A54SX08-2FG144I - 8K Gate SX FPGA, 144-FBGA | Microchip
MPN: A54SX08-2FG144I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.1 | $391.00 |
| 100 | $35.2 | $3,520.00 |
| 500 | $32.8 | $16,400.00 |
| 1,000 | $30.5 | $30,500.00 |
Drop-in alternatives for A54SX08-2FG144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX08-2FGG144I
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View Datasheet →A54SX08-2FG144I Maximum Ratings & Electrical Characteristics
| System Gates | 8000 |
| Logic Cells | 512 |
| Logic Modules | 768 |
| Number of I/O | 111 |
| Maximum System Frequency | 320 MHz |
| Process Technology | 0.35 um CMOS |
| Supply Voltage | 3.3 V / 5 V |
| Program Technology | Antifuse (one-time programmable) |
| Speed Grade | -2 |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 144-Ball Fine-Pitch BGA (FG144) |
| Mounting Type | Surface Mount |
| Configuration | Nonvolatile, instant-on (no external boot device) |
| Family | Actel SX (54SX) |
A54SX08-2FG144I 144-ball fine-pitch bga (fg144) Pin Configuration Guide
Complete pinout information for A54SX08-2FG144I (144-ball fine-pitch bga (fg144) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX08-2FG144I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX08-2FG144I is suitable for 6 applications: Industrial Control and Automation, 5V Legacy Bus Bridging, Telecommunications Line-Card Glue Logic, Avionics and Harsh-Environment Systems, ASIC Prototyping and Emulation Glue, Test and Measurement Instrumentation.
Industrial Control and Automation
The A54SX08-2FG144I fits industrial control well: the -I suffix guarantees -40C to +85C operation for factory-floor cabinets, and 111 user I/O absorbs dense sensor, encoder, and actuator interfaces in a single 144-ball FBGA. The antifuse fabric is instant-on and immune to configuration corruption from power glitches or EMI, a real advantage in electrically noisy motor-control environments where SRAM FPGAs risk corrupted boot. Logic runs at up to 320 MHz-class performance for fast interlocks and PWM glue logic. Use the device between a microcontroller and high-speed I/O where deterministic, non-reprogrammable logic is acceptable and single-chip integration reduces BOM count.
Recommended
5V Legacy Bus Bridging
Dual 3.3V/5V supply operation makes the A54SX08-2FG144I a natural bridge between legacy 5V TTL buses (VME-style backplanes, industrial parallel buses, older peripheral interfaces) and modern 3.3V subsystems. The I/O structure supports 5V signaling while the core runs at 3.3V, eliminating level-shifter arrays that would otherwise add propagation delay and parts count. With 320 MHz-class antifuse timing, even multi-level bus arbitration and decoding logic stays within tight setup/hold budgets. Place the FPGA at the backplane interface with its 111 I/O handling address, data, and control lanes in one chip, and rely on the nonvolatile configuration so the bridge is functional immediately at power-up.
Recommended
Telecommunications Line-Card Glue Logic
Telecom line cards frequently need high-speed glue logic: address decoding, clock distribution gating, framing interface adaptation, and hot-swap sequencing. The A54SX08-2FG144I's fine-grained multiplexer-based modules provide deterministic, low-skew routing that suits these fixed-function paths, and the -2 speed grade sustains 320 MHz-class toggle rates for OC-level bit streams and backplane clocks. The fine-pitch BGA keeps signal stubs short for signal integrity at these rates, while instant-on antifuse configuration means the line card presents valid logic to the backplane within microseconds of power application - important for system-level power sequencing. One chip replaces dozens of 74-series devices, cutting power and board area.
Recommended
Avionics and Harsh-Environment Systems
Antifuse FPGAs are a traditional choice in avionics and harsh environments because the configuration cannot be disturbed by radiation-induced configuration upsets, unlike SRAM fabrics. The A54SX08-2FG144I's industrial -40C to +85C range and nonvolatile instant-on behavior support instrumentation and control units in commercial aerospace-adjacent and ground-based harsh applications. The 8K-gate density is well matched to ARINC-style protocol adaptation, discrete-to-digital conversion, and built-in-test logic. For full space or military screening, migrate within the Microchip portfolio to RTAX radiation-tolerant families, but for cost-sensitive harsh industrial programs the SX antifuse fabric delivers configuration robustness at a fraction of the cost.
Recommended
ASIC Prototyping and Emulation Glue
The SX family's ASIC-like, fine-grained architecture makes the A54SX08-2FG144I useful for prototyping small control blocks and interface state machines destined for ASICs, with predictable timing that eases correlation between FPGA prototype and final silicon. Multiple devices can be combined on a prototype board, with the 111 I/O per device handling substantial inter-FPGA and host interfaces. The dual 3.3V/5V I/O simplifies interfacing with test equipment still using 5V logic levels. Because the antifuse fabric is programmed once, prototype iterations should use verified netlists; pair the device with the higher-density A54SX16/32 family members when the design grows beyond 8K gates during experimentation.
Recommended
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A54SX08-2FG144I as timing/controller logic: counter/timer front ends, trigger arbitration, and bus interface adaptation all map well to the 320 MHz-class fine-grained fabric. The dual 3.3V/5V I/O directly connects to legacy 5V instrument backplanes and TTL test points, while the FBGA package minimizes loop inductance for clean clock distribution. Nonvolatile instant-on configuration lets an instrument be measurement-ready the moment power is applied, with no configuration download delay that could stall automated test sequences. Use the industrial temperature grade for instruments deployed in unconditioned manufacturing-floor environments.
Recommended
Recommended Products Summary
Engineering reference data for A54SX08-2FG144I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX08-2FGG144I | A54SX08-2FGG144 | A54SX08-FG144I | A54SX08-2TQG144I |
|---|---|---|---|---|---|
| Package | 144-Ball FBGA (FG144) | 144-Ball FBGA - same | 144-Ball FBGA - same | 144-Ball FBGA - same | 144-TQFP - different footprint |
| Brand | Microsemi (Microchip) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| Max Frequency | 320 MHz (-2 speed grade) | 320 MHz (-2) | 320 MHz (-2) | [DATA_NEEDED] | 320 MHz (-2) |
| User I/O | 111 | 111 | 111 | 111 | 113 |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | 0C to +70C (Commercial) | -40C to +85C | -40C to +85C |
| Lead-Free Finish | No (standard FG tin-lead) | Yes (GG green) | Yes (GG green) | No | Yes (GG green) |
Key Differentiators
- Industrial temperature with full -2 speed grade (vs A54SX08-2FGG144)
- Identical drop-in for RoHS builds (vs A54SX08-2FGG144I)
- Fine-pitch BGA over TQFP for signal integrity and area (vs A54SX08-2TQG144I)
- Nonvolatile antifuse fabric vs SRAM alternatives (vs A54SX08-2TQG144I (and all SRAM FPGAs))
Design Notes
The A54SX08-2FG144I requires both a 3.3V rail (core) and optionally a 5V rail for legacy I/O banks. Provide independent decoupling networks on each supply: bulk capacitance plus local high-frequency ceramics at the FBGA power balls. Because the BGA power balls sit under the die, use short, wide via fanout to the planes. Estimated: dynamic power scales with clock frequency and toggle rate, so at 320 MHz-class operation budget realistic activity factors rather than worst-case 100% toggling when sizing the 3.3V rail.
Antifuse FPGAs are one-time-programmable: a flawed bitstream permanently consumes a device. Complete full functional simulation and static timing analysis in the Libero toolchain before programming, and program one pilot unit per lot to validate the programming setup. Also note the package difference trap: A54SX08-2TQG144I (TQFP) is not footprint-compatible with the FG144 FBGA despite identical die. Confirm date codes when sourcing legacy stock, and qualify the GG (lead-free) variant early if RoHS compliance may be required later.
At 320 MHz-class output toggling, the fine-pitch BGA offers low inductance but requires disciplined breakout: keep via stubs short, reference high-speed I/O to a continuous ground plane, and series-terminate long nets to control ringing, especially on 5V-swing I/O where overshoot margins differ from 3.3V banks. Distribute clocks through dedicated routing resources and avoid loading fast clock nets with excess fanout. For mixed 3.3V/5V designs, group same-voltage banks together to simplify return-path management.
Compliance Information
The FG suffix indicates standard tin-lead finish; for lead-free/RoHS-constrained builds use the pin-identical A54SX08-2FGG144I (GG green variant). Formal RoHS/REACH certificates not present in provided data - obtain from Microchip product page.
