EP1C12F324C8NGA - Cyclone FPGA, 12K LE, 324-BGA | Intel
MPN: EP1C12F324C8NGA ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.1 | $13,050.00 |
| 1,000 | $22.95 | $22,950.00 |
Drop-in alternatives for EP1C12F324C8NGA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1C12F324C8N
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View Datasheet →EP1C12F324C8NGA Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Family | Cyclone I (EP1C12) |
| Logic Elements (LE) | 12,060 |
| Total RAM Bits | 239,616 |
| Number of User I/O | 249 |
| Number of Logic Array Blocks (LAB) | 1,206 |
| Embedded 18x18 Multipliers | 52 |
| PLLs | 2 |
| Package | 324-BGA (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Speed Grade | 8 (commercial) |
| Operating Temperature | -40C to +85C (industrial) |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | 0.13 µm SRAM |
| Configuration Mode | Passive Serial (PS), Active Serial (AS), JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free) |
EP1C12F324C8NGA 324-bga (fineline bga, 19 x 19 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1C12F324C8NGA (324-bga (fineline bga, 19 x 19 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C12F324C8NGA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12F324C8NGA is suitable for 7 applications: Industrial Control and Factory Automation, Video Processing and Image Filtering, Digital Signal Processing Front-End, Communications Protocol Bridging, Consumer Electronics Display Controllers, Embedded System Glue Logic Replacement, Medical Device Interface and Signal Conditioning.
Industrial Control and Factory Automation
The EP1C12F324C8NGA fits industrial control because its 12,060 logic elements and 249 user I/O pins easily absorb PLC-style state machines, encoder counters, and parallel sensor arrays. The 52 embedded 18x18 multipliers support closed-loop PID and servo control math without offloading to a DSP. The industrial -40C to +85C operating range handles factory-floor ambient extremes. Designers typically implement EtherCAT or Modbus TCP bridges using the 2 PLLs to derive 100 MHz reference clocks. Unlike ASIC-based controllers, the Cyclone I can be reprogrammed in the field when process changes require updated logic.
Recommended
Video Processing and Image Filtering
The EP1C12F324C8NGA suits real-time video pipelines because 52 hardware 18x18 multipliers execute per-pixel FIR filters, color-space converters, and Sobel edge detection at VGA to 480p frame rates. The 239,616 bits of embedded SRAM accommodate line buffers for two or three scan lines at common resolutions. The 249 I/O pins accept parallel ITU-R BT.656 or RGB streams alongside control I2C channels. Compared with a software DSP solution, the FPGA achieves deterministic latency critical for video synchronization. For 720p or higher designs, migrate to Cyclone II or Cyclone III for additional memory bandwidth.
Recommended
Digital Signal Processing Front-End
The EP1C12F324C8NGA works well as a DSP front-end because its 52 18x18 multipliers deliver approximately 5.2 GMACs at 100 MHz, supporting FFT pre-processing, FIR decimation, and pulse compression in radar or sonar receivers. Two PLLs allow independent sampling-clock and processing-clock domains, simplifying ADC interface timing. The 12,060 logic elements implement custom state machines and DMA controllers alongside the DSP datapath. Compared with a discrete DSP, the FPGA offers tighter ADC-to-processor integration and parallel multi-channel capability.
Recommended
Communications Protocol Bridging
The EP1C12F324C8NGA bridges legacy and modern interfaces because its 249 user I/O and configurable I/O standards (LVDS, LVTTL, LVCMOS, SSTL) support custom parallel buses between UART, SPI, I2C, CAN, and proprietary protocols. The Cyclone I fabric implements hardware state machines for protocol conversion with deterministic timing, offloading the host processor. With 12,060 LEs, multiple bridges can coexist on a single device, reducing board area versus multiple bridge chips. The industrial temperature grade makes it suitable for outdoor telecom equipment.
Recommended
Consumer Electronics Display Controllers
The EP1C12F324C8NGA fits LCD or LED display controllers because 12K logic elements handle TCON timing generation, PWM backlight drivers, and OSD overlay. The 249 I/O drive multiple source-drive channels, while embedded RAM supports frame buffers for gamma correction. Two PLLs synthesize the pixel clock from a low-frequency reference, replacing multiple oscillator chips. The 1.0 mm-pitch BGA allows compact PCB designs suitable for monitor and TV main boards. Cyclone I cost points also suit consumer price-sensitive segments.
Recommended
Embedded System Glue Logic Replacement
The EP1C12F324C8NGA replaces discrete 74-series logic and CPLDs by integrating dozens of glue-logic functions, custom bus arbiters, and address-decoders in one device. Its 12K LEs are typically sufficient for full-system address mapping and interrupt controllers in MCU/MPU designs. The 324-BGA package consolidates many discrete packages, reducing BOM cost and PCB area. Reprogrammability supports late-stage design changes without board respins. Compared with CPLDs, the FPGA handles more complex sequential logic and wider bus widths.
Recommended
Medical Device Interface and Signal Conditioning
The EP1C12F324C8NGA is used in medical instrumentation interfaces because its multipliers and RAM enable digital filtering of ECG, SpO2, or patient-monitoring signals before MCU processing. The 52 multipliers implement real-time FIR/IIR filters while 239,616 bits of RAM store intermediate samples. The industrial temperature grade suits equipment operating in controlled clinical environments, and the BGA package supports compact patient-monitor form factors. Compared with analog filter chains, the FPGA delivers repeatable digital filters with tunable coefficients.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12F324C8NGA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12F324C8N | EP1C12F324C8 | EP1C12F324C8L | EP1C20F324C8N | EP1C12F324C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-BGA (F324) | 324-BGA (F324) - same | 324-BGA (F324) - same | 324-BGA (F324) - same | 324-BGA (F324) - same | 324-BGA (F324) - same |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 20,060 (+66%) | 12,060 |
| User I/O | 249 | 249 | 249 | 249 | 249 | 249 |
| Embedded RAM (bits) | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| Embedded 18x18 Multipliers | 52 | 52 | 52 | 52 | 52 | 52 |
| Speed Grade | 8 | 8 | 8 | 8 | 8 | 7 (faster) |
| Operating Temperature | -40C to +85C | -40C to +85C | [DATA_NEEDED] | [DATA_NEEDED] | -40C to +85C | -40C to +85C |
| Ball Finish | NiPdAu (lead-free) | SnPb | Standard | Lead-free | SnPb | SnPb |
Key Differentiators
- Lead-free NiPdAu BGA finish (vs EP1C12F324C8N)
- Pin-to-pin compatible with 20K LE upgrade (vs EP1C20F324C8N)
- Same silicon as industrial-temperature I7N variant (vs EP1C12F324I7N)
Design Notes
The EP1C12F324C8NGA requires three supply rails: VCCINT (1.5 V core, up to ~500 mA depending on utilization), VCCIO (1.5/1.8/2.5/3.3 V per bank), and VCC_PLL (1.5 V analog PLL supply). Decouple each VCCINT ball with a 0.1 µF X7R ceramic and one bulk 100 µF tantalum per device; place the 0.1 µF within 3 mm of the package. VCC_PLL must be filtered with a ferrite bead and 10 µF + 0.1 µF to minimize jitter. Estimated: at full utilization with all 249 I/O switching, VCCINT may reach ~600 mA.
The 324-BGA FineLine package uses a 1.0 mm pitch, which requires 0.5 mm via-pad and microvia stack-up on 4-6 layer boards. All signal escapes should use via-in-pad or dog-bone fan-out; keep all power and ground vias within 0.5 mm of their respective BGA balls. Ground plane should be unbroken under the BGA to provide return-path integrity for high-speed signals.
Do not leave JTAG pins floating - tie TMS, TCK, and TDI through 10 kΩ pull-ups to VCCIO of bank 3, or the device may enter unintended boundary-scan states during power-up. Do not drive configuration pins before VCCINT ramps to 1.5 V. Always sequence power supplies as VCCINT first, then VCCIO, then drive I/O. Failure to do so can cause high-current latch-up. Source: Cyclone Device Handbook configuration chapter.
Estimated: At 1.5 V core and 600 mA, VCCINT dissipation is ~0.9 W; total device dissipation including I/O switching can reach 1.5 W in worst-case utilization. The F324 BGA thermal resistance θJA is approximately 16 C/W with 0 m/s airflow, so junction temperature rise is ~24C above ambient. For enclosed industrial enclosures with 70C ambient, junction remains below 100C - acceptable. Provide thermal vias under the BGA to inner ground planes for improved heat spreading.
Compliance Information
The 'GA' suffix denotes NiPdAu lead-free BGA ball finish, which is RoHS compliant per Intel/Altera Cyclone device ordering information. Industrial temperature range -40C to +85C. Halogen-free status and conflict-minerals declaration are not stated in the verified web data; check Intel product compliance declarations for authoritative status.
