EP1C20F324I7N - Cyclone FPGA 20K LE, 324-BGA, Industrial | Intel
MPN: EP1C20F324I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $63.8 | $6,380.00 |
| 250 | $58.4 | $14,600.00 |
| 500 | $53.1 | $26,550.00 |
Drop-in alternatives for EP1C20F324I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1C20F324I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone (first generation) |
| Logic Elements | 20,060 LE |
| Embedded Memory | 294,912 bits (288 kbit) |
| Maximum User I/Os | 233 |
| Number of Logic Array Blocks (LABs) | 20060 (per Cyclone Family datasheet) |
| Embedded Multipliers | 26 (18x18) |
| PLLs | 4 |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per I/O bank) |
| Process Technology | 0.13 µm CMOS |
| Maximum Internal Frequency | 320 MHz |
| Package | 324-pin FineLine BGA (FBGA-324), 19 × 19 mm, 1.0 mm pitch |
| Operating Temperature | -40 °C to +100 °C (industrial) |
| Speed/Grade Code | I7 (-40 °C to +100 °C, industrial speed grade 7) |
| Configuration | Serial/parallel via EPCS or JTAG (IEEE 1149.1) |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Lead-free; halogen-free per device datasheet |
EP1C20F324I7N 324-pin fineline bga (fbga-324), 19 × 19 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1C20F324I7N (324-pin fineline bga (fbga-324), 19 × 19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C20F324I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C20F324I7N is suitable for 6 applications: Industrial Motor Control, Video Image Processing and Capture, Communication Protocol Bridging, Low-Cost ASIC Prototyping, Legacy Equipment Maintenance and Repair, Educational and Development Platforms.
Industrial Motor Control
The EP1C20F324I7N is well suited to industrial motor-control and drive-interface designs thanks to its 20,060 logic elements, four PLLs, and 26 embedded 18×18 multipliers that can implement field-oriented control (FOC) loops, PID controllers, and PWM generation. Industrial temperature operation (-40 °C to +100 °C, I7 grade) supports deployment in factory-floor and outdoor enclosures. The 233 user I/Os enable direct connection to multi-axis encoder feedback and gate-driver signals without external muxing.
Recommended
Video Image Processing and Capture
The 288 kbit of embedded M4K memory and 26 multipliers make EP1C20F324I7N a strong fit for video pipeline blocks such as color-space conversion, scaling, and simple edge detection running on parallel ITU-R BT.656 or VGA inputs. The 320 MHz internal clock supports real-time processing at common video rates (NTSC/PAL). Multiple I/O banks at 3.3 V and 1.8 V allow direct interface to image sensors and external SDRAM frame buffers.
Recommended
Communication Protocol Bridging
The EP1C20F324I7N's 20K logic elements and 233 I/Os allow multi-protocol bridging between UART, SPI, I2C, parallel, and custom industrial buses in a single device. The four PLLs provide independent clock domains for each interface, eliminating the need for external clock buffers. Industrial temperature operation supports building automation, substation gateways, and railway signaling equipment where protocol translation is required.
Recommended
Low-Cost ASIC Prototyping
The EP1C20F324I7N's 20,060 logic elements provide enough capacity to prototype mid-complexity ASICs for validation before tape-out, while the FBGA-324 footprint supports a wide range of I/O pin-out assignments. Engineers can re-spin logic in minutes using Quartus II and the JTAG-based program/erase flow, dramatically shortening verification cycles. The Cyclone family is widely supported by synthesis tools and IP libraries, accelerating time-to-prototype.
Recommended
Legacy Equipment Maintenance and Repair
Hundreds of thousands of deployed systems built 2005-2015 use EP1C20F324I7N for I/O expansion, glue logic, and timing control. NRND status has tightened supply, but the part remains in active distribution for sustainment programs in railway signaling, factory automation, military communications, and aerospace test equipment. Long-term authorized stockists with date-code verification support MRO requirements for these legacy platforms.
Recommended
Educational and Development Platforms
University digital-logic and embedded-systems courses continue to use EP1C20F324I7N-equipped Altera/Intel development boards because the device delivers meaningful 20K-LE capacity at low per-board cost. Quartus II Web Edition remains a free design entry point, and the JTAG-based program/erase cycle supports fast student iteration cycles. Industrial temperature grade also allows teaching labs to deploy boards into outdoor robotics projects.
Recommended
Recommended Products Summary
Engineering reference data for EP1C20F324I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C20F324I7 | EP1C20F324C8N | EP1C20F324C7N | EP1C20F324C6N | EP1C12F324I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-324 | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same |
| Logic Elements | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 12,060 LE (-40%) |
| Embedded Memory | 288 kbit | 288 kbit | 288 kbit | 288 kbit | 288 kbit | 239,616 bits (~239 kbit) |
| Temperature Range | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) |
| Speed Grade | 7 (industrial) | 7 (industrial) | 8 (commercial, faster) | 7 (commercial) | 6 (commercial, slower) | 7 (industrial) |
| Maximum User I/Os | 233 | 233 | 233 | 233 | 233 | 233 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Same-package lower-cost Cyclone I density variant (vs EP1C12F324I7N)
- Industrial temperature grade for harsh environments (vs EP1C20F324C8N)
- Higher speed grade than slower commercial options (vs EP1C20F324C6N)
Design Notes
EP1C20F324I7N requires 1.5 V on VCCINT and 1.5/1.8/2.5/3.3 V on VCCIO pins. Place one 0.1 µF ceramic decoupling capacitor adjacent to every VCCINT pin and a 10 µF bulk capacitor per VCCIO bank. Estimated: with 1.5 V core at typical 20K-LE utilization, core current draw can reach 0.5-1 A during configuration; ensure the 1.5 V regulator supplies at least 1.5 A peak with low-noise LDO such as the TI TPS7A4701 for clean PLL operation.
The FBGA-324 has 1.0 mm ball pitch on a 19 × 19 mm body. Use a 4-layer or 6-layer PCB with 0.5 oz copper on outer layers and 1 oz on inner power planes. Place 8-10 micro vias in the central thermal array to a dedicated inner ground plane. Estimated: with all four PLL banks active and 50% logic utilization, junction-to-ambient thermal resistance (θJA) is approximately 18 °C/W on a JEDEC 4-layer test board; derate outputs if ambient exceeds 70 °C.
First-generation Cyclone FPGAs require configuration at every power-up because the configuration RAM is volatile. Always include an EPCS1 or EPCS4 serial configuration device on the board, or plan for JTAG-only configuration via ByteBlaster II / USB-Blaster. Forgetting the configuration device is the single most common board bring-up failure. Also note that the device does not support single-voltage supply operation; 2.5 V or 3.3 V only will not power the core.
The 233 user I/Os include DDR-compatible output structures, but signal-integrity constraints apply above 100 MHz. Source-synchronous interfaces (DDR, LVDS-style) require 100 Ω differential routing and matched pair lengths within 50 mils. Use the Quartus II pin planner to assign I/O pins per bank voltage and to verify SSN (simultaneous switching noise) budget. Place reference-voltage pins (VREF) with 0.1 µF + 1 µF decoupling when using SSTL or HSTL I/O standards.
Compliance Information
RoHS compliance and lead-free terminal finish indicated by the "N" suffix in the MPN per Altera/Intel marking convention. JEDEC J-STD-020 MSL rating per package outline; refer to device-specific packing label for exact MSL level.
