DRA745 - Dual Cortex-A15 1.2GHz Auto SoC | Texas Instruments
MPN: DRA745 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for DRA745 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DRA745BLGABCRQ1
β Drop-Inπ Reference alternative (not in catalog)
DRA745BLGABCQ1
β Drop-Inπ Reference alternative (not in catalog)
DRA744
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DRA746
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DRA750
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DRA756
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DRA745 Maximum Ratings & Electrical Characteristics
| CPU Core | Dual Arm Cortex-A15 |
| CPU Frequency | 1.2 GHz |
| Graphics Core | SGX544 2D/3D GPU |
| DSP Subsystem | C66x DSP + IVA-HD multimedia accelerator |
| Product Family | Jacinto 6 (DRA74x) |
| Package | FCBGA, 529-ball (LGAB / LGABC) |
| Target Application | Automotive infotainment and digital cluster |
| Automotive Grade Option | Yes (DRA745BLGABCRQ1, AEC-Q100 Q1 ordering option) |
| Camera Interface | VIP (Video Input Port) |
| Audio Interface | McASP multi-channel audio serial ports |
| Automotive Networks | CAN, Ethernet AVB |
| Silicon Revision | 2.0 |
| Mounting Type | Surface Mount (BGA) |
DRA745 fcbga, 529-ball (lgab / lgabc) Pin Configuration Guide
Complete pinout information for DRA745 (fcbga, 529-ball (lgab / lgabc) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DRA745.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
DRA745 is suitable for 6 applications: Automotive Head Unit, Digital Instrument Cluster, Telematics Gateway, Rear-Seat Entertainment, Advanced Driver Assistance Camera Processing, Automotive Infotainment Development Platforms.
Automotive Head Unit
The DRA745 fits central infotainment head units because its dual Cortex-A15 cores at 1.2 GHz run the HMI, navigation, and connectivity stacks while the SGX544 GPU renders fluid UI animations and the C66x DSP/IVA-HD subsystem handles audio processing and video decode without loading the CPUs. In a typical head-unit topology, the SoC drives the display via its display controllers, captures reverse-camera video through the VIP interface, and mixes multi-zone audio through McASP ports to an external amplifier. The presence of CAN and Ethernet AVB lets the unit exchange media and vehicle data with ECUs over standard automotive networks. Compared with a discrete CPU-plus-GPU approach, the integrated SoC reduces BOM count and power while providing TI's Jacinto 6 BSPs (Processor SDK, QNX, Android Automotive) that shorten time to market.
Recommended
Digital Instrument Cluster
For digital clusters, the DRA745's SGX544 3D graphics core renders gauge clusters and navigation overlays at the frame rates modern clusters demand, while the dual 1.2 GHz Cortex-A15 cores host the cluster application and vehicle-data layers. The display subsystem can drive the cluster panel with deterministic timing, and CAN interfaces ingest vehicle signals (speed, RPM, telltales) with low latency. TI explicitly lists cluster among the DRA745's target applications on its product page, and Q1 ordering variants such as DRA745BLGABCRQ1 support automotive-grade builds. Designers should pair the SoC with TI's power-management companion devices to meet the strict power sequencing the FCBGA package requires, and should verify functional-safety documentation separately when cluster ASIL targets apply.
Recommended
Telematics Gateway
As a telematics gateway, the DRA745 aggregates vehicle CAN/LIN data, cellular and Wi-Fi backhaul, and Ethernet AVB in-vehicle networking on one processor. The dual Cortex-A15 cores run gateway middleware and cybersecurity stacks with headroom, the DSP can offload modem audio (eCall) processing, and the VIP camera inputs support surround-view or driver-monitoring feeds routed into the gateway. According to TI, the DRA74x peripheral set including Ethernet AVB makes it suitable for converged connectivity platforms. The key performance benefit is consolidating gateway, media, and camera functions that would otherwise need multiple processors, reducing board area and inter-processor latency; the trade-off is higher static power than a MCU-based gateway, which matters for always-on telematics budgets.
Recommended
Rear-Seat Entertainment
Rear-seat entertainment systems benefit from the DRA745's IVA-HD hardware multimedia engine, which decodes multiple simultaneous video streams without CPU load, and the SGX544 GPU for per-seat interactive UIs. McASP audio ports route independent stereo channels to each seat through external codecs, enabling headphone-zone audio alongside cabin audio. The VIP camera interface supports occupant monitoring, and the SoC can receive content from the head unit over Ethernet AVB. A single DRA745 can drive multiple displays via its display controllers, replacing the multi-chip solutions used in legacy RSE platforms. Designers should budget thermal dissipation for enclosed console installations, since FCBGA SoCs at 1.2 GHz dual-core operation require a defined thermal path to the enclosure.
Recommended
Advanced Driver Assistance Camera Processing
While the DRA745 is positioned for infotainment, its VIP parallel camera interfaces and C66x DSP subsystem make it a practical host for surround-view and driver-assist viewing functions integrated into the head unit. The VIP ports capture multiple camera streams, the C66x DSP performs pre-processing such as lens correction and stitching workloads in coordination with the GPU, and the Cortex-A15 cores run the application layer. In a typical topology, four camera feeds enter through VIP or FPD-Link deserializers and are composited into a bird's-eye view rendered by the SGX544. The performance consideration is that heavy ADAS algorithms should remain on dedicated TI TDAx safety processors, with the DRA745 handling the visualization and display side of the pipeline.
Recommended
Automotive Infotainment Development Platforms
The DRA745 serves as the core of evaluation and development platforms for Jacinto 6 software stacks. TI and ecosystem partners provide boards built around DRA74x silicon that expose the display, VIP, McASP, CAN, and Ethernet AVB peripherals for BSP bring-up, HMI prototyping, and automated testing. Developers use TI Processor SDK, QNX, or Android Automotive BSPs on these platforms, with JTAG debug access for low-level bring-up. The dual 1.2 GHz Cortex-A15 configuration matches production head-unit performance, so software validated on the platform transfers directly to DRA745-based hardware. Teams should lock their silicon revision (2.0 here) early and track TI errata documents, since infotainment SoCs accumulate silicon corrections that affect both software workarounds and board design details.
Recommended
Recommended Products Summary
Engineering reference data for DRA745 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DRA745BLGABCRQ1 | DRA745BLGABCQ1 | DRA744 | DRA746 | DRA750 |
|---|---|---|---|---|---|---|
| Package | FCBGA 529-ball (LGAB/LGABC) | FCBGA 529-ball (LGABC) - same | FCBGA 529-ball (LGABC) - same | FCBGA 529-ball - same | FCBGA 529-ball - same | FCBGA 529-ball - same family |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| CPU Cores | Dual Arm Cortex-A15 | Dual Arm Cortex-A15 | Dual Arm Cortex-A15 | Dual Arm Cortex-A15 | Dual Arm Cortex-A15 (higher grade) | |
| CPU Frequency | 1.2 GHz | 1.2 GHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] (DRA75x family, higher grades) | |
| Graphics Core | SGX544 2D/3D GPU | SGX544 2D/3D GPU | SGX544 (per family) | SGX544 (per family) | SGX544 (per family, higher population possible) | |
| DSP Subsystem | C66x DSP + IVA-HD | C66x DSP + IVA-HD | C66x DSP + IVA-HD | C66x DSP + IVA-HD | C66x DSP + IVA-HD | |
| Automotive Grade (Q1) | Q1 variants available | Yes (AEC-Q100 Q1) | Yes (Q1) | Q1 variants exist in family | Q1 variants exist in family | Q1 variants exist in family |
| Silicon Revision / Documentation | Rev 2.0, DRA75x/DRA74x datasheet (443 pages) | Same silicon rev 2.0 | Same DRA75x/DRA74x datasheet | Same DRA75x/DRA74x datasheet | Same DRA75x/DRA74x datasheet |
Key Differentiators
- Q1 automotive-grade ordering option (vs DRA745BLGABCRQ1 vs generic DRA745 order numbers)
- Cost-optimized DRA74x grade with full peripheral set (vs DRA750)
- Single-chip integration of display, camera, audio, and automotive networks (vs MIMX8QM5CVUFFAB (NXP i.MX 8QuadMax))
Design Notes
The DRA745 is a multi-rail FCBGA SoC requiring strictly ordered power sequencing: core voltage rails (VDD_CORE / VDD_MPU) must establish before I/O rails, and the companion PMIC (TI documents TPS659-class PMICs for Jacinto 6) handles ramp order, reset supervision, and rail monitoring. Estimated: even at moderate utilization a dual 1.2 GHz Cortex-A15 SoC dissipates on the order of 2-4 W, so the PCB must provide a solid thermal path through the FCBGA balls and package lid to board copper; derive exact budgets from the datasheet power tables for your use case, not estimates.
A 529-ball FCBGA requires a controlled breakout: verify every ball against the official silicon revision 2.0 ball map and additive pinmux documents on ti.com before layout - never copy ball maps from third-party sources. Route DDR memory interfaces with matched lengths per the TI hardware design guide for Jacinto 6, place decoupling capacitors on the underside of the BGA within the ball field, and plan X-ray inspection for assembly qualification since solder joints under the package cannot be visually inspected.
Do not mix silicon revisions in a production program: this device is documented at revision 2.0, and boot ROM, pinmux, and errata behavior can differ between revisions. Software BSP selection (Processor SDK, QNX, Android Automotive) must match the exact ordering part number (LGAB vs LGABC speed/power grade) and silicon revision. For Q1 automotive builds, order the RQ1-suffixed part (e.g., DRA745BLGABCRQ1) explicitly - the standard part is not a substitute in qualified builds.
Ethernet AVB and FPD-Link/LVDS display lanes demand impedance-controlled routing (100-ohm differential) with reference-plane continuity; avoid splitting these pairs across plane gaps. CAN interfaces require proper split termination at the stub topology recommended by the transceiver datasheet (e.g., SN65HVD230 family). Keep VIP parallel camera buses short (under a few inches) or migrate to serial camera links with deserializers for longer runs.
Compliance Information
Q1 ordering variants (DRA745BLGABCRQ1, DRA745BLGABCQ1) indicate automotive-grade qualification per TI ordering nomenclature; confirm exact AEC-Q100 level and environmental compliance from TI quality documentation for each ordering part number.
