EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel
MPN: EP1AGX35CF780I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $412.5 | $412.50 |
| 10 | $380 | $3,800.00 |
| 100 | $342 | $34,200.00 |
| 500 | $305.5 | $152,750.00 |
| 1,000 | $278.75 | $278,750.00 |
Drop-in alternatives for EP1AGX35CF780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX20CF780I6N
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✅ Drop-In ⚠️ 参数待验证✓ In Stock
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✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX35CF780I6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX20CF780C6N
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View Datasheet →EP1AGX35CF780I6N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Family | Arria GX |
| Device Series | EP1AGX35 |
| Logic Elements (LE) | 33,250 |
| Logic Array Blocks (LABs) | 33,520 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Embedded Transceivers | Up to 3.125 Gbps |
| Package | 780-pin Flip-Chip BGA (FC-FBGA) |
| Package Code | BGA-780 |
| Package Dimensions | 29 x 29 mm |
| Terminal Pitch | 1.00 mm |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| Temperature Grade | Industrial |
| Operating Temperature Range | -40C to +100C (Industrial, I6 speed grade) |
| Speed Grade | I6 |
EP1AGX35CF780I6N 29 x 29 mm Pin Configuration Guide
Complete pinout information for EP1AGX35CF780I6N (29 x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX35CF780I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX35CF780I6N is suitable for 7 applications: PCI Express Endpoint / Root Complex, Telecommunications Backplane Aggregation, Broadcast Video Processing Equipment, Software-Defined Radio Baseband Cards, Industrial Serial-Link Aggregation, ASIC Prototyping & Emulation, Test & Measurement Instrumentation.
PCI Express Endpoint / Root Complex
The EP1AGX35CF780I6N's embedded 3.125 Gbps transceivers and hard PCI Express IP blocks make it a strong fit for PCIe Gen1 endpoint designs. The Arria GX PCIe hard IP supports x1/x4/x8 lane configurations with the appropriate configuration in Quartus, and the 780-pin package exposes all required transceiver pins for x8 PCIe designs. The 33,250 logic elements are sufficient for a soft-logic application layer plus DMA engines, while the transceivers drive the SERDES differential pair lanes directly. Designers pair each transceiver channel with the documented 100 nF AC-coupling capacitor and follow the Arria GX PCB layout guide for 85 ohm differential impedance.
Recommended
Telecommunications Backplane Aggregation
Telecom backplane cards commonly aggregate multiple serial links (CPRI, OBSAI, or proprietary) onto a single board. The EP1AGX35CF780I6N's multi-channel 3.125 Gbps transceivers allow several backplane links to be terminated in a single FPGA, reducing BOM cost versus using discrete SERDES. Its 33,250 logic elements accommodate framing, deframing, and link-protocol state machines alongside the transceiver channels. Industrial temperature grade (-40C to +100C) suits outdoor-cabinet deployments such as Remote Radio Heads (RRH). The 780-pin BGA exposes both the high-speed serial pins and the general-purpose I/O for control/status.
Recommended
Broadcast Video Processing Equipment
The EP1AGX35CF780I6N serves broadcast video processing cards that need real-time SDI/HD-SDI/3G-SDI deserialization, color-space conversion, and frame buffering. Embedded transceivers receive serialized SDI streams at up to 2.97 Gbps, while the logic fabric handles scaling and overlay logic. Dedicated DSP blocks accelerate chroma upsampling and filtering. The 780-pin package provides abundant user I/O for HDMI/DisplayPort interfaces alongside SDI inputs. Industrial temperature grade suits studio and outdoor broadcast truck environments. Quartus IP for SDI is freely available, shortening time-to-market versus custom SERDES implementations.
Recommended
Software-Defined Radio Baseband Cards
Software-defined radio (SDR) platforms like USRP and custom designs use the EP1AGX35CF780I6N to implement wideband digital down-conversion, channelization, and packet formation in the fabric. The dedicated DSP blocks provide high-throughput multiply-accumulate operations needed for FIR filtering and FFT preprocessing, while the embedded 3.125 Gbps transceivers interface to high-speed ADC/DAC daughter-cards (e.g., FMC). The 33,250 logic elements fit complete SDR physical-layer designs plus Ethernet framing for the host link. Industrial temperature enables deployment in field-deployed radios for defense and public-safety applications.
Recommended
Industrial Serial-Link Aggregation
Industrial automation platforms aggregate multiple PROFINET, EtherCAT, or SERCOS III links into a central controller board; the EP1AGX35CF780I6N supports several such protocols simultaneously thanks to its 3.125 Gbps transceivers and ample logic resources. The industrial temperature grade (-40C to +100C) is rated for factory-floor operation. The 780-pin package exposes both the high-speed serial pins and control I/O for sensor-side communication. Designers integrate motion-control state machines alongside the protocol stacks without external ASIC assistance, reducing board area and BOM cost for machine-builder customers.
Recommended
ASIC Prototyping & Emulation
Designers targeting an ASIC often prototype with FPGAs to validate RTL before mask commit; the EP1AGX35CF780I6N provides 33,250 logic elements plus dedicated DSP and memory blocks that map efficiently from ASIC RTL. The 780-pin FC-FBGA exposes a large number of user I/O for ASIC pin-count exploration. Arria GX Quartus support is mature and includes incremental compilation flows that accelerate bring-up. Industrial temperature is sufficient for lab and chassis-mounted prototyping racks. Larger designs scale to multi-FPGA partitioning, where the 780-pin package provides the high pin-count required for cross-FPGA trace connections.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers use the EP1AGX35CF780I6N to acquire high-speed serial data and route it through flexible display or analysis logic. The embedded 3.125 Gbps transceivers capture multi-gigabit signals directly, while the logic fabric implements triggering, statistics counters, and protocol decoding. Industrial temperature suits bench and field instrument use. The 780-pin FC-FBGA exposes numerous general-purpose I/O for probe pods and front-panel interfaces, and Quartus support for standard test-and-measurement IP shortens development. Multiple transceiver channels support parallel acquisition across multiple DUTs.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX35CF780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX20CF780I6N | EP1AGX20CF780I6 | EP1AGX35CF780C6N | EP1AGX35CF780I6 | EP1AGX20CF780C6N |
|---|---|---|---|---|---|---|
| Package | 780-pin FC-FBGA (F780) 29x29 mm | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same | 780-pin FC-FBGA (F780) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 33,250 | 21,580 | 21,580 | 33,250 | 33,250 | 21,580 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Industrial | Commercial |
| Speed Grade | I6 | I6 | I6 | C6 | I6 | C6 |
| Embedded Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| Unit Price @ 1000 pcs (USD) | ~278.75 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Same-package drop-in availability within the Arria GX family (vs EP1AGX20CF780I6N)
- Industrial temperature grade with same die (vs EP1AGX35CF780C6N)
- Dedicated embedded 3.125 Gbps transceivers (vs EP1AGX35CF484I6N)
Design Notes
The 780-pin FC-FBGA package is a flip-chip land-grid array - PCB land pattern MUST use non-solder-mask-defined (NSMD) pads per the Arria GX PCB layout guide. Solder-mask-defined pads cause tombstoning and broken joints during reflow because the mask opening constrains the solder joint area. Use 0.40 mm pad diameter, 0.50 mm solder mask opening, and microvia-in-pad if your PCB fabricator supports it. Estimate: the BGA ball count (780) requires at least a 6-layer PCB with symmetric stackup to route out all transceiver differential pairs.
Each embedded transceiver channel requires an external AC-coupling capacitor (typically 100 nF, 0402 size) in series with the serial differential pair. The capacitor must be placed within 250 mils of the FPGA ball to maintain the 3.125 Gbps signal integrity budget. The reference clock input also requires a dedicated low-jitter clock source - jitter above 60 ps RMS will close the eye at 3.125 Gbps. Differential routing must hold 85 ohm +/-10% impedance with intra-pair length matching under 5 mils.
The Arria GX core operates at 1.2 V with separate PLL analog supplies (VCCA_PLL) at 2.5 V and transceiver supplies at 1.2 V and 1.4 V. Estimated: with all transceivers active at 3.125 Gbps, the device draws up to 2.5-3 A from the 1.2 V core rail alone. Use a switching regulator (e.g., TI TPS54620) followed by a low-dropout linear regulator for the PLL supply; place at least 4 bulk ceramic capacitors (10 uF X5R) plus 12-16 decoupling 0.1 uF capacitors around the BGA, distributed per the Arria GX pin-out guide.
Estimated: at full transceiver utilization, the Arria GX F780 package dissipates up to 5-7 W. The 29x29 mm FC-FBGA package does not expose a thermal pad to the PCB top surface, so heat is conducted primarily through the BGA balls into the inner PCB layers. Use a 6-layer board with 1 oz copper on outer layers and 2 oz copper on inner layers, plus thermal vias underneath the central ball array. Active cooling (small heatsink or 50 CFM airflow) is required above 4 W dissipation to keep the junction below 100C in industrial applications.
Configuration mode (AS, AP, PS, FPP) determines which pins are used for configuration and whether an external configuration device (EPCS/EPCQ) is required. For AS mode, connect the MSEL[2:0] pins to the recommended pull-up/pull-down values per the handbook. nCONFIG must be pulled high through a 10 kohm resistor to VCCIO of the configuration bank; nSTATUS also requires a 10 kohm pull-up. JTAG pins TCK, TMS, TDI, TDO must be brought out to a header for in-system programming and boundary-scan test.
Compliance Information
RoHS, REACH, lead-free, halogen-free status not stated in verified sources; Intel/Altera datasheets typically list compliance on the product page but no such information is present in the provided web data. AEC-Q100 not applicable - FPGAs are not automotive-qualified in the AEC-Q100 sense.
