EP1C3T100I7N - Cyclone I FPGA, 2910 LE, 100-TQFP | Intel
MPN: EP1C3T100I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $21.03 | $21.03 |
| 10 | $19.87 | $198.70 |
| 100 | $17.92 | $1,792.00 |
| 500 | $15.4 | $7,700.00 |
| 1,000 | $13.85 | $13,850.00 |
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View Datasheet →EP1C3T100I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone I |
| Family | EP1C3 |
| Logic Elements (LE) | 2,910 |
| Logic Array Blocks (LAB) | 291 |
| Total RAM Bits | 59,904 |
| Embedded RAM Blocks (M4K) | 13 |
| Embedded 18x18 Multipliers | 13 |
| PLLs | 1 |
| User I/Os | 65 |
| Package | 100-TQFP (T100) |
| Process Technology | 0.13 µm SRAM |
| Core Voltage | 1.5 V |
| Operating Temperature (I grade) | -40 °C to +100 °C |
| Speed Grade | 7 |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, PCI |
| Mounting Type | Surface Mount |
| RoHS Status | Non-compliant (Pb-containing package, per DigiKey listing) |
EP1C3T100I7N 100-tqfp (t100) Pin Configuration Guide
Complete pinout information for EP1C3T100I7N (100-tqfp (t100) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C3T100I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C3T100I7N is suitable for 6 applications: Industrial Control Glue Logic, Consumer Video Processing, I/O Expansion and Bus Bridging, Digital Signal Processing Front-End, Communications Protocol Conversion, Legacy Production Replacement.
Industrial Control Glue Logic
The EP1C3T100I7N is well suited to industrial control glue logic because its 2,910 logic elements, 13 hardware 18×18 multipliers, and 65 user I/Os provide ample capacity to interface microcontrollers with motor drivers, sensors, and display panels. Its industrial temperature grade (-40 °C to +100 °C) tolerates factory-floor environments while the 100-TQFP package remains hand-reworkable for prototype builds. Engineers typically instantiate UART, SPI, and PWM bridges in the fabric, and use the on-chip PLL to derive motor-control clocks from a single 50 MHz crystal. Compared with discrete 74-series glue logic, the FPGA reduces board area and BOM count while preserving firmware-free deterministic timing.
Recommended
Consumer Video Processing
For consumer video processing the EP1C3T100I7N offers 13 hardware multipliers and M4K RAM blocks that implement FIR filters, color-space converters, and de-interlacers at standard-definition pixel rates (27 MHz). The 65 user I/Os accommodate parallel RGB or ITU-R BT.656 video buses plus I2C control channels, while the on-chip PLL multiplies the 27 MHz reference to pixel-clock derivatives needed for scaling and frame-rate conversion. Designers commonly buffer active video lines in the 59,904 bits of embedded RAM, allowing frame-comb filtering at low latency. The industrial temperature grade supports enclosed set-top box and A/V receiver environments without additional cooling.
Recommended
I/O Expansion and Bus Bridging
When a microcontroller lacks sufficient UART, SPI, I2C, or GPIO lines, the EP1C3T100I7N serves as a flexible I/O expansion and bus-bridging device. The 65 user I/Os support multiple voltage standards including LVTTL, LVCMOS, SSTL, and 3.3 V PCI, allowing direct connection to legacy 5 V-tolerant buses through external resistors. The Cyclone I fabric runs custom bridge cores at 100 MHz+ system clock while JTAG-based configuration simplifies firmware updates during development. Typical bridges include SPI-to-I2C, UART-to-parallel GPIO, and CAN-to-UART conversions. The 100-TQFP footprint keeps PCB cost low and supports 4-layer FR4 stack-ups without microvia technology.
Recommended
Digital Signal Processing Front-End
The EP1C3T100I7N's 13 dedicated 18×18 multipliers enable DSP front-end implementations such as FIR filters, Goertzel DFT bins, and audio mixers without consuming logic-element resources for soft multiplication. Each M4K block provides 4 Kbits of true dual-port memory, which is ideal for sample buffering and coefficient storage. With 59,904 bits of total embedded RAM, the device can hold several hundred audio samples or a small FFT working buffer. The single PLL generates audio-rate clocks (44.1 / 48 kHz and derivatives) from a system reference. Typical implementations include 16-bit audio EQ stages and motor-current PI controllers sampled at 20 kHz.
Recommended
Communications Protocol Conversion
The EP1C3T100I7N supports up to 65 user I/Os at multiple voltage standards and can implement multiple communications protocols concurrently, making it well suited to multi-protocol gateway and conversion applications. Engineers commonly instantiate UART, SPI, I2C, RS-485, and CAN cores in parallel, then use the on-chip PLL to derive independent baud-rate clocks. The 2,910 logic elements fit a typical 4-channel UART plus SPI master and slave bridge at 50 MHz system clock. The device's industrial temperature range and JTAG-based debug support simplify field validation in telecom and building-automation installations.
Recommended
Legacy Production Replacement
The EP1C3T100I7N remains in active demand as a long-term production component for legacy designs whose PCBs cannot be redesigned. Because the part shares the 100-TQFP footprint with the rest of the EP1C3 family, multiple speed and temperature variants are pin-compatible and qualify as drop-in replacements. Industrial and military customers rely on the EP1C3T100I7N to sustain end-of-life products that must continue shipping for 5 to 10 additional years. The independent distribution channel currently holds over 100,000 pieces across multiple lots, supporting planned-obsolescence mitigation strategies that prioritise functional continuity over feature upgrades.
Recommended
Recommended Products Summary
Engineering reference data for EP1C3T100I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C3T100I7 | EP1C3T100C8N | EP1C3T100C7N | EP1C3T100C6N | EP1C3T100C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-TQFP | 100-TQFP (same) | 100-TQFP (same) | 100-TQFP (same) | 100-TQFP (same) | 100-TQFP (same) |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 |
| User I/Os | 65 | 65 | 65 | 65 | 65 | 65 |
| Temperature Grade | Industrial (-40 to +100 °C) | Industrial (-40 to +100 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) |
| Speed Grade | 7 | 7 | 8 (slower) | 7 | 6 (faster) | 8 (slower) |
| Pb-Free Finish (N suffix) | Yes (N suffix, Pb-free) | No (SnPb finish) | Yes (N suffix, Pb-free) | Yes (N suffix, Pb-free) | Yes (N suffix, Pb-free) | No (SnPb finish) |
| Lifecycle Status | EOL (December 2024) | EOL | EOL | EOL | EOL | EOL |
| Distributor Price (USD, qty 1) | 21.03 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Pin-compatible family with multiple temperature/speed grades (vs EP1C3T100C8N)
- Pb-free N finish suitable for RoHS-compliant production (vs EP1C3T100I7)
- Fastest speed grade within 100-TQFP industrial variants (vs EP1C3T100I8N (if it existed in same finish))
- Drop-in compatibility preserves PCB layout investment (vs EP4CE6E22 (Cyclone IV))
Design Notes
Cyclone I EP1C3T100I7N requires a 1.5 V core supply and a 3.3 V I/O supply; both rails must ramp monotonically within the datasheet-specified tRAMP window to avoid high inrush current during power-on. Decouple VCCINT with one 100 µF bulk + ten 0.1 µF ceramics distributed across the package, and VCCIO with one 47 µF bulk + four 0.1 µF ceramics per I/O bank. Estimated: with 65 I/Os switching at 50 MHz and 10 pF external load, dynamic current on VCCIO can exceed 200 mA per bank.
Place the 50 MHz reference crystal within 200 mil of the CLK0 pin and route on an inner layer with ground shielding on both sides to minimise reference jitter. JTAG chain pins (TCK, TMS, TDI, TDO) must each have a 10 kΩ pull-up to VCCIO of bank 1 to prevent spurious configuration during board bring-up. The nCONFIG line should be pulled up to 3.3 V through 4.7 kΩ; do not leave it floating. Estimated trace length mismatch of CLK0 to CLK1 should be held below 50 mil for clean PLL lock.
Do not assume the EP1C3T100I7N can be migrated pin-for-pin to a Cyclone IV EP4CE6 - the packages differ (100-TQFP vs 144-TQFP/256-BGA). Verify MSEL pin settings against the chosen configuration mode; incorrect MSEL values cause the device to fail configuration silently. The 100-TQFP is non-trivial to rework; budget 90 seconds at 260 °C peak reflow profile. Avoid I/O standards above 3.3 V because the Cyclone I I/O banks are not 5 V-tolerant even when VCCIO is set to 3.3 V; use external level shifters for 5 V signals.
Estimated: at maximum utilisation (2,910 LE at 80% toggle rate, all 13 multipliers active, 65 I/Os at 25 MHz) the EP1C3T100I7N dissipates approximately 0.6 W, well within the 100-TQFP θJA of 32 °C/W and not requiring a heatsink. For sealed enclosures without airflow, derate utilisation to 70% to maintain junction below 100 °C. Industrial-temperature variants are specified to +100 °C ambient but Tj must remain below +125 °C absolute maximum.
Compliance Information
Pb-free finish per N suffix but DigiKey listing indicates the 100-TQFP package is not RoHS-compliant due to Pb-containing die-attach or terminal plating per Cyclone I datasheet device family addendum. REACH compliance not explicitly stated in retrieved web data. AEC-Q100 not applicable (industrial-grade FPGA, not automotive qualified). Lead-free finish confirmed by N suffix. Halogen-free and conflict-mineral status not disclosed in retrieved data.
