EP1AGX20CF484I6N - 484-FBGA FPGA, 21.6K LE, Industrial | Intel
MPN: EP1AGX20CF484I6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $210 | $210,000.00 |
Drop-in alternatives for EP1AGX20CF484I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1AGX20CF484I6N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Process Technology | 90 nm |
| Logic Elements | 21,580 |
| LABs / CLBs | 1,079 |
| Total RAM Bits | 1,229,184 |
| User I/O Count | 230 |
| I/O Supply Voltage | 2.5 V / 3.3 V |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Operating Junction Temperature | -40C to +100C (Industrial) |
| Speed Grade | -6 |
| Package | 484-pin FC-FBGA (23x23 mm) |
| Mounting Type | Surface Mount |
| Configuration Method | JTAG, Active Serial |
| RoHS Status | Compliant |
EP1AGX20CF484I6N 484-pin fc-fbga (23x23 mm) Pin Configuration Guide
Complete pinout information for EP1AGX20CF484I6N (484-pin fc-fbga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX20CF484I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX20CF484I6N is suitable for 6 applications: PCI Express Endpoint Card, Telecom Line Card Interface, Video Processing Pipeline, Industrial Imaging System, Serial Bridge / Protocol Converter, Military / Aerospace Communication.
PCI Express Endpoint Card
The EP1AGX20CF484I6N's dedicated multi-gigabit transceivers support data rates up to 3.125 Gbps, which is sufficient for PCI Express Gen1 (2.5 Gbps) and Gen2 with oversampling. Its 21,580 logic elements and 1,229,184 bits of embedded RAM are more than adequate for typical endpoint designs including transaction layer, data link layer, and user-application logic. The 230 user I/Os in the 484-FBGA package provide ample parallel connectivity for memory buses, board control signals, and external PHY interfacing. The I6N industrial temperature rating ensures reliability in server-room and edge-computing environments. Quartus II IP cores for PCIe hard IP simplify integration.
Recommended
Telecom Line Card Interface
Telecom line cards require reliable serial-interface bridging across backplanes and to external networks. The EP1AGX20CF484I6N supports standard telecom protocols including Gigabit Ethernet, Serial RapidIO, and XAUI through its multi-gigabit transceivers. With 21,580 logic elements available, designers can implement packet processing, framing, and link-layer functions alongside the PHY interface. The industrial temperature range (-40C to +100C junction) suits outdoor cabinet and central-office deployments. The 484-FBGA package with 230 user I/Os accommodates TDM bus, memory, and management interface connectivity typical of line-card designs.
Recommended
Video Processing Pipeline
Broadcast and professional video systems benefit from the EP1AGX20CF484I6N's combination of DSP blocks, embedded RAM, and high-speed transceivers. SDI (Serial Digital Interface) at 270 Mbps, HD-SDI at 1.485 Gbps, and 3G-SDI at 2.97 Gbps all fall well within the device's 3.125 Gbps transceiver capability. The 1,229,184 bits of block RAM enable line-buffer and frame-buffer implementation for real-time video processing. The 230 user I/Os support parallel video buses (BT.656, BT.1120) and external memory interfaces. The I6N industrial temperature grade suits broadcast-equipment rack environments.
Recommended
Industrial Imaging System
Machine-vision and industrial imaging systems require deterministic, low-latency processing of high-bandwidth sensor data. The EP1AGX20CF484I6N's transceivers can interface with CoaXPress, Camera Link, or proprietary high-speed serial sensor protocols at rates up to 3.125 Gbps per lane. Its 21,580 logic elements support real-time image processing pipelines including filtering, color-space conversion, and feature extraction. The industrial temperature grade (-40C to +100C junction) is critical for factory-floor and outdoor installations. The 484-FBGA package's 230 user I/Os accommodate multiple parallel sensor interfaces, GPIO, and host connectivity.
Recommended
Serial Bridge / Protocol Converter
Protocol-conversion bridges between serial standards are a common Arria GX use case. The EP1AGX20CF484I6N's multiple multi-gigabit transceivers allow simultaneous support of multiple protocols: converting XAUI to Serial RapidIO, PCIe to Ethernet, or custom serial formats to parallel bus interfaces. With 21,580 logic elements and dedicated block RAM, the device can buffer and reframe data across protocols while maintaining line-rate throughput. The industrial temperature rating suits outdoor telecom and industrial-automation deployments. Quartus II provides IP cores for most common serial protocols, accelerating development.
Recommended
Military / Aerospace Communication
Ruggedized communication systems for defense and aerospace applications leverage the EP1AGX20CF484I6N's industrial temperature range (-40C to +100C junction) and radiation-tolerant Arria GX architecture. The device's transceivers support secure serial links, while its logic capacity enables encryption, error correction, and protocol handling. The 484-FBGA package provides the mechanical robustness required for vibration-prone environments. Note that for true space-grade applications, specific radiation-hardened variants or additional lot screening may be required; consult Intel/Altera aerospace documentation for flight-grade qualification status.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX20CF484I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX20CF484I6 | EP1AGX20CF484C7N | EP1AGX20CF484C6N | EP1AGX20CF484C7 | EP1AGX20CF484C6 | EP1AGX20CF484C3 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 |
| Total RAM (bits) | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 | 1,229,184 |
| User I/O | 230 | 230 | 230 | 230 | 230 | 230 | 230 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -6 | -6 | -7 | -6 | -7 | -6 | -3 |
| Lead Finish | Pb-free (N suffix) | Pb (non-N) | Pb-free (N suffix) | Pb-free (N suffix) | Pb (non-N) | Pb (non-N) | Pb (non-N) |
Key Differentiators
- Industrial temperature rating for harsh environments (vs EP1AGX20CF484C7N)
- RoHS-compliant lead finish (Pb-free) (vs EP1AGX20CF484I6)
- -6 speed grade balance of performance and cost (vs EP1AGX20CF484C7N)
Design Notes
The EP1AGX20CF484I6N requires a 1.15 V to 1.25 V core supply and 2.5 V/3.3 V I/O rails, plus dedicated analog PLL and transceiver TX/RX supplies that must be filtered separately per the Arria GX datasheet. Each power pin requires a local bulk capacitor (10-22 uF) plus 0.1 uF and 1 nF high-frequency ceramics placed within 0.5 inches of the pin. Estimated core current draw under typical utilization is 0.5-2 A depending on clock rate and logic activity; use a voltage regulator with at least 20% margin. Power sequencing must follow the Altera-recommended order to prevent latch-up.
The 484-FBGA package dissipates significant power through the bottom balls. Implement thermal vias in the PCB land pattern directly beneath the BGA, connecting to inner ground planes for heat spreading. For applications exceeding 3-5 W total power dissipation, attach a heatsink with thermal interface material. Maximum junction temperature is 100C for the industrial-grade device; derate power budget to maintain margin. Estimate: at 3 W dissipation and theta_JA of approximately 15 C/W (with proper thermal design), junction temperature rise is 45C above ambient.
Route high-speed transceiver traces with controlled-impedance differential pairs (typically 100 ohm or 85 ohm differential). Maintain continuous reference planes under all transceiver traces; avoid routing across plane splits. Match trace lengths within the tolerance specified by the protocol (PCIe requires 5 mil, XAUI requires 25 mil). Place AC-coupling capacitors as close to the transmitter as possible. The 484-FBGA fanout requires at least 4 PCB routing layers with microvia technology for breakout; plan stackup accordingly.
Multi-gigabit transceiver signals require careful signal-integrity analysis. Use IBIS or HSPICE models from Altera for channel simulation before PCB fabrication. Maintain 100 ohm differential impedance for transceiver lanes; use series capacitors for AC coupling (typically 100 nF). Clock signals should be routed with controlled impedance and matched lengths. Apply source termination on high-speed outputs if recommended by the protocol specification. Perform pre-layout and post-layout simulations to validate signal integrity at the target data rate.
Do not exceed the maximum I/O count of 230 user pins when assigning signals; the remaining pins are dedicated power, ground, JTAG, configuration, or transceiver. Ensure proper configuration mode is selected (Active Serial vs JTAG) via MSEL pins before power-up. Do not omit the decoupling capacitors specified in the datasheet, even if your design appears to function without them in the lab. The N suffix indicates Pb-free/RoHS-compliant lead finish; non-N variants may be non-compliant for some regions. Always check temperature grade (I vs C suffix) matches your application's environment.
Compliance Information
RoHS compliant per N suffix designation. Not AEC-Q100 qualified (not an automotive-grade part). Industrial temperature grade (-40C to +100C junction) suitable for harsh environments but not automotive.
