EP1AGX35CF484C6N - Arria GX FPGA 33.5K LE 484-FBGA | Intel
MPN: EP1AGX35CF484C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $118 | $118,000.00 |
Drop-in alternatives for EP1AGX35CF484C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX35CF484C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$295 / Unit
View Datasheet →EP1AGX35CF484C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP1AGX35CF484C6N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements (LE) | 33,520 |
| Embedded Memory | 1,348,416 bits |
| User I/O Pins | 230 |
| Package | 484-pin FC-FBGA (Flip-Chip BGA) |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Speed Grade | C6 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Transceivers | 4 channels, 600 Mbps to 3.125 Gbps |
| DSP Blocks | 18x18 multipliers |
| Memory Blocks | M9K and M-RAM |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Mounting Type | Surface Mount |
EP1AGX35CF484C6N 484-pin fc-fbga (flip-chip bga) Pin Configuration Guide
Complete pinout information for EP1AGX35CF484C6N (484-pin fc-fbga (flip-chip bga) package) with 230 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX35CF484C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 230 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX35CF484C6N is suitable for 6 applications: Wireless Baseband Processing, PCI Express Endpoint Card, Serial RapidIO Backplane, Industrial Video Processing Pipeline, Broadcast Equipment (SDI Multiplexing), Protocol Bridge and Interface Conversion.
Wireless Baseband Processing
The EP1AGX35CF484C6N fits wireless baseband processing with its 33,520 logic elements providing DSP-style arithmetic resources via embedded 18x18 multipliers, and 1,348,416 bits of embedded memory enabling chip-rate buffering and coefficient storage. The 4 transceivers at up to 3.125 Gbps support CPRI/OBSAI links to RF cards, while the 230 user I/O pins handle parallel radio data interfaces. Designers typically place the device between a baseband ASIC/SoC and the RF front-end, using the FPGA for protocol adaptation and real-time signal processing.
Recommended
PCI Express Endpoint Card
With 4 integrated transceivers operating up to 3.125 Gbps, the EP1AGX35CF484C6N implements x1 or x4 PCI Express endpoints without requiring an external PHY, reducing BOM and board complexity. The 33,520 logic elements and 1.35 Mbit of embedded RAM support custom register maps, DMA engines, and application accelerators. The 484-ball FC-FBGA package provides the signal integrity required for high-speed serial links, while 230 user I/O pins connect to downstream peripherals and memory.
Recommended
Serial RapidIO Backplane
The EP1AGX35CF484C6N supports Serial RapidIO (SRIO) at 1.25, 2.5, and 3.125 Gbps per lane, making it suitable for backplane switching and aggregation in DSP cluster systems. Four transceivers can be aggregated for higher aggregate bandwidth, while the 33,520 LE fabric implements the SRIO logical layer, switch logic, and port arbitration. Embedded M9K and M-RAM blocks provide packet buffering and table lookup, and the 230 user I/O pins support local parallel buses to host processors.
Recommended
Industrial Video Processing Pipeline
The EP1AGX35CF484C6N fits industrial video processing where its 33,520 logic elements implement pixel pipelines and color-space converters, while embedded 18x18 multipliers enable real-time scaling and filtering. The 1,348,416-bit embedded memory provides line buffering for HD video streams without external DDR. The 230 user I/O pins connect to camera sensors (LVDS), DDR2 memory controllers, and display output channels, and the 484-ball FC-FBGA package supports the controlled-impedance layout required for high-speed sensor interfaces.
Recommended
Broadcast Equipment (SDI Multiplexing)
The EP1AGX35CF484C6N's 4 transceivers at 2.97 Gbps implement SMPTE SDI standards (SD-SDI, HD-SDI, and 3G-SDI) for broadcast video routing and multiplexing. The 33,520 logic elements support video format conversion, audio embedding, and ancillary data processing, while 1,348,416 bits of embedded memory buffers active video streams. The 230 user I/O pins connect to switch fabrics and downstream broadcast equipment, with the 484-ball FC-FBGA providing the thermal performance required for sustained broadcast operations.
Recommended
Protocol Bridge and Interface Conversion
The EP1AGX35CF484C6N serves as a multi-protocol bridge converting between serial interfaces such as PCIe, Serial RapidIO, Gigabit Ethernet, and custom LVDS links. The 33,520 logic elements implement protocol stack layers (MAC, logical, transport), while 4 transceivers support up to 4 simultaneous high-speed links. The 230 user I/O pins connect to legacy parallel buses (PCI, Local Bus) and modern serial peripherals, and the embedded M9K memory blocks provide packet queuing and descriptor storage for sustained throughput.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX35CF484C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX35CF484C6 | EP1AGX35CF484C4N |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Package | 484-pin FC-FBGA | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same |
| Logic Elements | 33,520 | 33,520 | 33,520 |
| Embedded Memory (bits) | 1,348,416 | 1,348,416 | 1,348,416 |
| User I/O Pins | 230 | 230 | 230 |
| Transceivers | 4 channels up to 3.125 Gbps | 4 channels up to 3.125 Gbps | 4 channels up to 3.125 Gbps |
| Speed Grade | C6 | C6 (same) | C4 (slower) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm |
| Lifecycle Status | NRND | NRND | NRND |
Key Differentiators
- Integrated 3.125 Gbps transceivers (vs EP1AGX20CF484C6N)
- Mid-range logic capacity (vs EP1AGX50CF484C6N)
- C6 speed grade for higher performance (vs EP1AGX35CF484C4N)
Design Notes
The 484-ball FC-FBGA package requires a multi-layer PCB with controlled-impedance stack-up and microvia technology (laser-drilled vias). The BGA pitch and ball diameter should match the PCB pad design guidelines in the Arria GX Device Handbook. Decoupling capacitors must be placed as close as possible to the power pins, with a recommended mix of 100 nF, 10 nF, and bulk capacitors distributed across the PCB area under the device.
High-speed transceiver channels require matched-length differential pair routing with 100 ohm differential impedance, length matching within 5 mils, and AC-coupling capacitors placed symmetrically. Reference the Arria GX Transceiver Layout Guidelines for via pattern recommendations, ground plane stitching via spacing (typically lambda/20), and transmitter pre-emphasis tap settings to achieve compliance with PCI Express and Serial RapidIO specifications.
Power sequencing must follow the Arria GX device handbook specification: VCCINT (1.2 V core) and VCCA (2.5 V PLL analog) should rise monotonically before or simultaneously with VCCIO (I/O supply), with VCCD_PLL following. Use a dedicated power management IC with sequence control or carefully designed discrete RC delay networks. Incorrect sequencing can cause latch-up or permanent device damage.
Estimated: The 33,520 logic elements and 4 transceivers can generate significant simultaneous switching noise (SSN). Isolate high-speed transceiver regions from parallel I/O regions using separate power planes, and place ground islands between noisy switching zones. SSO (Simultaneously Switching Outputs) analysis should be performed using Intel's Signal Integrity tool or third-party tools to validate ground bounce and VCCIO sag margins.
Compliance Information
RoHS compliance per Intel/Altera legacy product documentation. Not AEC-Q100 qualified (commercial temperature grade only). For industrial temperature range, consider EP1AGX35CF484I6N variants.
