EP1AGX35CF484C6 - Arria GX FPGA 33.5K LE 484-FBGA | Intel
MPN: EP1AGX35CF484C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
Drop-in alternatives for EP1AGX35CF484C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX35CF484C6N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1AGX35CF484I6N
✅ Drop-In✓ In Stock
$120 / Unit
View Datasheet →EP1AGX35CF484C4N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1AGX35CF484C7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1AGX35CF484I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1AGX35CF484C6 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements (LE) | 33,520 |
| Number of LABs/CLBs | 1676 |
| Total Memory Bits | 1348416 |
| User I/O Count | 230 |
| Number of Transceivers | 4 |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Package | 484-BBGA (FC-FBGA) |
| Package Body Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| Hard IP Support | PCI Express, Gigabit Ethernet, Serial RapidIO |
EP1AGX35CF484C6 23 x 23 mm Pin Configuration Guide
Complete pinout information for EP1AGX35CF484C6 (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX35CF484C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX35CF484C6 is suitable for 6 applications: PCI Express Endpoint Card, Broadcast Video Processing, Wireless Baseband Prototyping, Industrial Imaging and Machine Vision, Serial RapidIO Bridge, Test and Measurement Instrumentation.
PCI Express Endpoint Card
The EP1AGX35CF484C6's integrated PCI Express hard IP supporting x1/x4 endpoint configurations makes it ideal for protocol bridge cards. With 33,520 logic elements and 1.348 Mbit of embedded block RAM, the device can host the PCIe transaction layer, data-path FIFOs, and an application-side DMA engine on a single chip. The four 3.125 Gbps transceivers provide the SerDes lanes required for PCIe x4 link training, eliminating the need for external PHY silicon. Designers targeting legacy x86 server backplanes can drop this device directly onto an adapter card layout with the 484-ball FC-FBGA exposing 230 user I/Os for downstream chip interconnect.
Recommended
Broadcast Video Processing
The 33,520 LEs and 1.348 Mbit block RAM of the EP1AGX35CF484C6 support multi-stream SD/HD broadcast equipment such as format converters, frame synchronizers, and de-interlacers. The DSP blocks on the Arria GX family accelerate motion-estimation and chroma-key compositing pipelines, while 230 user I/Os handle parallel video buses (BT.656, BT.1120) and DVI/HDMI bridge interfaces. The 484-ball FC-FBGA package is footprint-compatible across the Arria GX family, simplifying board variants for cost-down or feature-up SKUs. With commercial temperature grade and a 1.2 V core, the device suits broadcast studio and master-control room installations where thermals are well controlled.
Recommended
Wireless Baseband Prototyping
The EP1AGX35CF484C6's combination of 33,520 logic elements, embedded multipliers, and four 3.125 Gbps transceivers makes it a practical platform for wireless baseband prototyping at LTE and WiMAX sample rates. The transceivers can drive CPRI or OBSAI links to remote radio heads, while the on-chip DSP blocks implement FFT/iFFT, channel coding, and matrix multipliers for MIMO signal chains. With 230 user I/Os, designers have plenty of headroom for ADC/DAC interfaces, JTAG debug, and external memory buses (DDR2/DDR3 controllers in soft IP). The 484-ball FC-FBGA package is a sensible choice for prototype hardware that may later migrate to a denser Arria II or Arria V device on the same BGA footprint family.
Recommended
Industrial Imaging and Machine Vision
For industrial camera and machine-vision pipelines, the EP1AGX35CF484C6's 33,520 LEs and 1.348 Mbit block RAM support real-time Bayer demosaicing, color-space conversion, and pre-processing for FPGA-to-MCU hand-off. The 230 user I/Os accept multi-lane Camera Link, LVDS, or MIPI CSI-2 inputs through bridge chips, while the four 3.125 Gbps transceivers enable GigE Vision and CoaXPress uplink over a single serial link. Industrial temperature variants such as the EP1AGX35CF484I6N extend deployment to factory floors with -40C to +100C tolerance. Designers using the 484-ball FC-FBGA benefit from a robust substrate for thermal cycling and vibration.
Recommended
Serial RapidIO Bridge
The EP1AGX35CF484C6's Serial RapidIO hard IP and four 3.125 Gbps transceivers let it serve as a low-latency bridge between DSP clusters, microTCA backplanes, and AMC modules. The 33,520 LEs are sufficient to implement additional switch fabric glue logic, error-correction wrappers, and DMA channels on top of the RapidIO hard IP. With 1.348 Mbit of embedded memory, designers can size sizeable TX/RX descriptor rings without resorting to external SRAM. The 484-ball FC-FBGA package is widely accepted across defense and telecom OEMs, easing supply-chain adoption. Performance-critical pin-compatible alternates include the higher-speed C7 variants in the same family.
Recommended
Test and Measurement Instrumentation
The EP1AGX35CF484C6's mix of 33,520 logic elements, 1.348 Mbit block RAM, and four 3.125 Gbps transceivers is well matched to test-and-measurement instruments such as protocol analyzers, logic-analyzer probe heads, and arbitrary waveform generator pre-processors. Commercial temperature grade and the 1.2 V core keep thermal envelopes manageable in benchtop chassis. The 230 user I/Os handle parallel LVDS or CMOS probe fan-in without external muxing, while the embedded transceivers drive high-speed serial triggers and external 10 GbE uplinks for remote data acquisition. Migrating to higher-density Arria II GX preserves the BGA footprint and Quartus toolchain when channel counts grow.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX35CF484C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX35CF484C6N | EP1AGX35CF484I6N | EP1AGX35CF484C4N | EP1AGX35CF484C7N | EP1AGX35CF484I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BBGA (FC-FBGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Logic Elements | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 |
| Total Memory Bits | 1,348,416 | 1,348,416 | 1,348,416 | 1,348,416 | 1,348,416 | 1,348,416 |
| User I/O Count | 230 | 230 | 230 | 230 | 230 | 230 |
| Transceiver Data Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Speed Grade | C6 (6 speed grade) | C6 | I6 | C4 | C7 | I7 |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Lead-Free / RoHS | unknown | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-package same-die drop-in compatible across the Arria GX 35K family (vs EP1AGX90EF1152I6)
- Integrated PCI Express hard IP reduces soft-logic utilization (vs Cyclone III FPGA without hard PCIe)
- Four embedded 3.125 Gbps transceivers eliminate external PHY (vs Discrete SerDes + companion FPGA)
- Industrial-temperature variants available in same package (vs EP1AGX35CF484C6N (commercial only))
Design Notes
Estimated: the 484-ball FC-FBGA at 1.0 mm ball pitch requires a 6-layer or 8-layer stack-up with a solid ground plane directly beneath the BGA to control return paths for the four high-speed transceivers. Route all four transceiver channels with 100-ohm differential impedance and length-match within 0.127 mm (5 mil) per pair. Place the configuration PROM (EPCS64 or compatible) within 50 mm of the nCONFIG/DATA pins to ensure robust configuration timing on power-up.
The EP1AGX35CF484C6 uses a 1.2 V core supply; transceivers each draw around 100 mA from a 1.2 V supply and additional current from 1.4 V PLL supplies. Estimated: at full utilization, total power consumption can reach 5-8 W. Decouple each transceiver bank with 0.1 uF MLCCs and 10 uF bulk ceramics placed within 5 mm of the supply balls. Add a Pi-filter (ferrite bead + capacitors) on each PLL analog supply pin to minimize jitter from digital noise coupling.
Each of the four transceivers is specified to 3.125 Gbps and requires controlled-impedance routing, AC-coupling capacitors on each serial pin, and an external reference clock with sub-300 fs RMS jitter for compliance with PCI Express and Gigabit Ethernet specifications. Per the Arria GX handbook, the reference clock input is differential LVPECL; use a dedicated clock buffer IC rather than routing the reference from a noisy shared source.
Do not assume that pin-compatible Arria GX variants are bitstream-compatible: although the C4, C6, and C7 speed-grade options share the same die, Quartus II must be told which device variant to target for the SOF file generation, otherwise the configuration controller will fail to start the device on power-up. Also avoid relying on undocumented features such as soft JTAG IDCODE overrides; use the documented factory IDCODE sequence.
Compliance Information
RoHS/lead-free status of the EP1AGX35CF484C6 specific variant is not confirmed in the verified web data; the equivalent EP1AGX35CF484C6N suffix indicates lead-free compliance. AEC-Q100 not applicable (FPGA, not automotive-qualified discrete). Conflict-minerals compliance per Altera/Intel corporate policy.
