion, Server / Datacenter Board Management.
Industrial Bus-Interface Bridging
The 5M2210ZF256I5 is a strong fit for industrial bus-bridging tasks because its 1700 macro cells and 212 user I/O can host multiple parallel-to-serial bridges (e.g., parallel bus to SPI, I2C, or UART) on one non-volatile device. With a 1.8 V core and four independent I/O banks (1.2-3.3 V), the part can connect a 3.3 V MCU, a 1.8 V image sensor, and a 1.5 V DDR memory controller without external level shifters. Its instant-on flash configuration wakes the system in under 1 ms - critical for industrial PLCs that must respond to safety inputs immediately on power-up.
Recommended
Telecom Line-Card Glue Logic
In telecom line cards, the 5M2210ZF256I5 handles chip-select decoding, interrupt aggregation, and clock-domain crossing between line-card ASICs, FPGAs, and backplane SERDES links. The 201.1 MHz fMAX and 1.8 V core allow synchronous operation up to 100 MHz on the I/O, while per-bank voltage translation (1.5 V HSTL, 2.5 V LVCMOS, 3.3 V LVTTL) interfaces legacy ASICs. Non-volatile configuration means line cards boot to a known-good state after a power-cycle without external boot memory.
Recommended
Automotive Infotainment Display Timing
Inside an automotive infotainment head unit, the 5M2210ZF256I5 generates display-timing signals (HSYNC, VSYNC, DE, pixel clock) for LVDS or TTL LCD panels and routes touch-controller interrupts to the host SoC. Its wide industrial-grade temperature range (-40C to +100C) and multi-voltage I/O bank support tolerate the under-hood and dashboard thermal environment. Compared with an FPGA, the MAX V's near-zero standby current and instant-on behaviour suit CAN/LIN wake-up scenarios when the infotainment system is parked but monitoring for driver input.
Recommended
Motor-Control Signal Conditioning
The 5M2210ZF256I5 conditions encoder-quadrature (QEP) inputs, generates PWM blanking windows, and implements fault-input prioritisation for a 3-phase motor drive. With up to 212 user I/O, multiple encoder and Hall-sensor channels can be processed in parallel, and the 1.8 V core plus 3.3 V-tolerant I/O handles both low-voltage MCUs and 5 V gate-driver interfaces. Non-volatile configuration means the motor controller resumes safe braking immediately after a brown-out without a slow FPGA boot.
Recommended
Consumer LED-Matrix Multiplexing
For large LED-matrix signage and architectural lighting, the 5M2210ZF256I5 multiplexes rows and columns at high refresh rates while the host MCU streams pixel data over SPI. The 201.1 MHz fMAX supports thousands of LED updates per refresh, and the FBGA-256 footprint exposes enough I/O for 16+ row lines plus several colour-channel PWMs. Multi-voltage bank support lets the CPLD directly drive 3.3 V LED-driver shift registers without external buffers.
Recommended
Medical Device I/O Expansion
Patient-monitoring and diagnostic instruments use the 5M2210ZF256I5 to expand the I/O count of a system-on-module by adding isolated UART, SPI, and GPIO channels for sensors, keypads, and alarms. The non-volatile instant-on configuration and industrial temperature range satisfy medical-device reliability expectations, while 1.8-3.3 V I/O bank support connects legacy 3.3 V sensor ASICs and modern 1.8 V SoCs without external level translation. CPLD density (1700 LE) is enough to host multiple soft UARTs and debounce logic simultaneously.
Recommended
Server / Datacenter Board Management
Inside a 1U server, the 5M2210ZF256I5 handles board-management glue: I2C muxing between the BMC and dozens of downstream sensors, hot-swap LED control, and POST-code latching for the BIOS. Multi-voltage I/O banks (1.0/1.2/1.5/1.8/2.5/3.3 V) let the CPLD bridge between modern low-voltage BMC SoCs and legacy 3.3 V peripherals. Non-volatile flash configuration boots in under 1 ms - essential for fault logging that must survive a hang or brown-out.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF256I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF256C5N | 5M2210ZF256A5N | 5M2210ZF256I5N | 5M1270ZF256I5N | 5M1270ZF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Family | MAX V | MAX V | MAX V | MAX V | MAX V | MAX V |
| Macro Cells (LE) | 1700 | 1700 | 1700 | 1700 | 980 (-42%) | 980 (-42%) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| fMAX (max) | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O (max) | 212 | 212 | 212 | 212 | 212 | 212 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Configuration Memory | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
Key Differentiators
- Higher density in the same FBGA-256 footprint vs 5M1270ZF256I5N (vs 5M1270ZF256I5N)
- Industrial temperature range vs commercial-only alternative (vs 5M2210ZF256C5N)
- Non-volatile instant-on configuration vs SRAM-based FPGAs (vs 10M08SAE144C8G (MAX 10 FPGA))
Design Notes
The 5M2210ZF256I5 requires a clean 1.8 V (±5%) VCCINT rail and per-bank VCCIO supplies at 1.2 / 1.5 / 1.8 / 2.5 / 3.3 V. Place a 0.1 µF X7R decoupling capacitor within 5 mm of every VCCINT ball and a 10 µF bulk capacitor per power plane. Estimated: at 50% I/O toggle and 50 MHz, IICCINT is roughly 30-50 mA plus I/O bank current - design the 1.8 V regulator for at least 200 mA headroom. Power-on sequence: VCCINT must come up before or simultaneously with any VCCIO bank that drives into a powered rail.
The FBGA-256 uses a 1.0 mm ball pitch. Use a 4-layer or 6-layer PCB stack-up with a continuous ground plane directly under the BGA to provide both thermal spreading and a low-impedance return path. Fan-out via dog-bone or micro-via (laser-drilled 0.1 mm vias on 0.4 mm pad) is recommended; via-in-pad is acceptable but increases assembly cost. Match JTAG trace lengths (TCK/TMS/TDO/TDI) within 25 mm to keep the BSDL-defined TCK rise/fall requirements within spec.
Although MAX V CPLDs are not as speed-critical as FPGAs, controlled-impedance routing (50 Ω single-ended, 100 Ω differential) is still required for clock inputs and JTAG. Series-termination resistors (22-33 Ω) on heavily-loaded clocks reduce overshoot. For LVDS pairs (supported on certain MAX V I/O banks), keep length matching within 0.13 mm to maintain the ±150 ps intra-pair skew requirement. Estimated: at 100 MHz toggle, an unterminated net longer than 50 mm may ring and cause metastability on input pins.
Do NOT mix 1.5 V and 3.3 V rails within the same I/O bank - all pins in one bank must share VCCIO. Mixing I/O standards across banks is allowed. When migrating from the 5M2210ZF256I5 to the 5M2210ZF324I5N, plan for a footprint change (324-ball BGA vs 256-ball BGA) - they are NOT pin-compatible. Always regenerate the Quartus Prime pin-out file (.pin) and re-validate the BSDL chain before taping out a new PCB revision.
Compliance Information
RoHS and REACH compliance per Intel MAX V product page. Industrial temperature grade -40C to +100C. AEC-Q100 grade: not applicable; the A-suffix (5M2210ZF256A5N) is the automotive-grade variant.
