EP1C12F256C6 - Cyclone FPGA, 12,060 LEs, 256-BGA | Intel
MPN: EP1C12F256C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $80.48 | $80.48 |
| 10 | $72.43 | $724.30 |
| 100 | $64.38 | $6,438.00 |
| 250 | $56.34 | $14,085.00 |
| 500 | $48.29 | $24,145.00 |
Drop-in alternatives for EP1C12F256C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C12F256C6N
✅ Drop-In✓ In Stock
$51.9 / Unit
View Datasheet →EP1C12F256C7N
✅ Drop-In✓ In Stock
$27.95 / Unit
View Datasheet →EP1C12F256C8N
✅ Drop-In✓ In Stock
$15.1 / Unit
View Datasheet →EP1C12F256I7
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →EP1C12F256I6
✅ Drop-In📋 Reference alternative (not in catalog)
EP1C12F256C6 Maximum Ratings & Electrical Characteristics
| Series | Cyclone I |
| Logic Elements | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Embedded RAM Bits | 239,616 bits (52 M4K blocks) |
| Embedded 18x18 Multipliers | 17 |
| Maximum User I/Os | 185 |
| PLLs | 2 |
| Process Technology | 130 nm SRAM, 1.5 V core |
| Package | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Operating Temperature | 0C to +85C (commercial, C6 speed grade) |
| Speed Grade | C6 (mid-tier) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI |
| LVDS Data Rate | Up to 640 Mbps |
| Mounting Type | Surface Mount (BGA) |
EP1C12F256C6 256-bga (fineline bga, 17x17 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1C12F256C6 (256-bga (fineline bga, 17x17 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C12F256C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12F256C6 is suitable for 6 applications: Industrial Control and Factory Automation, Telecommunications Line Cards, Video Processing and Image Capture, Consumer Electronics and Display Controllers, Automotive Infotainment Prototyping, ASIC Prototyping and Glue Logic Replacement.
Industrial Control and Factory Automation
The EP1C12F256C6 fits industrial automation because its 12,060 logic elements and 17 embedded 18x18 multipliers handle multi-axis motor control loops, encoder decoding, and fieldbus protocol bridging simultaneously. The 185 user I/Os accommodate multiple RS-485 ports, digital I/O banks, and PWM channels for servo drives, while two PLLs generate the precise clock trees required for CAN, EtherCAT, or Profibus interfaces. The commercial 0C to +85C operating range covers most factory-floor enclosures. Placing the EP1C12F256C6 between the MCU and the power-stage drivers, with 0.1 uF and 10 uF decoupling on every VCCINT/VCCIO pair, yields deterministic control latency that pure software solutions cannot match.
Recommended
Telecommunications Line Cards
The EP1C12F256C6 is well matched to telecom line cards because its 239,616 bits of embedded RAM implement channelized buffers and lookup tables for T1/E1 framers and DSL PHY interfaces. The 17 multipliers accelerate Reed-Solomon and Viterbi forward error correction, while the 256-FBGA package's 185 I/Os support LVDS links to upstream ASICs at up to 640 Mbps per the Cyclone I datasheet. Its 1.5 V core consumption keeps board thermal budgets manageable in densely populated line-card shelves. Pair the FPGA with an external PHY and use the two PLLs to derive independent clocks for transmit and receive paths without jitter accumulation.
Recommended
Video Processing and Image Capture
The EP1C12F256C6 suits video processing because its 12,060 logic elements and 17 multipliers can implement pipelined Sobel, FIR, and color-space conversion filters at VGA to 720p resolutions in real time. The 52 M4K memory blocks store line buffers and frame-grab FIFOs without external SRAM, reducing BOM cost on cost-sensitive cameras and display controllers. The 185 user I/Os drive parallel RGB or LVDS panel interfaces, and the device's JTAG and AS configuration paths enable in-field firmware updates. Place the FPGA downstream of the image sensor and upstream of the LCD controller, using one PLL to double the input pixel clock for internal processing pipelines.
Recommended
Consumer Electronics and Display Controllers
The EP1C12F256C6 is attractive for consumer display controllers because its 12,060 logic elements, 52 M4K RAM blocks, and 17 multipliers implement scalers, deinterlacers, and OSD compositors in a single chip. The 185 user I/Os accommodate HDMI bridge interfaces, LVDS panel links, and multiple I2C/SPI control buses. The 130 nm process and 1.5 V core deliver an attractive performance-per-watt ratio for thermally enclosed set-top boxes and digital photo frames. Use the two PLLs to generate independent pixel clocks for the input source and the output panel, with a 4-layer PCB stack-up to keep SSO noise below the LVDS eye-mask limits.
Recommended
Automotive Infotainment Prototyping
The EP1C12F256C6 enables rapid infotainment prototyping because its 12,060 LEs can emulate I2S audio routers, MOST bus bridges, and LVDS display backbones without waiting for an ASIC spin. The 17 hardware multipliers accelerate audio DSP and equalizer functions, while 185 I/Os interface to touch controllers, CAN transceivers, and rear-seat displays. The commercial temperature range is acceptable for cabin-mounted prototypes; production designs should migrate to AEC-Q100-qualified Cyclone IV or Cyclone 10 LP parts. Place the FPGA on a carrier board with 0.1 uF/10 uF decoupling pairs and a JTAG header for in-vehicle firmware iteration.
Recommended
ASIC Prototyping and Glue Logic Replacement
The EP1C12F256C6 is widely used for ASIC prototyping because its 12,060 logic elements, 52 M4K RAM blocks, and 17 multipliers provide enough capacity to host a full pre-silicon validation of mid-complexity ASIC RTL. Designers benefit from deterministic timing closure using Quartus II TimeQuest, plus abundant I/O for FPGA-to-ASIC co-emulation. Its 1.5 V core and 130 nm process are well characterized, and the 256-FBGA's 1.0 mm pitch works with standard via-in-pad PCB fabrication. Migrate to Cyclone IV or Cyclone 10 LP for new prototyping starts since Quartus II support ends at version 13.0 sp1 for Cyclone I.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12F256C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12F256C6N | EP1C12F256C7N | EP1C12F256C8N | EP1C12F256I7 | EP1C12F256I6 |
|---|---|---|---|---|---|---|
| Package | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-BGA - same | 256-BGA - same | 256-BGA - same | 256-BGA - same | 256-BGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C6 | C6 | C7 (~10% faster than C6) | C8 (~15% faster than C6) | I7 (faster, industrial) | I6 (industrial equivalent of C6) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| User I/Os | 185 | 185 | 185 | 185 | 185 | 185 |
| Lead-Free / RoHS | Yes (per 'C6' commercial ordering code) | Yes (N suffix confirms Pb-free) | Yes (N suffix) | Yes (N suffix) | [DATA_NEEDED] | [DATA_NEEDED] |
| Unit Price (qty 1, as of 2026-09-06) | $80.48 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Drop-in upgrade path to faster speed grades within the same package (vs EP1C12F256C8N)
- Industrial temperature variant available in identical package (vs EP1C12F256I7)
- Quartus II 13.0 sp1 toolchain compatibility across all variants (vs Cross-brand FPGA alternatives)
Design Notes
The 256-FBGA package with 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for reliable assembly and escape routing. Use a 4-layer stack-up with continuous ground and power planes directly beneath the BGA to minimize SSO noise and provide low-inductance returns for switching I/Os. Place 0.1 uF decoupling capacitors within 2 mm of every VCCINT and VCCIO ball pair, and add bulk 10 uF capacitors around the BGA perimeter for transient current support.
Cyclone I device support ends at Quartus II version 13.0 sp1 - newer Quartus versions do not include the Cyclone I device library and will refuse to compile. Pin the Quartus version in your design environment and document the toolchain dependency in your project README. When migrating to newer Cyclone families (Cyclone IV, Cyclone 10 LP), expect I/O bank voltage changes, configuration scheme differences, and updated PLL primitives that require RTL updates.
Although the 130 nm process is relatively cool, sustained high toggle rates on all 185 I/Os combined with high internal logic utilization can push junction temperature into the 90C+ range. Use the Quartus II PowerPlay Power Analyzer to estimate worst-case power, and place a thermal copper pour directly under the BGA's exposed pad region. For fully enclosed industrial enclosures, derate the clock frequency by 10-15% if ambient exceeds 70C.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page. The 'N' suffix variants (e.g., EP1C12F256C6N) explicitly confirm lead-free / Pb-free assembly. Not AEC-Q100 qualified - for automotive production, migrate to AEC-Q100-qualified Cyclone IV or Cyclone 10 LP families.
