AM5728BABCXA - Dual Cortex-A15 & DSP MPU | Texas Instruments
MPN: AM5728BABCXA β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $60.2 | $60,200.00 |
Drop-in alternatives for AM5728BABCXA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
AM5728BABCXEA
β Drop-Inπ Reference alternative (not in catalog)
AM5726BABCXA
β Drop-Inπ Reference alternative (not in catalog)
AM5748BABCXA
β Drop-Inπ Reference alternative (not in catalog)
AM5729BABCXA
β Drop-Inπ Reference alternative (not in catalog)
AM5746BABCXA
β Drop-Inπ Reference alternative (not in catalog)
AM5728BABCXA Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-A15 |
| Number of Cores | 2 |
| Maximum Clock Frequency | 1.5 GHz |
| Data Bus Width | 32 bit |
| DSP Cores | 2x C66x |
| Graphics Acceleration | PowerVR SGX544 |
| Package | 760-FCBGA (23x23 mm) |
| Operating Temperature Range | -40Β°C to 105Β°C |
| Memory Support | DDR3/DDR3L |
| Ethernet | Gigabit Ethernet |
| USB | USB 3.0 |
| PCIe | PCIe |
| SATA | SATA |
| Video Acceleration | H.264 encode/decode |
| PRU-ICSS | Dual-core programmable real-time unit |
| RoHS | Compliant |
AM5728BABCXA Pin Configuration
| Pin A1 | VDD_CORE β Core power supply |
| Pin A2 | VSS β Ground |
| Pin B1 | VDD_MPU β MPU power supply |
| Pin B2 | VDD_DSP β DSP power supply |
| Pin C1 | VDD_IO β I/O power supply |
| Pin C2 | VSS β Ground |
| Pin D1 | DDR3_CK β DDR3 clock |
| Pin D2 | DDR3_DQ0 β DDR3 data line 0 |
| Pin E1 | USB0_DP β USB 3.0 data plus |
| Pin E2 | USB0_DM β USB 3.0 data minus |
| Pin F1 | GMII0_TXD0 β Ethernet transmit data 0 |
| Pin F2 | GMII0_RXD0 β Ethernet receive data 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
AM5728BABCXA is suitable for 6 applications: Industrial Automation, Medical Imaging, Human-Machine Interface (HMI), Smart Grid Gateways, Edge Computing, Automotive Infotainment.
Industrial Automation
The AM5728BABCXA excels in industrial automation due to its dual Cortex-A15 cores and PRU-ICSS for real-time industrial Ethernet protocols. It supports multiple fieldbuses and provides high-performance processing for PLCs and robotic controllers. The wide temperature range and robust connectivity make it a reliable choice for factory floor applications.
Recommended
Medical Imaging
With dual C66x DSP cores and video acceleration, the AM5728BABCXA is ideal for medical imaging systems like ultrasound. The DSPs handle signal processing for image reconstruction, while the ARM cores manage user interface and communication. Its high performance enables real-time processing of high-resolution images, and the industrial temperature range ensures reliability in clinical environments.
Recommended
Human-Machine Interface (HMI)
The AM5728BABCXA supports multiple display interfaces and 3D graphics acceleration, making it perfect for advanced HMIs. It can drive high-resolution LCDs with smooth graphics rendering, while the ARM cores handle touch input and application logic. The rich connectivity options allow seamless integration with industrial networks and peripherals.
Recommended
Smart Grid Gateways
The AM5728BABCXA is well-suited for smart grid gateways due to its dual-core processing and multiple communication interfaces. It can handle protocol conversion, data aggregation, and secure communication simultaneously. The PRU-ICSS enables real-time monitoring and control, while the DSPs can perform power quality analysis. Its industrial temperature range ensures operation in outdoor environments.
Recommended
Edge Computing
The AM5728BABCXA serves as a powerful edge computing node, combining high-performance ARM cores with DSPs for local data processing. It can run AI inference, video analytics, and real-time control at the edge, reducing latency and bandwidth usage. The multiple I/O interfaces allow connection to various sensors and actuators, making it versatile for IoT and Industry 4.0 applications.
Recommended
Automotive Infotainment
Although not safety-critical, the AM5728BABCXA is used in automotive infotainment systems for its multimedia capabilities. It supports multiple displays, video playback, and connectivity features like USB and Ethernet. The dual Cortex-A15 cores provide smooth performance for navigation and entertainment apps, while the DSPs handle audio processing. Its temperature range covers automotive cabin environments.
Recommended
Recommended Products Summary
Engineering reference data for AM5728BABCXA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AM5728BABCXEA | AM5726BABCXA | AM5748BABCXA |
|---|---|---|---|---|
| Package | 760-FCBGA (23x23 mm) | 760-FCBGA (23x23 mm) | 760-FCBGA (23x23 mm) | 760-FCBGA (23x23 mm) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Architecture | ARM Cortex-A15 | ARM Cortex-A15 | ARM Cortex-A15 | ARM Cortex-A15 |
| Maximum Clock Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| DSP Cores | 2x C66x | 2x C66x | 2x C66x | 2x C66x |
| Graphics Acceleration | PowerVR SGX544 | PowerVR SGX544 | None | PowerVR SGX544 |
| Operating Temperature Range | -40Β°C to 105Β°C | -40Β°C to 105Β°C | -40Β°C to 105Β°C | -40Β°C to 105Β°C |
| PRU-ICSS | Dual-core | Dual-core | Dual-core | Dual-core |
Key Differentiators
- Dual DSP cores for signal processing (vs AM5726BABCXA)
- Integrated graphics acceleration (vs AM5726BABCXA)
- Higher performance than AM5726 (vs AM5726BABCXA)
Design Notes
The AM5728BABCXA requires multiple power rails (core, MPU, DSP, I/O) with specific sequencing. Use a power sequencer like the UCD9090 to manage the power-up sequence and ensure proper operation. Decouple each rail with low-ESR ceramic capacitors close to the pins.
The SoC can dissipate significant power, especially under heavy load. Use a heatsink or thermal pad on the FCBGA package and ensure adequate airflow. The thermal resistance of the package is [DATA_NEEDED: theta_JA], so calculate junction temperature to avoid exceeding the maximum rating.
For high-speed interfaces like DDR3 and USB 3.0, follow the layout guidelines in the datasheet. Maintain controlled impedance for differential pairs and keep trace lengths matched. Use ground planes to minimize noise and ensure signal integrity.
Compliance Information
RoHS compliant per TI product page. Not AEC-Q100 qualified; for automotive safety-critical applications, consider other TI processors.
