EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
MPN: EP1C12F256C6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $63.4 | $6,340.00 |
| 500 | $56.8 | $28,400.00 |
| 1,000 | $51.9 | $51,900.00 |
Drop-in alternatives for EP1C12F256C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C12F256C8N
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View Datasheet →EP1C12F256C7N
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View Datasheet →EP1C12F256I7N
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View Datasheet →EP1C12F256I6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1C12F256C6AA
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View Datasheet →EP1C12F256C6
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View Datasheet →EP1C12F256C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone® |
| Logic Elements (LEs) | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Embedded Memory Bits | 239,616 bits |
| M4K RAM Blocks | 52 |
| Embedded 18x18 Multipliers | Yes |
| PLLs | 2 |
| Maximum User I/O | 185 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | 0.13 µm SRAM |
| Package | 256-ball FBGA (F256) |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Speed Grade | 6 |
| Configuration Method | Serial (EPCS) / JTAG |
| Mounting Type | Surface Mount (BGA) |
EP1C12F256C6N 256-ball fbga (f256) Pin Configuration Guide
Complete pinout information for EP1C12F256C6N (256-ball fbga (f256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C12F256C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12F256C6N is suitable for 6 applications: Industrial Control and Factory Automation, PCI Bus Bridge and Interface Cards, Low-Cost DSP Preprocessing, Display and Video Glue Logic, Communication Protocol Bridging, Education and Rapid Prototyping.
Industrial Control and Factory Automation
The EP1C12F256C6N fits industrial control boards where its 12,060 logic elements provide enough capacity for state-machine-based PLC logic, while 185 user I/O pins directly drive sensor inputs and actuator outputs. Its two PLLs generate the deterministic clocking required for motor-control PWM and fieldbus timing, and 239,616 bits of embedded RAM accommodate FIFO buffers between fieldbus (e.g., PROFIBUS, Modbus) and backplane interfaces. The 1.5 V core and 0.13 µm process keep typical power dissipation under 1 W at moderate toggle rates, eliminating the need for forced-air cooling in sealed enclosures.
Recommended
PCI Bus Bridge and Interface Cards
With PCI 33/66 MHz support via dedicated I/O standards, the EP1C12F256C6N is widely deployed in PCI add-in cards for legacy industrial PCs. Its 12,060 LEs comfortably implement a 32-bit PCI target with DMA engine and scatter-gather logic, and the 256-ball FBGA places all PCI signals on a single I/O bank for clean impedance matching. The device's 5 V-tolerant I/O (with external clamping) handles classic PCI signaling, while 52 M4K blocks provide the descriptor memory needed for high-throughput DMA transfers.
Recommended
Low-Cost DSP Preprocessing
The EP1C12F256C6N's dedicated 18×18 hardware multipliers and 52 M4K RAM blocks enable efficient FIR filter and FFT pipeline implementations without consuming general-purpose logic. At 100 MHz, a 32-tap FIR filter fits in roughly 500 LEs and 16 multipliers, leaving ample headroom for control logic and communication stacks. Compared to a software DSP, the FPGA delivers deterministic latency critical for motor control and real-time audio preprocessing, with the Quartus II DSP Builder accelerating algorithm-to-bitstream development.
Recommended
Display and Video Glue Logic
Consumer video applications leverage the EP1C12F256C6N for format conversion, de-interlacing, and timing generation between LCD panels and SoCs. The device's 185 user I/O pins support parallel RGB, LVDS, and DVI TMDS links, while its two PLLs synthesize the pixel clocks required for non-standard display timings. The 239,616 bits of embedded RAM act as a 2-line buffer for video scaling, and the Cyclone architecture's fast carry chain handles chroma interpolation at low cost.
Recommended
Communication Protocol Bridging
The EP1C12F256C6N serves as a low-latency bridge between legacy and modern serial interfaces, such as UART-to-Ethernet, I2C-to-SPI, or custom proprietary protocols. Its 12,060 LEs comfortably implement multiple UART cores alongside TCP/IP offload logic, while the 256-ball FBGA's 185 user I/Os handle multi-channel bridging without external muxing. The device's industrial temperature variant (EP1C12F256I7N) suits outdoor telecom and substation deployments where ambient temperatures exceed commercial limits.
Recommended
Education and Rapid Prototyping
Universities and design houses use the EP1C12F256C6N on Altera DE1 / DE2 development boards because its 12,060 LEs accommodate processor cores (NIOS II), peripherals, and student designs simultaneously. The mature Quartus II toolchain with free license and abundant reference designs lowers the learning curve, while the 256-ball FBGA exposes enough I/O for SDRAM, VGA, audio codec, and GPIO expansion. The part's long lifecycle in last-time-buy status means existing university labs can continue to source replacement parts for repair.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12F256C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12F256C8N | EP1C12F256C7N | EP1C12F256I7N | EP1C12F256I6N | EP1C12F256C6AA |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256) | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Speed Grade | 6 | 8 (slower) | 7 | 7 | 6 | 6 |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) |
| Embedded RAM (bits) | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O Pins | 185 | 185 | 185 | 185 | 185 | 185 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Mid-density Cyclone silicon (12,060 LEs) with mature toolchain (vs EP1C6Q240C8N (6,000 LEs))
- Fastest speed grade (C6) in the F256 commercial-temperature family (vs EP1C12F256C8N)
- Commercial temperature range suitable for indoor industrial use (vs EP1C12F256I7N)
Design Notes
The 256-ball FBGA package has a 1.0 mm ball pitch, which demands microvia or via-in-pad PCB technology for reliable assembly. Per Cyclone Device Handbook layout guidelines, use a 4 to 6 layer stack-up with continuous ground and power planes beneath the BGA, and route all decoupling capacitors on the top layer with short traces to the balls. Estimate: a 6-layer stack with 0.5 oz copper and 1.0 mm pitch requires ENIG surface finish and an 8-12 mil laser-drilled microvia.
The EP1C12F256C6N requires three power rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V per bank), and VCC_PLL (1.5 V analog PLL supply). Each PLL requires its own filtered analog supply with an RC filter (10 ohm + 1 uF) to minimize jitter. Bulk decoupling should include at least 100 uF tantalum and 10 uF ceramic per rail, with 0.1 uF and 0.01 uF ceramics placed within 100 mils of every VCC pin.
Do not apply VCCIO before VCCINT during power-up - this forward-biases the I/O ESD diodes and may damage the device. The Cyclone handbook mandates VCCINT ramp first, followed by VCCIO within 100 ms. Estimated: a typical inrush current of 1-2 A on VCCINT at 1.5 V requires a soft-start regulator or power sequencer (e.g., LTC2923). Always use an EPCS serial flash or JTAG programmer; modern Active Serial (AS) mode is recommended over passive serial for production.
Although the Cyclone family dissipates relatively little power (typically 0.3 to 1.5 W depending on toggle rate), the FBGA package has a theta-JA of approximately 15 C/W with adequate PCB copper. Estimate: at 1.0 W dissipation in a 25 C ambient, junction temperature rises 15 C to 40 C - well within the 85 C commercial limit. For sealed enclosures, derate toggle rate by 20-30% to maintain thermal margin.
Compliance Information
Compliance status not explicitly stated in the verified web data. Some Cyclone F256 variants include a Pb-free finish (e.g., EP1C12F256C6AA); check the part marking for specific finish. The part is not AEC-Q100 qualified; choose an automotive-grade Cyclone (e.g., EP1C12F256I7N-A) if required.
