A54SX32-CQ256B - 48K Gate Military FPGA, 203 I/O | Microsemi
MPN: A54SX32-CQ256B ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for A54SX32-CQ256B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX32-CQ256M
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View Datasheet →A54SX32-CQ256M
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View Datasheet →A54SX32A-CQ256B
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
A54SX32-CQ256B Maximum Ratings & Electrical Characteristics
| System Gates | 48000 gates |
| Logic Array Blocks (LABs) | 2880 |
| User I/O | 203 |
| Maximum Toggle Frequency | 205 MHz |
| Supply Voltage (VCCI) | 3 V to 3.6 V |
| Supply Voltage (VCI) | 4.75 V to 5.25 V |
| Process Technology | 0.35 um CMOS |
| Series | SX (Actel SX) |
| Configuration Technology | Antifuse (one-time programmable) |
| Package | 256-BFCQFP Exposed Pad and Tie Bar (75x75 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -55C to +125C (TJ) |
| Temperature Grading | Military |
| Terminal Form | Flat |
| Terminal Count | 256 |
| Package Shape | Square (QFF package code) |
A54SX32-CQ256B square (qff package code) Pin Configuration Guide
Complete pinout information for A54SX32-CQ256B (square (qff package code) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32-CQ256B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32-CQ256B is suitable for 6 applications: Military Avionics Bus Interfaces, Secure Defense System Control Logic, Industrial 5V Legacy System Retrofit, Test and Measurement Instrumentation, Communications and Networking Line Cards, Aerospace Ground Support Equipment.
Military Avionics Bus Interfaces
The A54SX32-CQ256B's -55C to +125C junction rating and hermetic ceramic CQFP package make it a natural fit for military avionics control and bus-interface logic, where commercial plastic-packaged FPGAs cannot survive thermal cycling. Its 203 user I/O supports wide parallel interfaces such as MIL-STD-1553 companion logic, ARINC 429 front-end buffering, and discrete I/O concentration. The dual-supply operation (3V-3.6V core, 4.75V-5.25V I/O rail) allows direct interfacing with legacy 5V avionics backplanes without level shifters. Because the antifuse configuration is stored in silicon, the bitstream cannot be corrupted by single events or power glitches - a critical reliability property in flight-critical platforms. Place the exposed thermal pad against a plated through-hole array to manage junction temperature near the +125C ceiling.
Recommended
Secure Defense System Control Logic
Antifuse FPGAs are favored in defense control logic precisely because the A54SX32-CQ256B's configuration is burned into the silicon at programming time and cannot be read back, dumped, or altered. For weapons-system controllers, cryptographic auxiliary logic, and secure telemetry formatting, this OTP property eliminates the configuration-cloning attack surface that SRAM FPGAs carry. The 48,000 system gates and 2880 LABs accommodate state machines, counters, and interface glue logic of moderate complexity at toggle rates up to approximately 205 MHz. The military C-grade temperature range covers conduction-cooled chassis environments from -55C to +125C. Design teams should complete full simulation before programming, since there is no field rework path; keep a spare programmed population in storage for logistics sustainment.
Recommended
Industrial 5V Legacy System Retrofit
Many industrial retrofits must integrate new logic into 5V backplanes and PLC racks designed decades ago. The A54SX32-CQ256B addresses this directly with its second supply rail accepting 4.75V to 5.25V, letting the FPGA's I/O drive and receive 5V logic levels without translators. Its 203 user I/O covers large parallel bus bridges, relay-control expansion, and sensor aggregation across the full -55C to +125C military range, comfortably exceeding industrial -40C to +85C requirements. The 256-pin ceramic CQFP, while premium in cost, provides mechanical robustness on vibration-prone factory floors. Designers should budget the dual-rail power architecture - a 5V rail plus a 3.3V regulator feeding the core - and verify that the CQFP land pattern on the retrofit PCB matches the 75x75 mm ceramic package footprint.
Recommended
Test and Measurement Instrumentation
Bench and rack instrumentation benefits from the A54SX32-CQ256B's deterministic, configuration-immune logic for timing generators, trigger distribution, and bus interface functions. With system performance up to roughly 205 MHz, the SX architecture handles sub-10 ns timing resolution in counter/timer and pattern-generator roles. The 203 user I/O enables wide parallel pattern buses to DUT fixtures, and the dual-supply design (3.3V core, 5V I/O rail) connects cleanly to both modern and legacy instrument internals. Because antifuse configuration has zero startup configuration time - the design is live at power-up - instruments avoid the boot latency of SRAM FPGAs, an advantage for fast-trigger test sequences. The ceramic CQFP's exposed pad should be soldered to a generous ground pour to contain switching noise near sensitive analog measurement front ends.
Recommended
Communications and Networking Line Cards
Legacy telecom and defense-communications line cards used SX-class FPGAs for framing, multiplexing, and backplane interface logic. The A54SX32-CQ256B's 48K gates implement HDLC controllers, T1/E1 framer glue, and parallel backplane interfaces at the moderate speeds those systems require, while 203 user I/O covers the wide data buses characteristic of parallel backplanes. The -55C to +125C rating supports outside-plant and unconditioned equipment-shelter deployments, and the hermetic ceramic package resists humidity and corrosive atmospheres better than plastic packages. The dual 3.3V/5V supply scheme matches the mixed-voltage backplanes common in installed base cards. For lifecycle management, note that the SX family is mature - new line-card designs should evaluate current Microchip FPGA families, while this part excels in sustaining existing deployed systems.
Recommended
Aerospace Ground Support Equipment
Ground support and test equipment for aerospace programs must validate flight hardware across the same environmental extremes as flight, making the A54SX32-CQ256B's -55C to +125C capability and military screening a practical match without the cost of full space-grade silicon. Its antifuse configuration provides deterministic behavior during thermal-vacuum and hot/cold test campaigns - there is no risk of a configuration SEU invalidating a test run. The 203 user I/O drives large-scale umbilical and panel interfaces, and the dual-rail 3.3V/5V operation ties into mixed-era test-set electronics. The 75x75 mm ceramic CQFP with tie bar withstands repeated insertion-cycle mechanical stress on test fixtures. Designers should implement boundary-scan or built-in test logic within the 48K gates to streamline fixture self-test between campaigns.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32-CQ256B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32-CQ256M | A54SX32-CQ256 | A54SX32A-CQ256B |
|---|---|---|---|---|
| Package | 256-BFCQFP (ceramic CQFP, 75x75 mm) | 256-CQFP - same footprint | 256-CQFP - same footprint | 256-CQFP - same footprint |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microchip Technology |
| System Gates | 48,000 | 48,000 | 48,000 | 48,000 (SX-A die) |
| User I/O | 203 | 203 | 203 | [DATA_NEEDED] |
| Supply Voltage | 3V-3.6V and 4.75V-5.25V | 3V-3.6V and 4.75V-5.25V | 3V-3.6V and 4.75V-5.25V | 3V-3.6V and 4.75V-5.25V |
| Temperature Range | -55C to +125C (TJ) | -55C to +125C (TJ) | -55C to +125C (TJ) | -55C to +125C (TJ) |
| Configuration Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
| Speed Grade / Screening | B suffix (military) | M suffix (military screening) | Standard speed grade | B suffix (SX-A family, higher performance) |
Key Differentiators
- Antifuse OTP configuration with zero boot latency (vs Intel/Xilinx SRAM FPGAs (functional alternatives only))
- Military -55C to +125C junction range in hermetic ceramic (vs A54SX32 plastic TQ176/PQ208 variants)
- Dual 3.3V/5V supply architecture with 203 user I/O (vs A54SX32A-CQ256B (SX-A family))
Design Notes
The A54SX32-CQ256B requires two supply rails: a core/I/O rail of 3V to 3.6V (typically 3.3V) and a second rail of 4.75V to 5.25V (typically 5V). Decouple each rail with bulk capacitance (10-47 uF) plus 0.1 uF ceramics at multiple package corners of the 75x75 mm CQFP. Estimated: antifuse FPGA static current is low, but dynamic current scales with clock frequency and toggle rate - budget supply rails using the Microchip Designer power estimator at your maximum 205 MHz operating frequency rather than assuming worst-case datasheet figures.
The military C-grade rating allows junction temperatures to +125C, but the ceramic CQFP's thermal resistance is high compared to modern flipped-chip packages. Estimated: with the exposed pad soldered to a multi-row via array into a ground plane, board-level heat spreading improves substantially; without it, junction-to-ambient resistance in still air limits sustained power dissipation. For conduction-cooled chassis, bond the tie bar and pad to the cold wall per MIL-STD-style card design. Verify junction temperature with a thermal model before committing to a -55C to +125C full-range qualification.
The most common pitfall with this device is treating it like an SRAM FPGA: it is one-time programmable. Any design change after programming requires a new physical part, so complete full functional and timing simulation in the Microchip Designer flow before committing. Second, the B and M suffixes define different speed/screening combinations - do not substitute A54SX32-CQ256M for CQ256B in a timing-critical path without re-running static timing analysis. Third, no cross-brand pin-compatible replacement exists; do not assume Intel/Xilinx parts can drop onto the same footprint.
Compliance Information
This is a military-grade ceramic-packaged device (C grade, -55C to +125C); RoHS/REACH and lead-free status were not stated in the verified data and must be confirmed with the manufacturer for this legacy military product line.
