A54SX08-FG144 - 8K Gate FPGA, 111 I/O, 144-BGA | Microchip
MPN: A54SX08-FG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $137.23 | $137.23 |
| 10 | $130.37 | $1,303.70 |
| 100 | $123.51 | $12,351.00 |
| 500 | $116.65 | $58,325.00 |
| 1,000 | $109.78 | $109,780.00 |
Drop-in alternatives for A54SX08-FG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX08-FG144I
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$109.79 / Unit
View Datasheet →A54SX08-FGG144
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$49.75 / Unit
View Datasheet →A54SX08-FGG144I
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$1 / Unit
View Datasheet →A54SX08-2FGG144
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$38.5 / Unit
View Datasheet →A54SX08-2FGG144I
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View Datasheet →A54SX08-FG144 Maximum Ratings & Electrical Characteristics
| Family | Actel SX (54SX) |
| System Gates | 8000 |
| Logic Cells | 512 |
| User I/O | 111 |
| Maximum Frequency | 240 MHz |
| Process Technology | 0.35 um CMOS |
| Supply Voltage | 3.3 V / 5 V |
| Program Technology | Antifuse (one-time programmable) |
| Architecture | Sea-of-modules |
| Package | 144-LBGA (FBGA) |
| Mounting Type | Surface Mount |
A54SX08-FG144 144-lbga (fbga) Pin Configuration Guide
Complete pinout information for A54SX08-FG144 (144-lbga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX08-FG144.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX08-FG144 is suitable for 6 applications: Industrial Automation Control, Telecommunications Interface Logic, Military and Aerospace Systems, Legacy 5V Bus Bridging, Secure One-Time-Programmable Systems, Glue Logic Consolidation in Embedded Systems.
Industrial Automation Control
The A54SX08-FG144 fits industrial automation because its 5V-tolerant I/O (3.3V/5V operation) directly interfaces legacy PLC backplanes, sensor buses, and TTL-level control signals without external level shifters. Its 8,000 gates and 512 cells consolidate glue logic, address decoders, and state machines that would otherwise require multiple 74-series devices. The antifuse fabric provides deterministic, non-volatile configuration that survives power cycling without a configuration PROM, improving system boot time on factory floors. Used as a bridge between motor-controller logic and a higher-level CPU, its 240 MHz class toggle performance comfortably handles encoder-counting and interlock logic.
Recommended
Telecommunications Interface Logic
Telecom line-card and backplane designs benefit from the A54SX08-FG144's high-speed sea-of-modules architecture, which delivers deterministic routing delays suited to framing, deserialization, and protocol-glue functions at line rates below its 240 MHz toggle class. The 111 user I/O in a compact 144-ball FBGA conserves board area on dense line cards, and 3.3V/5V I/O eases integration with legacy T1/E1 framer and backplane components. Because the antifuse configuration is non-volatile, remote equipment reboots without a boot device, improving carrier-grade availability. Designers should reserve I/O for JTAG boundary-scan test access during production.
Recommended
Military and Aerospace Systems
The A54SX08-FG144 suits military and aerospace subsystems because antifuse configuration is inherently non-volatile and resistant to configuration upset, eliminating the external configuration storage that SRAM FPGAs require. Its 8,000-gate capacity handles payload sequencing, telemetry formatting, and bus-bridging logic in avionics boxes where board space and power are constrained. The 240 MHz class performance supports fast counters and parallel interfaces, while 3.3V/5V tolerance eases integration with mixed-voltage heritage designs common in legacy platforms. For higher-reliability programs, engineers often prototype on SX and migrate to the RTAX radiation-tolerant family while reusing RTL.
Recommended
Legacy 5V Bus Bridging
Many installed systems still run 5V TTL and 5V CMOS buses that modern 3.3V-only devices cannot safely interface. The A54SX08-FG144's specified 3.3V/5V operation allows direct connection to these legacy rails, making it an ideal one-chip bridge between old and new subsystems during phased upgrades. Its 111 I/O can absorb dozens of discrete 74-series glue devices, reducing board area, power, and failure points. The 240 MHz class performance covers even aggressive bus turnaround timing. Antifuse one-time programming is acceptable here because bridge functions are fixed at design time, and configuration integrity over decades of service is a benefit rather than a limitation.
Recommended
Secure One-Time-Programmable Systems
Designs with security requirements favor the A54SX08-FG144 because antifuse configuration cannot be read back or altered after programming, unlike SRAM FPGAs whose bitstreams are exposed during configuration loading. The 8,000-gate fabric is sufficient for authentication logic, secure key-handling state machines, and tamper-response glue logic in payment terminals, access-control systems, and licensed equipment. The 111 I/O in the 144-ball FBGA supports parallel interfaces to secure elements and host processors. With no external configuration PROM, there is no bitstream to intercept in transit, reducing the attack surface. Non-volatility also guarantees that no reprogramming occurs in the field.
Recommended
Glue Logic Consolidation in Embedded Systems
Embedded board designers use the A54SX08-FG144 to consolidate address decoding, wait-state generation, interrupt aggregation, and memory-mapped glue logic into one 144-ball device. Compared with a handful of 5V and 3.3V PAL/GAL/74-series parts, the SX device provides recompilable (pre-programming) flexibility, deterministic timing from the antifuse fabric, and 240 MHz class speed margin. The 512-cell capacity typically absorbs the entire glue function of a microprocessor board, and 5V-tolerant I/O connects directly to legacy peripherals. Consolidation reduces BOM count, assembly cost, and inter-device skew, while the non-volatile configuration removes boot-time configuration delays from reset sequencing analysis.
Recommended
Recommended Products Summary
Engineering reference data for A54SX08-FG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX08-FG144I | A54SX08-FGG144 | A54SX08-FGG144I | A54SX08-2FGG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA (FBGA) | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same |
| Brand | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) |
| System Gates | 8000 | 8000 | 8000 | 8000 | 8000 |
| User I/O | 111 | 111 | 111 | 111 | 111 |
| Maximum Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz | [DATA_NEEDED] (faster -2 speed grade) |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Temperature Grade | Commercial | Industrial (-40C to +85C) | Commercial | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Lead-Free / RoHS Plating | No (FG leaded variant) | No | Yes (GG lead-free) | Yes (GG lead-free) | Yes (GG lead-free) |
| Approx. Unit Price (qty 1, as of 2026-09-03) | $137.23 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Non-volatile antifuse configuration with no boot PROM (vs A54SX08-FG144I)
- RoHS-compliant lead-free plating option (vs A54SX08-FG144I)
- Higher timing headroom (vs A54SX08-2FGG144I)
Design Notes
Antifuse devices are one-time programmable. Unlike SRAM FPGAs, the A54SX08-FG144 cannot be erased or reprogrammed after configuration burn, so any post-silicon fix requires a new physical device. Budget unprogrammed spares into every build, freeze the design file before releasing devices to programming, and validate fully in the Libero/Designer simulation flow first. Also note the FG (leaded) plating may conflict with RoHS assembly profiles; select the FGG variant for lead-free reflow lines.
The 144-ball FBGA requires a carefully controlled land pattern and via-in-pad or dog-bone escape routing on fine pitch. Follow the Microchip SX datasheet package drawing for pad geometry, and verify ball-map pinout directly against the official datasheet before layout release - third-party ball maps for legacy Actel parts frequently contain errors. Plan JTAG programming access on the board, since antifuse programming and boundary-scan test both occur through the JTAG port; include a programming header or bed-of-nails access.
The SX family operates from 3.3V/5V supply domains per the verified data; exact per-rail current figures are not in the verified data and must be taken from the manufacturer datasheet power calculator. As a general practice, decouple each supply ball group with at least 0.1 uF ceramic capacitors placed close to the package, plus bulk capacitance per rail. Because antifuse fabric has no configuration inrush, power sequencing is simpler than SRAM FPGAs, but 5V-tolerant I/O should still not be driven before VDD is stable.
Compliance Information
The FG144 suffix denotes standard (leaded) plating; the FGG144 variants are the lead-free option per Microchip naming convention. RoHS/REACH status for this specific suffix was not stated in verified data - verify with distributor compliance certificates before export-controlled or EU shipments.
