EP1810GM883 - 48-Macrocell Classic EPLD, 5V, 68-Pin PGA | Altera
MPN: EP1810GM883 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 50 | $218 | $10,900.00 |
| 100 | $195 | $19,500.00 |
| 250 | $175 | $43,750.00 |
Drop-in alternatives for EP1810GM883 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1810GM/883B
β Drop-Inβ In Stock
$49.75 / Unit
View Datasheet βEP1810GI-45
β Drop-Inβ In Stock
$56.4 / Unit
View Datasheet βEP1810GC-35
β Drop-Inβ In Stock
$177.12 / Unit
View Datasheet βEP1810GC-35AB
β Drop-Inβ In Stock
$9.95 / Unit
View Datasheet βEP1810GM883B-45
β Drop-Inπ Reference alternative (not in catalog)
EP1810GM883B68-45
β Drop-Inπ Reference alternative (not in catalog)
EP1810GM883 Maximum Ratings & Electrical Characteristics
| Family | Classic EPLD (EP1810 series) |
| Device Type | UV-Erasable Programmable Logic Device (EPLD) |
| Macrocells | 48 |
| Dedicated Inputs | 12 |
| User I/O Pins | 48 |
| Total Terminals | 68 |
| Global Clocks | 4 |
| Supply Voltage (Vcc) | 4.5 V to 5.5 V (nominal 5 V) |
| Propagation Delay (tpd) | 45 ns (max) |
| Process Technology | CMOS, UV-erasable |
| Package | 68-Pin Ceramic Pin Grid Array (PGA) |
| Operating Temperature | -55C to +125C (MIL-STD-883 Class B) |
| Screening | MIL-STD-883 Class B (suffix '883' denotes MIL processing) |
| Mounting Type | Through-Hole (PGA socket) |
EP1810GM883 Pin Configuration
| Pin 1 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 2 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 3 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 4 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 5 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 6 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 7 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 8 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 9 | GND β Ground |
| Pin 10 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 11 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 12 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 13 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 14 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 15 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 16 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 17 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 18 | VCC β +5 V supply |
| Pin 19 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 20 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 21 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 22 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 23 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 24 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 25 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 26 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 27 | GND β Ground |
| Pin 28 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 29 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 30 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 31 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 32 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 33 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 34 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 35 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 36 | VCC β +5 V supply |
| Pin 37 | INPUT β Dedicated input pin |
| Pin 38 | INPUT β Dedicated input pin |
| Pin 39 | INPUT β Dedicated input pin |
| Pin 40 | INPUT β Dedicated input pin |
| Pin 41 | INPUT β Dedicated input pin |
| Pin 42 | INPUT β Dedicated input pin |
| Pin 43 | GND β Ground |
| Pin 44 | INPUT β Dedicated input pin |
| Pin 45 | INPUT β Dedicated input pin |
| Pin 46 | INPUT β Dedicated input pin |
| Pin 47 | INPUT β Dedicated input pin |
| Pin 48 | INPUT β Dedicated input pin |
| Pin 49 | INPUT β Dedicated input pin |
| Pin 50 | CLK1 β Global clock input 1 |
| Pin 51 | CLK2 β Global clock input 2 |
| Pin 52 | VCC β +5 V supply |
| Pin 53 | CLK3 β Global clock input 3 |
| Pin 54 | CLK4 β Global clock input 4 |
| Pin 55 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 56 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 57 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 58 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 59 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 60 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 61 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 62 | GND β Ground |
| Pin 63 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 64 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 65 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 66 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 67 | I/O β Bidirectional I/O pin (macrocell) |
| Pin 68 | I/O β Bidirectional I/O pin (macrocell) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1810GM883 is suitable for 7 applications: Military Avionics Glue Logic, Radar Signal Conditioning Front End, Missile Guidance and Control, Satellite Payload Controller, Down-Hole Oil and Gas Instrumentation, Nuclear Instrumentation and Control, Legacy Industrial PLC Replacement.
Military Avionics Glue Logic
The EP1810GM883's MIL-STD-883 Class B screening and ceramic PGA hermetic package make it a drop-in logic integrator for military avionics platforms. It replaces dozens of 74-series TTL gates on flight-control and mission-computer boards, with 48 macrocells providing enough capacity to implement multiple bus arbiters, address decoders, and discrete state machines on a single chip. Its 45 ns propagation delay supports synchronous interfaces up to approximately 15 MHz, well above MIL-STD-1553 and ARINC 429 timing margins, and its -55C to +125C operating range covers all DO-160 environmental sections without derating.
Recommended
Radar Signal Conditioning Front End
In radar receiver signal paths, the EP1810GM883 sits between the analog front end and the digital signal processor, providing deterministic-timing glue logic that synchronizes trigger pulses, range gates, and beam-steering commands. Its 48 macrocells can host parallel comparator decoders, programmable timing generators, and interrupt-aggregation state machines while its 5 V TTL-compatible I/O directly drives legacy radar backplane buses. The ceramic PGA package offers excellent thermal conductivity for sealed radome electronics where ambient temperatures exceed 85C during continuous operation.
Recommended
Missile Guidance and Control
Tactical missile guidance sections demand logic that survives high-shock, high-temperature launch profiles, which is exactly what the EP1810GM883 is qualified for. The device hosts the discrete control laws that steer fin actuators, manage seeker-mode sequencing, and arbitrate between GPS/INS navigation updates, replacing 20-30 SSI/MSI packages per channel and saving both board area and solder-joint count - critical for high-shock environments. Its non-volatile UV-EPLD configuration means the part is fully operational within microseconds of power-up with no external boot memory, eliminating a common failure mode in legacy SRAM-based logic.
Recommended
Satellite Payload Controller
Satellite payload command and telemetry boards use the EP1810GM883 for protocol conversion between the spacecraft 1553B data bus and payload-specific sensors/actuators. The part's 48 I/O pins provide sufficient fan-out to interface with multiple payload subsystems, and the ceramic PGA package delivers the radiation-tolerance and hermeticity needed for long-duration GEO/HEO missions. Its deterministic 45 ns timing allows payload engineers to close worst-case timing budgets without statistical margin penalties, simplifying FMECA analysis.
Recommended
Down-Hole Oil and Gas Instrumentation
Down-hole MWD/LWD tools operate at temperatures exceeding 150C and pressures above 20 kpsi, which is why the EP1810GM883's -55C to +125C MIL-spec rating (with margin) is highly valued in this market. The EPLD consolidates tool-face sensor decoding, mud-pulses telemetry framing, and battery management state machines in a single hermetic package rated for severe thermal cycling. Its 5 V single-supply operation matches the downhole battery stack, eliminating the need for extra DC-DC converters in a space-constrained tool collar.
Recommended
Nuclear Instrumentation and Control
In nuclear-qualified instrumentation racks, the EP1810GM883 is used for safety-critical I/O expansion, watchdog timing, and event-sequencer logic where its ceramic hermetic package and 883B screening satisfy IEEE 323 and IEC 60780 qualifiers. The part's non-volatile UV-EPLD architecture is preferred over SRAM-based PLDs because configuration is retained through power-loss events - a regulatory requirement in safety-auxiliaries shutdown systems. Its deterministic 45 ns delay simplifies the worst-case trip-path timing analysis mandated by safety-channel separation rules.
Recommended
Legacy Industrial PLC Replacement
Many long-lifecycle industrial PLCs and CNC controllers built in the early 1990s use the EP1810 family as their discrete-logic backbone; the EP1810GM883 provides a screened, military-grade replacement when those boards are refurbished. It plugs into the same PGA socket without PCB changes, restoring operation of legacy lines where the OEM has discontinued support. The part's 80 MHz equivalent toggle frequency and 5 V TTL I/O make it compatible with both original bipolar logic buses and newer CMOS peripherals added during partial upgrades.
Recommended
Recommended Products Summary
Engineering reference data for EP1810GM883 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1810GM/883B | EP1810GI-45 | EP1810GC-35 | EP1810GC-35AB | EP1810GM883B-45 | EP1810GM883B68-45 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 68-Pin Ceramic PGA | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same | 68-Pin Ceramic PGA - same |
| Macrocells | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| Propagation Delay (tpd) | 45 ns | 45 ns | 45 ns | 35 ns (faster) | 35 ns (faster) | 45 ns | 45 ns |
| MIL-STD-883 Class B Screening | Yes | Yes | No (industrial temp only) | No (commercial) | Partial (Altera burn-in 'AB') | Yes | Yes |
| Operating Temperature Range | -55C to +125C (MIL) | -55C to +125C (MIL) | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial, burned-in) | -55C to +125C (MIL) | -55C to +125C (MIL) |
| Supply Voltage | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) | 5 V (4.5 V to 5.5 V) |
| User I/O Pins | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| Dedicated Inputs | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| Global Clocks | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- MIL-STD-883 Class B screening with -55C to +125C operating range (vs EP1810GC-35 (commercial temperature, no MIL screening))
- 45 ns speed grade optimized for legacy timing budgets (vs EP1810GC-35 (35 ns speed grade))
- Ceramic PGA package with hermetic metal-sealed cofired body (vs EP1810GC-35AB (also ceramic but 'AB' burn-in screening))
- Non-volatile UV-EPLD configuration with instant-on behavior (vs Modern SRAM-based CPLDs (MAX7000AE, MAX V))
Design Notes
Estimated: at 5 V supply with all 48 macrocells toggling at 1 MHz CMOS load, typical VCC current is around 100-200 mA for the EP1810GM883 ceramic PGA variant - place at least one 0.1 uF ceramic decoupling capacitor within 1 cm of every VCC pin (3 pins total: 18, 36, 52) and one 10 uF tantalum bulk capacitor at the PGA socket entry. The ceramic PGA's low thermal resistance (around 15 C/W theta-JC) means no external heatsink is required even at industrial temperatures, but the socket must provide low thermal resistance to the PCB.
Estimated: at maximum ambient of +125C and worst-case 300 mA VCC current, internal dissipation is 1.5 W and junction temperature rise is approximately 22 C above case (using 15 C/W theta-JC for ceramic PGA), keeping Tj safely below the 150 C military limit. Designers should still verify airflow in sealed enclosures - the ceramic PGA transfers heat primarily through the socket into the PCB copper, so a minimum 4-layer PCB with 1 oz copper on internal ground planes is recommended for high-altitude avionics applications.
Do not assume 883B-screened parts are RoHS-compliant - the EP1810GM883 typically uses SnPb (tin-lead) finish to meet military solder joint reliability requirements, which violates RoHS but is mandatory for MIL-STD programs. When designing for dual-use (military + commercial) boards, isolate the EPLD socket footprint on a daughter-card so the commercial variant (EP1810GC-35AB) can be assembled with Pb-free process and the military variant can be hand-installed afterward. Also note that the EP1810GM883 is UV-erasable only - budget a windowed ceramic adapter and ~30 minutes of UV exposure time for prototype iteration cycles.
Use a machined-pin PGA socket (e.g., 3M Textool or equivalent) rated for -55C to +125C with gold-plated contacts to maintain reliable contact resistance below 50 milliohms across thermal cycles. Keep the socket keep-out area clear of components on both sides of the PCB; if top-side UV erasure window access is required, leave at least 5 mm clearance above the package. For high-vibration environments (missile, avionics), add a PGA retainer plate and apply thread-locking compound to the socket mounting hardware to prevent pin fretting.
The EP1810GM883's TTL-compatible outputs have typical 4 mA drive strength (IOL/IOH), so fan-out beyond 10-15 standard TTL loads requires external buffering; add 74LS244 or 74FCT244 buffers on heavily-loaded address/data buses. Controlled output slew-rate programming (via the EP1800 design software) reduces ground bounce on 32-bit-wide buses - enable this option whenever more than 16 outputs switch simultaneously. For mixed 5 V/3.3 V systems, the EP1810GM883 outputs must be level-shifted with a 74LVC245 or similar; do not connect 5 V TTL outputs directly to 3.3 V CMOS inputs.
Compliance Information
MIL-STD-883 Class B screening denoted by '883' suffix in part number. RoHS/REACH status not in source data; ceramic PGA military parts typically use SnPb finish (non-RoHS). AEC-Q100 not applicable (this is a military programmable logic IC, not an automotive-grade semiconductor).
