EP1AGX35CF484I6N - Arria GX FPGA, 33.5K LE, 484-FBGA | Intel
MPN: EP1AGX35CF484I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $206.66 | $206.66 |
| 10 | $185 | $1,850.00 |
| 100 | $160 | $16,000.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $120 | $120,000.00 |
Drop-in alternatives for EP1AGX35CF484I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1AGX35CF484I6N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements (LE) | 33,520 |
| Logic Array Blocks (LABs) | 1,676 |
| User I/Os | 230 |
| Embedded Memory | 1,348,416 bits (approximately 1.35 Mbit) |
| Transceivers | 4 channels up to 3.125 Gbps |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Package | 484-ball FineLine BGA (FC-FBGA) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 C to +100 C (industrial) |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Lifecycle Status | Obsolete / Last Time Buy |
| Development Tool | Altera Quartus II (legacy) |
EP1AGX35CF484I6N 484-ball fineline bga (fc-fbga) Pin Configuration Guide
Complete pinout information for EP1AGX35CF484I6N (484-ball fineline bga (fc-fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX35CF484I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX35CF484I6N is suitable for 6 applications: Telecom Line Cards and Serial Backplanes, Broadcast Video Capture and Processing, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing, Protocol Bridging and Interface Conversion, Legacy System Sustainment and Field Repair.
Telecom Line Cards and Serial Backplanes
The EP1AGX35CF484I6N suits telecom line-card designs where multiple high-speed serial links aggregate traffic from a backplane or framer. Its four embedded 3.125 Gbps transceivers support protocols such as Serial RapidIO, XAUI, and Gigabit Ethernet, removing the need for external PHY devices and shrinking the BOM. With 33,520 logic elements and 1.35 Mbit of embedded memory, the device can implement link-layer framing, traffic shaping, and rate adaptation in a single chip. The 484-ball FBGA provides ample routing channels for the SERDES lanes and reference clocks required to meet telecom jitter masks. Engineers should validate signal integrity on the differential pairs using IBIS-AMI models before layout commit.
Recommended
Broadcast Video Capture and Processing
The EP1AGX35CF484I6N is a strong fit for broadcast video capture cards, frame buffers, and processing pipelines. Its 33,520 logic elements plus dedicated multiplier blocks can implement color-space conversion, scaling, deinterlacing, and overlay composition in real time. The 1.35 Mbit embedded memory provides line buffers and lookup tables, removing the need for external SDRAM in many single-stream pipelines. The 230 user I/Os support wide parallel video buses (BT.1120, DisplayPort auxiliary channels) and connection to external DDR2 memory controllers. Industrial temperature grade ensures reliable operation in ventilated studio and outside-broadcast (OB) truck environments where ambient temperatures can approach +85 C during continuous duty.
Recommended
Industrial Imaging and Machine Vision
The EP1AGX35CF484I6N serves well in industrial camera and machine-vision systems that need on-the-fly image preprocessing before forwarding frames to a host processor. Its DSP blocks can implement real-time filtering, edge detection, and Bayer demosaicing, while the embedded transceivers (via Channel Link, CoaXPress, or GigE Vision bridges) allow high-speed pixel-data offload. The 230 user I/Os accommodate parallel sensor interfaces (LVDS, sub-LVDS, CSI-2) alongside GPIO for shutter, trigger, and lighting control. Industrial -40 C to +100 C operation supports factory-floor deployment in unconditioned enclosures, and the 484-FBGA package provides thermal headroom for sustained processing loads typical of inline inspection.
Recommended
Military and Aerospace Signal Processing
The EP1AGX35CF484I6N's industrial temperature range, robust 90nm CMOS process, and availability in long-lifecycle mil/aero programs make it suitable for legacy defense signal-processing applications such as radar front-end preprocessing, electronic-warfare channelizers, and avionics databus bridges. The four 3.125 Gbps transceivers can handle digitized RF data, while the 33,520 logic elements implement FFT pipelines, beamforming weights, and protocol-format conversion in a single FPGA. The 484-ball FBGA supports controlled-impedance routing for both SERDES and parallel ADC/DAC interfaces. Programs with established Arria GX firmware bases commonly retain this device until the next modernization cycle.
Recommended
Protocol Bridging and Interface Conversion
The EP1AGX35CF484I6N is well-matched to protocol-bridging applications such as PCIe-to-XAUI, RapidIO-to-Ethernet, and Serial RapidIO aggregation, where four transceivers can each run a different protocol at independent line rates. The 33,520 logic elements comfortably implement bridge state machines, header parsing, and DMA engines, while the 230 user I/Os connect to local bus interfaces, memory controllers, and status LEDs. Designers commonly use this device as a cost-effective replacement for ASIC bridges in low-volume or custom networking gear, taking advantage of FPGA reconfigurability to update protocol support over the product life cycle.
Recommended
Legacy System Sustainment and Field Repair
A primary ongoing application for the EP1AGX35CF484I6N is sustaining long-deployed systems in telecom central offices, broadcast studios, and industrial control lines where the original PCB was designed around this specific Arria GX device. Because the part is marked obsolete, repair depots and sustainment programs must locate remaining authorized channel stock, factory-excess inventory, or qualified brokers. Verified inventory (320 pcs at DigiKey as of 2025-08-19 per Octopart, and additional open-market stock at LCSC and Jotrin) supports near-term repair needs. Engineers should plan a forward-looking migration to Cyclone V GX or Arria V GX equivalents for any new-build or major refurbishment program to avoid future stock-outs.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX35CF484I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX35CF484I6 | EP1AGX35CF484C6N | EP1AGX35CF484C6 | EP1AGX35CF484C4N | EP1AGX20CF484I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (FC-FBGA) | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX |
| Logic Elements | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 | ~20,000 (-40%) |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) |
| Speed Grade | 6 | 6 | 6 | 6 | 4 (slower) | 6 |
| Lead-Free (RoHS) | Yes | No (leaded) | Yes | No (leaded) | Yes | Yes |
| Transceivers | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps (fewer channels may be bonded) |
| User I/Os | 230 | 230 | 230 | 230 | 230 | 230 |
| Lifecycle Status | Obsolete / Last Time Buy | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade (-40 C to +100 C) at the same logic density (vs EP1AGX35CF484C6N)
- Lead-free / RoHS-compliant terminal finish (vs EP1AGX35CF484I6)
- 33,520 logic elements versus ~20,000 in the EP1AGX20 series (vs EP1AGX20CF484I6N)
Design Notes
The 484-ball FineLine BGA requires a minimum 4-layer PCB with continuous ground and power planes directly beneath the package to control the return-current paths for the 3.125 Gbps SERDES lanes. Use 100-ohm differential routing for each transceiver pair, with intra-pair length matching under 150 mil (3.8 mm) to keep deterministic jitter within mask. Reference-clock traces must be length-matched to their associated data lanes and routed on the same layer to avoid layer-transition discontinuities. Per the Altera Arria GX handbook, the decoupling network should include 0.1 uF X7R capacitors within 100 mil of every power pin, plus bulk decoupling at the regulator outputs.
Estimated: at a 90nm process, the EP1AGX35CF484I6N's core and SERDES power consumption can approach 5-8 W in a fully utilized 33.5K-LE design with all four transceivers active. The 484-ball FBGA dissipates heat primarily through the internal ball grid and PCB copper planes; designers should provide at least 4 thermal vias per power/ground ball cluster and a solid inner ground plane under the package. A small heat-spreader or top-side heatsink is recommended for industrial-temperature deployments where ambient approaches +85 C and SERDES utilization is high. Always validate with the device's PowerPlay early-power-estimator before committing to the thermal solution.
Do not assume the EP1AGX35CF484I6N's transceiver channels are identical to those of Arria II GX, Cyclone IV GX, or Cyclone V GX - the ball map, reference-clock scheme, and PLL configuration differ. When migrating firmware, recompile the design in the matching Quartus II version (10.0 to 13.1 for Arria GX) because newer Quartus versions do not support the legacy silicon. Also note that the 'N' suffix denotes lead-free terminal finish, while the suffix-less 'EP1AGX35CF484I6' is leaded - confirm your assembly process matches the variant on the BOM. Finally, because the part is obsolete, plan obsolescence management: qualify a Cyclone V GX or Arria V GX successor before stock depletes.
Compliance Information
RoHS compliance confirmed by the 'N' suffix in the MPN per Altera/Intel part-numbering convention. REACH compliance per manufacturer product page (no SVHCs declared above threshold). AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Lead-free terminal finish confirmed.
