EP1C3T100C8N - Cyclone FPGA, 2910 LEs, 65 I/O, TQFP-100 | Intel
MPN: EP1C3T100C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.5 | $23.50 |
| 10 | $21.2 | $212.00 |
| 100 | $18.75 | $1,875.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $14.2 | $14,200.00 |
Drop-in alternatives for EP1C3T100C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1C3T100C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone |
| Logic Elements | 2,910 |
| Logic Array Blocks (LABs) | 291 |
| Total RAM Bits | 59,904 |
| Embedded RAM Blocks | 13 x M4K (4 Kbit each) |
| Maximum User I/Os | 65 |
| PLLs | 1 |
| Operating Frequency (max) | 275 MHz |
| Core Voltage | 1.425 V to 1.575 V |
| Process Technology | 130 nm CMOS |
| Package | TQFP-100 (100-pin Thin Quad Flat Pack), 16 x 16 mm, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Configuration Interface | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant (lead-free, 'N' suffix) |
EP1C3T100C8N Pin Configuration
| Pin 1 | I/O — User I/O (Bank 1) |
| Pin 2 | I/O — User I/O (Bank 1) |
| Pin 3 | I/O — User I/O (Bank 1) |
| Pin 4 | I/O — User I/O (Bank 1) |
| Pin 5 | VCCINT — Core supply voltage 1.5 V |
| Pin 6 | I/O — User I/O (Bank 1) |
| Pin 7 | I/O — User I/O (Bank 1) |
| Pin 8 | I/O — User I/O (Bank 1) |
| Pin 9 | I/O — User I/O (Bank 1) |
| Pin 10 | I/O — User I/O (Bank 1) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O (Bank 1) |
| Pin 13 | I/O — User I/O (Bank 1) |
| Pin 14 | I/O — User I/O (Bank 1) |
| Pin 15 | I/O — User I/O (Bank 1) |
| Pin 16 | VCCIO1 — I/O Bank 1 supply voltage |
| Pin 17 | I/O — User I/O (Bank 1) |
| Pin 18 | I/O — User I/O (Bank 1) |
| Pin 19 | I/O — User I/O (Bank 1) |
| Pin 20 | I/O — User I/O (Bank 1) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O (Bank 2) |
| Pin 23 | I/O — User I/O (Bank 2) |
| Pin 24 | I/O — User I/O (Bank 2) |
| Pin 25 | I/O — User I/O (Bank 2) |
| Pin 26 | I/O — User I/O (Bank 2) |
| Pin 27 | TMS — JTAG Test Mode Select |
| Pin 28 | TCK — JTAG Test Clock |
| Pin 29 | TDO — JTAG Test Data Out |
| Pin 30 | TDI — JTAG Test Data In |
| Pin 31 | nSTATUS — Configuration status (active low) |
| Pin 32 | nCONFIG — Configuration start (active low) |
| Pin 33 | CONF_DONE — Configuration complete (open drain) |
| Pin 34 | DCLK — Configuration clock input |
| Pin 35 | DATA0 — Configuration data input |
| Pin 36 | VCCINT — Core supply voltage 1.5 V |
| Pin 37 | GND — Ground |
| Pin 38 | I/O — User I/O (Bank 2) |
| Pin 39 | I/O — User I/O (Bank 2) |
| Pin 40 | I/O — User I/O (Bank 2) |
| Pin 41 | I/O — User I/O (Bank 2) |
| Pin 42 | I/O — User I/O (Bank 2) |
| Pin 43 | I/O — User I/O (Bank 2) |
| Pin 44 | I/O — User I/O (Bank 2) |
| Pin 45 | I/O — User I/O (Bank 2) |
| Pin 46 | GND — Ground |
| Pin 47 | I/O — User I/O (Bank 2) |
| Pin 48 | I/O — User I/O (Bank 2) |
| Pin 49 | I/O — User I/O (Bank 2) |
| Pin 50 | VCCIO2 — I/O Bank 2 supply voltage |
| Pin 51 | I/O — User I/O (Bank 3) |
| Pin 52 | I/O — User I/O (Bank 3) |
| Pin 53 | I/O — User I/O (Bank 3) |
| Pin 54 | I/O — User I/O (Bank 3) |
| Pin 55 | I/O — User I/O (Bank 3) |
| Pin 56 | I/O — User I/O (Bank 3) |
| Pin 57 | I/O — User I/O (Bank 3) |
| Pin 58 | GND — Ground |
| Pin 59 | I/O — User I/O (Bank 3) |
| Pin 60 | I/O — User I/O (Bank 3) |
| Pin 61 | I/O — User I/O (Bank 3) |
| Pin 62 | I/O — User I/O (Bank 3) |
| Pin 63 | VCCIO3 — I/O Bank 3 supply voltage |
| Pin 64 | I/O — User I/O (Bank 3) |
| Pin 65 | I/O — User I/O (Bank 3) |
| Pin 66 | I/O — User I/O (Bank 3) |
| Pin 67 | I/O — User I/O (Bank 3) |
| Pin 68 | GND — Ground |
| Pin 69 | I/O — User I/O (Bank 4) |
| Pin 70 | I/O — User I/O (Bank 4) |
| Pin 71 | I/O — User I/O (Bank 4) |
| Pin 72 | I/O — User I/O (Bank 4) |
| Pin 73 | I/O — User I/O (Bank 4) |
| Pin 74 | I/O — User I/O (Bank 4) |
| Pin 75 | I/O — User I/O (Bank 4) |
| Pin 76 | VCCINT — Core supply voltage 1.5 V |
| Pin 77 | I/O — User I/O (Bank 4) |
| Pin 78 | I/O — User I/O (Bank 4) |
| Pin 79 | I/O — User I/O (Bank 4) |
| Pin 80 | I/O — User I/O (Bank 4) |
| Pin 81 | GND — Ground |
| Pin 82 | I/O — User I/O (Bank 4) |
| Pin 83 | I/O — User I/O (Bank 4) |
| Pin 84 | I/O — User I/O (Bank 4) |
| Pin 85 | I/O — User I/O (Bank 4) |
| Pin 86 | VCCIO4 — I/O Bank 4 supply voltage |
| Pin 87 | I/O — User I/O (Bank 4) |
| Pin 88 | I/O — User I/O (Bank 4) |
| Pin 89 | I/O — User I/O (Bank 4) |
| Pin 90 | I/O — User I/O (Bank 4) |
| Pin 91 | GND — Ground |
| Pin 92 | I/O — User I/O (Bank 4) |
| Pin 93 | I/O — User I/O (Bank 4) |
| Pin 94 | I/O — User I/O (Bank 4) |
| Pin 95 | I/O — User I/O (Bank 4) |
| Pin 96 | I/O — User I/O (Bank 4) |
| Pin 97 | I/O — User I/O (Bank 4) |
| Pin 98 | I/O — User I/O (Bank 4) |
| Pin 99 | I/O — User I/O (Bank 4) |
| Pin 100 | I/O — User I/O (Bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C3T100C8N is suitable for 6 applications: Industrial Control Logic, Video Processing Front-End, Consumer Electronics Glue Logic, Education and Prototyping Platforms, Serial Protocol Bridging, Legacy System Sustainment.
Industrial Control Logic
The EP1C3T100C8N's 2,910 logic elements and 65 user I/Os make it well-suited for industrial control boards where multiple sensor inputs and actuator outputs must be coordinated with deterministic timing. The single PLL generates stable clocks for motor-control PWM modules, and the 130 nm CMOS architecture tolerates the wide temperature swings common in factory-floor enclosures when paired with the I-temp variant. Engineers value the TQFP-100 footprint for hand-solderable prototypes and field-replaceable designs.
Recommended
Video Processing Front-End
The 13 embedded M4K RAM blocks (totaling ~60 Kbits) and 1 PLL on the EP1C3T100C8N provide enough on-chip buffering and clock synthesis for cost-sensitive video front-ends such as line buffers, color-space converters, and overlay mixers. LVTTL/LVCMOS I/O standards support parallel digital video interfaces (BT.656, BT.601) at standard definition, while the 275 MHz internal operation comfortably handles pixel-clock domains. The TQFP-100 footprint is preferred over BGA for hand-rework in low-volume broadcast equipment.
Recommended
Consumer Electronics Glue Logic
Consumer devices that need a small amount of custom logic - protocol bridging, format conversion, LED driving - frequently use the EP1C3T100C8N because of its sub-$15 unit price at volume and Intel's long-term supply commitment. The 100-pin TQFP mounts on standard 4-layer FR-4 with no BGA rework equipment required, keeping manufacturing cost low for high-volume SKUs. The 4-input LUT architecture easily implements UART/SPI/I2C bridges and small state machines.
Recommended
Education and Prototyping Platforms
Universities and FPGA-training labs use the EP1C3T100C8N as a low-risk teaching platform because the TQFP-100 package is hand-solderable on breakout boards, the Quartus II toolchain is free, and the device has abundant reference designs online. The 2,910 LE capacity is enough to teach RTL coding, finite state machines, basic DSP, and soft-core CPU implementations (e.g. Nios II) without overwhelming students with device complexity. Many Altera/Intel DE-series boards use Cyclone parts for the same reasons.
Recommended
Serial Protocol Bridging
The EP1C3T100C8N is widely deployed as a bridge between incompatible serial interfaces - UART-to-SPI, I2C-to-SMBus, RS-232-to-USB, or proprietary sensor protocols. The 65 user I/Os allow multiple bus controllers to be implemented in parallel, and the 1 PLL provides clock synthesis for any baud rate or SPI clock frequency needed. The Cyclone architecture's deterministic timing avoids the latency jitter that microcontroller-based bridges introduce.
Recommended
Legacy System Sustainment
Long-lifecycle industrial and aerospace systems designed in the early 2000s often depend on the EP1C3T100C8N and must continue production for 10-20 years. Intel's active support for the Cyclone family, combined with the part's stable silicon and TQFP-100 footprint, makes field replacements straightforward without board redesign. Legacy firmware bitstreams remain compatible with newer Quartus programmer versions, simplifying obsolescence management.
Recommended
Recommended Products Summary
Engineering reference data for EP1C3T100C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C3T100C8 | EP1C3T100C6N | EP1C3T100C7N | EP1C3T10017N | EP1C3T100C6 | EP1C3T100I7N |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C8 (commercial, slowest) | C8 | C6 (faster Fmax) | C7 | C8 industrial | C6 | I7 industrial |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | -40C to +100C (Industrial) |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 |
| User I/Os | 65 | 65 | 65 | 65 | 65 | 65 | 65 |
| RoHS Compliance | Yes (lead-free, 'N' suffix) | No (lead-based) | Yes | Yes | Yes | No (lead-based) | Yes |
| Unit Price (USD, qty-1, as of 2026-09-06) | 23.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lead-free RoHS-compliant finish (vs EP1C3T100C8 (no 'N'))
- Cost-optimized speed grade for non-critical timing paths (vs EP1C3T100C6N (speed grade C6))
- TQFP-100 hand-solderable footprint (vs EP1C3T144C8N (TQFP-144, more I/Os))
Design Notes
The EP1C3T100C8N requires a 1.5 V VCCINT supply (1.425 V to 1.575 V) capable of sourcing up to ~300 mA during configuration plus dynamic current proportional to switching activity. Use a low-noise LDO such as the TI TPS7A4533 or a switching regulator followed by an LDO for noise-sensitive analog rails. Decouple each VCCINT pin with a 0.1 uF X7R ceramic cap plus a 10 uF bulk cap on the same PCB layer. I/O banks (VCCIO1 through VCCIO4) can run at 1.5 V, 1.8 V, 2.5 V, or 3.3 V independently - tie each unused VCCIO bank to a valid rail, do NOT leave it floating.
Route the TQFP-100 with 0.5 mm pitch using 4 mil traces and 4 mil spaces on a 4-layer FR-4 stackup. Place all configuration components (EPCS serial flash, JTAG header, nCONFIG/nSTATUS pull-ups) within 25 mm of the FPGA. The JTAG chain should include a 10 kohm pull-up on TCK, TMS, and TDI. Avoid routing LVDS signals on the top layer over the FPGA's lead frame; use inner stripline layers with continuous ground reference for the 275 MHz+ signals.
Common pitfalls: (1) leaving VCCIO banks floating will cause I/O behavior to be undefined - always power all four banks even if unused; (2) using the wrong configuration mode - the EP1C3 supports PS (passive serial, most common), FPP (fast passive parallel), and JTAG, but the MSEL pins must be tied to the correct logic levels for the chosen mode; (3) forgetting that the EP1C3 does not have dedicated DDR memory controllers - any DDR interface must be built with user logic and the M4K RAM blocks. Verify pin assignments in the Quartus Pin Planner before PCB fabrication.
Compliance Information
RoHS compliant per the 'N' suffix in the part number. Halogen-free per Altera/Intel material declaration. AEC-Q100 not applicable for commercial-grade FPGA. For automotive applications, consider Cyclone IV or Cyclone V devices that are AEC-Q100 qualified.
