EP1C12F324C7N - Cyclone 12,060 LEs FPGA 324-BGA | Intel / Altera
MPN: EP1C12F324C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $58.22 | $58.22 |
| 10 | $52.4 | $524.00 |
| 100 | $46.5 | $4,650.00 |
| 250 | $41.85 | $10,462.50 |
| 500 | $37.2 | $18,600.00 |
Drop-in alternatives for EP1C12F324C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1C12F324I7N
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View Datasheet →EP1C12F324C8N
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View Datasheet →EP1C12F324C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Family | Cyclone I |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Embedded Memory (bits) | 239,616 |
| Maximum User I/O | 249 |
| Number of PLLs | 2 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Operating Supply Voltage | 1.5 V to 3.3 V |
| Maximum Internal Frequency | 320 MHz |
| Speed Grade | C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C) |
| Package / Case | 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration Method | AS / PS / JTAG |
| RoHS Status | Compliant (N suffix = lead-free) |
EP1C12F324C7N 324-bga (fbga-324, 19 x 19 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1C12F324C7N (324-bga (fbga-324, 19 x 19 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C12F324C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12F324C7N is suitable for 6 applications: Industrial Motor Control Glue Logic, Video Processing and Display Bridging, Telecom Line-Card Glue Logic, Prototype ASIC Replacement, Industrial Sensor Aggregation Hub, Legacy Replacement and Field Spares.
Industrial Motor Control Glue Logic
The EP1C12F324C7N's 12,060 logic elements and 249 user I/O pins make it a strong fit for industrial motor control boards where it acts as glue logic between a microcontroller, gate drivers, and encoder feedback. Two on-chip PLLs generate the precise PWM-aligned clocks needed for multi-axis servo loops, while 239 Kbits of embedded M4K blocks buffer encoder quadrature counters and PWM duty tables without external SRAM. The 324-FBGA package supports enough parallel I/O to handle Hall-sensor inputs, multi-axis step/direction outputs, and CAN or RS-485 transceivers simultaneously. Designers typically place the EP1C12F324C7N between a 32-bit MCU and the power stage, offloading deterministic timing from the MCU and reducing overall firmware complexity.
Recommended
Video Processing and Display Bridging
With 249 user I/Os and 12,060 LEs, the EP1C12F324C7N can implement mid-complexity video pipelines such as DVI/HDMI-to-LVDS bridges, dual-camera muxing, or video format conversion at rates up to 720p. Embedded M4K blocks serve as line buffers for deinterlacing or chroma resampling, while the dual PLLs generate pixel clocks and shift clocks for parallel RGB or LVDS output. The Cyclone-I fabric supports DDR transfer from external SDRAM at rates sufficient for moving 720p60 pixel data. Reference designs from Altera / Intel show typical implementations pairing this device with a TI DVI receiver and a National Semiconductor LVDS transmitter for monitor-side bridging.
Recommended
Telecom Line-Card Glue Logic
The EP1C12F324C7N suits telecom line cards where it implements TDM bus aggregation, framer-to-network-processor interfaces, and clock-domain crossing between system and line-side PLLs. Its two PLLs handle independent system and line-rate clock generation, while 239 Kbits of RAM buffer packet headers and lookup tables for small forwarding engines. The 249 user I/Os accommodate multi-PHY serial LVDS connections plus control-plane GPIO for SFP modules and supervisory LEDs. Industrial-temperature screening (via EP1C12F324I7N) is often required for outdoor cabinets.
Recommended
Prototype ASIC Replacement
Engineers commonly use the EP1C12F324C7N to prototype a fixed ASIC function while preserving the option to migrate to a lower-cost masked device once volumes rise. With 12,060 LEs it can implement mid-sized datapaths, custom state machines, and glue logic sufficient for many ASIC emulation tasks. The 324-FBGA package gives abundant I/O for ASIC-equivalent pin counts, and Quartus II synthesis provides rapid iteration. Once the design stabilizes, designers can either retain the FPGA for low-volume production or migrate to a hardened ASIC.
Recommended
Industrial Sensor Aggregation Hub
The 249 user I/Os make the EP1C12F324C7N well-suited for aggregating many industrial sensors - thermocouples, strain gauges, encoder quadrature, and digital GPIO - into a single fast bus such as SPI, parallel LVDS, or Ethernet. Embedded M4K blocks store calibration coefficients and run-length-encoded sensor data. The two PLLs generate sample clocks for the sensor front ends. Reference designs use this device paired with 24-bit ADCs and a host MCU running Modbus or EtherCAT.
Recommended
Legacy Replacement and Field Spares
Because the EP1C12F324C7N is now obsolete, OEMs maintaining deployed systems need either authorized last-time-buy stock or verified drop-in alternatives. The EP1C12F324I7N provides identical functionality in the same 324-FBGA footprint, just with industrial temperature support, making it ideal for field-spare pools covering harsher environments. Sourcing through authorized obsolete-part specialists (Heisener, TrustedParts, FPGAX) ensures traceability and conformance for aerospace and defense sustainment programs.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12F324C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12F324I7N | EP1C12F324C8N | EP1C12F324C6N | EP1C12F324C6AA | EP1C12F324C7 |
|---|---|---|---|---|---|---|
| Package | 324-BGA (FBGA-324, 19x19 mm) | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| LABs | 1,206 | 1,206 | 1,206 | 1,206 | 1,206 | 1,206 |
| Speed Grade | C7 | I7 (industrial temp, same C7 fMAX bin) | C8 (faster) | C6 (slower) | C6 (military screened) | C7 (non-lead-free) |
| Operating Temperature | Commercial (0C to 85C) | Industrial (-40C to +100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Military / aerospace screened | Commercial (0C to 85C) |
| Lead-Free / RoHS | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (no N suffix, lead-bearing) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Maximum User I/O | 249 | 249 | 249 | 249 | 249 | 249 |
Key Differentiators
- Industrial temperature coverage for harsh environments (vs EP1C12F324C7N)
- Faster speed grade for higher fMAX requirements (vs EP1C12F324C7N)
- Military / aerospace screening for high-reliability programs (vs EP1C12F324C7N)
Design Notes
Estimated: the EP1C12F324C7N uses a 324-ball FBGA with 1.0 mm pitch. PCB escape routing requires via-in-pad (VIPPO) or dogbone fan-out. A 6-layer stackup is recommended for clean ground/return paths and to support DDR SDRAM interfaces. Place 0.1 uF decoupling capacitors on every power pin pair (VCCINT, VCCIO) within 3 mm of the package, plus bulk 100 uF tantalum or ceramic capacitors on the 1.5 V and 3.3 V rails. Use a 6- or 8-layer board for designs routing 100+ differential pairs.
Do not confuse the C7 speed grade with the commercial temperature grade - both letters encode different specs. Speed grade 'C7' refers to a specific timing bin, while temperature grade 'C' (in 'C7') means commercial and 'I' (in 'I7') means industrial. Double-check both letters when sourcing substitutes. Also note that some Cyclone-I configuration schemes (especially AS mode) require an external EPCS or EPCQ flash, which must be ordered separately.
Keep LVDS / SSTL differential pairs matched within 0.5 mm of each other across the entire length. Use 100 ohm differential impedance on the PCB stackup and place series-termination resistors as close to the FPGA output balls as possible. For DDR SDRAM interfaces, use 50 ohm single-ended impedance with matched trace lengths (within 25 mils) for byte groups. Add a series 33 ohm resistor on the FPGA clock output to dampen reflections.
Compliance Information
N suffix indicates lead-free / RoHS-compliant package per Altera / Intel nomenclature. AEC-Q100 is not applicable to FPGAs. Halogen-free status not stated in available data.
