EP1C4F324C8 - Cyclone FPGA 4000 Cells, 249 I/O, 324-FBGA | Intel
MPN: EP1C4F324C8 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $65.4 | $6,540.00 |
| 500 | $58.9 | $29,450.00 |
| 1,000 | $52.75 | $52,750.00 |
Drop-in alternatives for EP1C4F324C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C4F324C8N
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EP1C4F324C7N
✅ Drop-In✓ In Stock
$25.75 / Unit
View Datasheet →EP1C4F324C6N
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →EP1C4F324C7
✅ Drop-In✓ In Stock
$46.8 / Unit
View Datasheet →EP1C4F324C6
✅ Drop-In✓ In Stock
$16.75 / Unit
View Datasheet →EP1C4F324C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone |
| Logic Elements | 4,000 |
| Logic Blocks (LEs / LABs) | 4000 cells / 249 LABs |
| Total RAM Bits | 78,336 bits |
| User I/Os | 249 |
| Maximum Internal Frequency | 405.2 MHz |
| Speed Grade | C8 (commercial, speed grade 8) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Package | FBGA-324, 19 mm x 19 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (0 C to +85 C) |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| Embedded Multipliers | 18 x 18 hardware multipliers |
| Clock Management | PLLs integrated |
| RoHS Status | Compliant (per Alldatasheet package description) |
EP1C4F324C8 fbga-324, 19 mm x 19 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1C4F324C8 (fbga-324, 19 mm x 19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C4F324C8.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C4F324C8 is suitable for 6 applications: Industrial Motor Control, Video Bridge and Display Controller, Telecommunications Line Card Glue Logic, Embedded Controller and Glue Logic Consolidation, Digital Signal Processing Front-End, Prototyping and Education Platform.
Industrial Motor Control
The EP1C4F324C8's 4,000 logic elements and 249 user I/Os in a 324-FBGA package make it a strong fit for multi-axis industrial motor control boards that need to consolidate PWM generation, encoder decoding, and fieldbus glue logic in one device. With 18 x 18 hardware multipliers and embedded M4K RAM blocks, the Cyclone device can host closed-loop control loops at several kHz update rates while leaving headroom for safety and diagnostics. The 1.5 V core and commercial temperature range fit cabinet-mounted industrial environments.
Recommended
Video Bridge and Display Controller
With 4,000 logic elements, dedicated 18 x 18 multipliers, and 249 user I/Os, the EP1C4F324C8 is well-suited to bridge legacy video formats (BT.656, VGA, LVDS) to modern flat-panel interfaces in industrial and medical displays. The 324-FBGA package exposes enough pins for parallel RGB, LVDS pairs, and control I2C/SPI buses without multiplexing. The Cyclone PLL block generates pixel clocks at common video rates, while M4K memory blocks serve as line buffers and color lookup tables.
Recommended
Telecommunications Line Card Glue Logic
The EP1C4F324C8 is a proven solution for telecom line-card glue logic, where its 249 user I/Os and 324-FBGA footprint can address multiple E1/T1 framers, UARTs, and bus-conversion interfaces in a single device. The 1.5 V core, combined with flexible I/O voltage standards (LVTTL, LVCMOS, HSTL, SSTL) supported by Cyclone, makes it compatible with legacy 3.3 V and modern 1.8 V ASICs on the same board. JTAG-based in-system programmability eases board bring-up and field upgrades.
Recommended
Embedded Controller and Glue Logic Consolidation
Designers use the EP1C4F324C8 to replace multiple 74-series glue-logic packages, CPLDs, and small bus-conversion ASICs with a single programmable device, reducing PCB area and BOM cost. With 4,000 LEs and 78,336 RAM bits, the Cyclone FPGA can implement custom register interfaces, address decoding, bus bridges (e.g., ISA to local bus), and timing generators. The 249 user I/Os accommodate address, data, and control signals for 8/16/32-bit external buses.
Recommended
Digital Signal Processing Front-End
The EP1C4F324C8's 18 x 18 hardware multipliers and M4K RAM blocks enable implementation of FIR filters, FFT engines, and digital downconverters at modest sample rates in DSP front-end subsystems. At the C8 speed grade, the 405 MHz internal frequency supports 100+ MHz DSP pipelines for audio and baseband processing. The 324-FBGA package provides enough I/O for parallel ADC/DAC interfaces and serial LVDS data links.
Recommended
Prototyping and Education Platform
Universities and engineering labs use the EP1C4F324C8 on Cyclone development boards as a platform for teaching digital design, RTL synthesis, and embedded systems. The 4,000-LE capacity is large enough for student projects including RISC-V soft cores, video processing pipelines, and custom peripherals, but small enough to fit within Quartus II Web Edition's free license. The 324-FBGA package exposes abundant I/O for breadboard-friendly daughtercards.
Recommended
Recommended Products Summary
Engineering reference data for EP1C4F324C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C4F324C8N | EP1C4F324C7N | EP1C4F324C6N | EP1C4F324C7 | EP1C4F324C6 |
|---|---|---|---|---|---|---|
| Package | FBGA-324, 19x19 mm, 1.0 mm pitch | FBGA-324, 19x19 mm, 1.0 mm pitch (same) | FBGA-324, 19x19 mm, 1.0 mm pitch (same) | FBGA-324, 19x19 mm, 1.0 mm pitch (same) | FBGA-324, 19x19 mm, 1.0 mm pitch (same) | FBGA-324, 19x19 mm, 1.0 mm pitch (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Total RAM Bits | 78,336 | 78,336 | 78,336 | 78,336 | 78,336 | 78,336 |
| User I/Os | 249 | 249 | 249 | 249 | 249 | 249 |
| Speed Grade | C8 (commercial, slowest) | C8 | C7 (faster) | C6 (faster still) | C7 (faster) | C6 (faster still) |
| Lead-Free (Pb-Free) | Not specified (assumed SnPb or Pb-free per variant) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | No (standard SnPb) | No (standard SnPb) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
Key Differentiators
- Slowest C8 commercial speed grade enables broadest sourcing at lowest cost (vs EP1C4F324C6N)
- Drop-in compatibility with the entire EP1C4F324 speed-grade and lead-free family (vs EP1C4F324C8N, EP1C4F324C7N, EP1C4F324C6N)
- Mid-density Cyclone device with abundant I/O for bridging and glue logic (vs EP1C3T144C8N)
Design Notes
The EP1C4F324C8 core operates at 1.5 V and requires multiple supply rails (VCCINT for core, VCCIO for I/O banks, VCCAUX for auxiliary). Place 0.1 uF and 10 uF decoupling capacitors as close as possible to each supply pin pair per the Cyclone Family Data Sheet power distribution guidelines. Estimated quiescent current at room temperature is on the order of tens of mA for the core and rises with toggle rate; use the Quartus II PowerPlay analyzer to model actual dissipation for your design.
The 324-FBGA package uses a 1.0 mm ball pitch, which is at the practical limit of standard SMT processes. Per IPC-7351, use NSMD (non-solder mask defined) land pads with a diameter approximately 0.5 mm and via-in-pad or microvia fan-out for breakout. Staggered via patterns are recommended for inner rows. PCB fabrication must target the manufacturer's specified coplanarity and flatness tolerances to avoid head-in-pillow or open-joint defects during reflow.
Configure all unused I/O pins through software attributes (e.g., 'tri-stated with weak pull-up' or 'grounded') rather than leaving them floating, which can cause excessive supply current and I/O contention. The C8 speed grade is the slowest commercial grade in the Cyclone family; do not assume timing closure at 250 MHz+ without choosing C7 or C6. When migrating between EP1C4F324C8, EP1C4F324C7N, and EP1C4F324C6N, only the speed grade bin differs - no firmware or pinout changes are required.
Compliance Information
RoHS compliance per Alldatasheet package description (LEAD FREE). REACH status assumed compliant based on Intel/Altera product family policy; specific test report not in verified data. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free and conflict-minerals status: not in verified data.
