EP1C6T144C8AA - Cyclone FPGA, 6K LEs, 144-LQFP | Intel
MPN: EP1C6T144C8AA ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.9 | $339.00 |
| 100 | $29.2 | $2,920.00 |
| 500 | $25.75 | $12,875.00 |
| 1,000 | $22.4 | $22,400.00 |
Drop-in alternatives for EP1C6T144C8AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1C6T144C8AA Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Family | Cyclone (original) |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Number of Logic Array Blocks (LABs) | 598 |
| Number of M4K RAM Blocks (4 Kbit each) | 20 |
| User I/O Pins | 98 |
| PLLs | 2 |
| Package | 144-LQFP (TQFP), 20 mm × 20 mm, 0.4 mm pitch |
| Pin Count | 144 |
| Speed Grade | 8 (slowest commercial) |
| Suffix AA | Lead-free, industrial temperature grade |
| Operating Temperature (junction) | -40 °C to +100 °C |
| Supply Voltage (Core) | 1.5 V |
| Configuration Modes | AS, PS, JTAG |
| I/O Standards | LVTTL, LVCMOS, SSTL, PCI, LVDS |
| Process Technology | 0.13 µm SRAM |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free AA suffix) |
| MSL Level | 3 (168 hours, per AIChipLink listing) |
EP1C6T144C8AA Pin Configuration
| Pin 1 | I/O (Bank 1) — User I/O; dual-purpose configuration pin |
| Pin 2 | I/O (Bank 1) — User I/O |
| Pin 3 | I/O (Bank 1) — User I/O |
| Pin 4 | I/O (Bank 1) — User I/O |
| Pin 5 | VCCIO1 — I/O bank 1 supply |
| Pin 6 | I/O (Bank 1) — User I/O |
| Pin 7 | I/O (Bank 1) — User I/O |
| Pin 8 | GND — Ground |
| Pin 9 | I/O (Bank 1) — User I/O |
| Pin 10 | I/O (Bank 1) — User I/O |
| Pin 11 | I/O (Bank 1) — User I/O |
| Pin 12 | VCCINT — Core supply (1.5 V) |
| Pin 13 | I/O (Bank 1) — User I/O |
| Pin 14 | I/O (Bank 1) — User I/O |
| Pin 15 | I/O (Bank 1) — User I/O |
| Pin 16 | GND — Ground |
| Pin 17 | I/O (Bank 1) — User I/O |
| Pin 18 | I/O (Bank 1) — User I/O |
| Pin 19 | I/O (Bank 1) — User I/O |
| Pin 20 | VCCIO1 — I/O bank 1 supply |
| Pin 21 | I/O (Bank 1) — User I/O |
| Pin 22 | I/O (Bank 1) — User I/O |
| Pin 23 | I/O (Bank 1) — User I/O |
| Pin 24 | I/O (Bank 1) — User I/O |
| Pin 25 | I/O (Bank 1) — User I/O |
| Pin 26 | I/O (Bank 1) — User I/O |
| Pin 27 | I/O (Bank 1) — User I/O |
| Pin 28 | GND — Ground |
| Pin 29 | I/O (Bank 1) — User I/O |
| Pin 30 | I/O (Bank 1) — User I/O |
| Pin 31 | VCCIO1 — I/O bank 1 supply |
| Pin 32 | I/O (Bank 1) — User I/O |
| Pin 33 | I/O (Bank 1) — User I/O |
| Pin 34 | I/O (Bank 1) — User I/O |
| Pin 35 | I/O (Bank 1) — User I/O |
| Pin 36 | I/O (Bank 1) — User I/O |
| Pin 37 | VCCINT — Core supply (1.5 V) |
| Pin 38 | I/O (Bank 2) — User I/O |
| Pin 39 | I/O (Bank 2) — User I/O |
| Pin 40 | I/O (Bank 2) — User I/O |
| Pin 41 | GND — Ground |
| Pin 42 | I/O (Bank 2) — User I/O |
| Pin 43 | I/O (Bank 2) — User I/O |
| Pin 44 | VCCIO2 — I/O bank 2 supply |
| Pin 45 | I/O (Bank 2) — User I/O |
| Pin 46 | I/O (Bank 2) — User I/O |
| Pin 47 | I/O (Bank 2) — User I/O |
| Pin 48 | I/O (Bank 2) — User I/O |
| Pin 49 | GND — Ground |
| Pin 50 | I/O (Bank 2) — User I/O |
| Pin 51 | I/O (Bank 2) — User I/O |
| Pin 52 | I/O (Bank 2) — User I/O |
| Pin 53 | VCCIO2 — I/O bank 2 supply |
| Pin 54 | I/O (Bank 2) — User I/O |
| Pin 55 | I/O (Bank 2) — User I/O |
| Pin 56 | I/O (Bank 2) — User I/O |
| Pin 57 | I/O (Bank 2) — User I/O |
| Pin 58 | VCCINT — Core supply (1.5 V) |
| Pin 59 | I/O (Bank 2) — User I/O |
| Pin 60 | I/O (Bank 2) — User I/O |
| Pin 61 | I/O (Bank 2) — User I/O |
| Pin 62 | GND — Ground |
| Pin 63 | I/O (Bank 2) — User I/O |
| Pin 64 | I/O (Bank 2) — User I/O |
| Pin 65 | I/O (Bank 2) — User I/O |
| Pin 66 | VCCIO2 — I/O bank 2 supply |
| Pin 67 | I/O (Bank 2) — User I/O |
| Pin 68 | I/O (Bank 2) — User I/O |
| Pin 69 | I/O (Bank 2) — User I/O |
| Pin 70 | I/O (Bank 2) — User I/O |
| Pin 71 | GND — Ground |
| Pin 72 | I/O (Bank 2) — User I/O |
| Pin 73 | I/O (Bank 3) — User I/O |
| Pin 74 | VCCIO3 — I/O bank 3 supply |
| Pin 75 | I/O (Bank 3) — User I/O |
| Pin 76 | I/O (Bank 3) — User I/O |
| Pin 77 | I/O (Bank 3) — User I/O |
| Pin 78 | VCCINT — Core supply (1.5 V) |
| Pin 79 | I/O (Bank 3) — User I/O |
| Pin 80 | I/O (Bank 3) — User I/O |
| Pin 81 | I/O (Bank 3) — User I/O |
| Pin 82 | GND — Ground |
| Pin 83 | I/O (Bank 3) — User I/O |
| Pin 84 | I/O (Bank 3) — User I/O |
| Pin 85 | I/O (Bank 3) — User I/O |
| Pin 86 | VCCIO3 — I/O bank 3 supply |
| Pin 87 | I/O (Bank 3) — User I/O |
| Pin 88 | I/O (Bank 3) — User I/O |
| Pin 89 | I/O (Bank 3) — User I/O |
| Pin 90 | I/O (Bank 3) — User I/O |
| Pin 91 | GND — Ground |
| Pin 92 | I/O (Bank 3) — User I/O |
| Pin 93 | I/O (Bank 3) — User I/O |
| Pin 94 | VCCIO3 — I/O bank 3 supply |
| Pin 95 | I/O (Bank 3) — User I/O |
| Pin 96 | I/O (Bank 3) — User I/O |
| Pin 97 | I/O (Bank 3) — User I/O |
| Pin 98 | I/O (Bank 3) — User I/O |
| Pin 99 | VCCINT — Core supply (1.5 V) |
| Pin 100 | I/O (Bank 3) — User I/O |
| Pin 101 | I/O (Bank 3) — User I/O |
| Pin 102 | I/O (Bank 3) — User I/O |
| Pin 103 | GND — Ground |
| Pin 104 | I/O (Bank 3) — User I/O |
| Pin 105 | I/O (Bank 3) — User I/O |
| Pin 106 | I/O (Bank 3) — User I/O |
| Pin 107 | VCCIO3 — I/O bank 3 supply |
| Pin 108 | I/O (Bank 3) — User I/O |
| Pin 109 | VCCINT — Core supply (1.5 V) |
| Pin 110 | I/O (Bank 4) — User I/O |
| Pin 111 | I/O (Bank 4) — User I/O |
| Pin 112 | I/O (Bank 4) — User I/O |
| Pin 113 | GND — Ground |
| Pin 114 | I/O (Bank 4) — User I/O |
| Pin 115 | I/O (Bank 4) — User I/O |
| Pin 116 | VCCIO4 — I/O bank 4 supply |
| Pin 117 | I/O (Bank 4) — User I/O |
| Pin 118 | I/O (Bank 4) — User I/O |
| Pin 119 | I/O (Bank 4) — User I/O |
| Pin 120 | I/O (Bank 4) — User I/O |
| Pin 121 | GND — Ground |
| Pin 122 | I/O (Bank 4) — User I/O |
| Pin 123 | I/O (Bank 4) — User I/O |
| Pin 124 | VCCIO4 — I/O bank 4 supply |
| Pin 125 | I/O (Bank 4) — User I/O |
| Pin 126 | I/O (Bank 4) — User I/O |
| Pin 127 | I/O (Bank 4) — User I/O |
| Pin 128 | I/O (Bank 4) — User I/O |
| Pin 129 | VCCINT — Core supply (1.5 V) |
| Pin 130 | I/O (Bank 4) — User I/O |
| Pin 131 | I/O (Bank 4) — User I/O |
| Pin 132 | I/O (Bank 4) — User I/O |
| Pin 133 | GND — Ground |
| Pin 134 | nCONFIG — Configuration start (active-low) |
| Pin 135 | nSTATUS — Configuration status (active-low) |
| Pin 136 | CONF_DONE — Configuration complete (open-drain) |
| Pin 137 | DCLK — Configuration clock |
| Pin 138 | MSEL0 — Configuration mode select |
| Pin 139 | MSEL1 — Configuration mode select |
| Pin 140 | TDI — JTAG test data in |
| Pin 141 | TMS — JTAG test mode select |
| Pin 142 | TCK — JTAG test clock |
| Pin 143 | TDO — JTAG test data out |
| Pin 144 | VCCIO4 — I/O bank 4 supply (also JTAG bank) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C6T144C8AA is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Image-Sensor Interface Bridging, Legacy Telecom Backplane and Bus Bridging, Low-Cost ASIC Prototyping, Consumer Display Controllers and LCD Adapters, Test and Measurement Front-End Logic.
Industrial Motor Control and Factory Automation
The EP1C6T144C8AA's 5,980 logic elements and two PLLs make it well-suited to industrial motor control front-ends, where the device performs PWM generation, encoder decoding, and field-oriented control glue logic. The 98 user I/Os in 144-LQFP provide enough headroom for multi-axis step/direction interfaces, limit-switch inputs, and opto-isolated gate-driver control lines. Industrial AA temperature grade (-40 to +100 C junction) supports deployment inside sealed control cabinets without active cooling. Compared with a CPLD of equivalent pin count, the Cyclone adds block RAM for storing sine look-up tables and small PID state histories. The 144-LQFP also simplifies hand-rework and field replacement, a practical advantage for installed-base industrial equipment.
Recommended
Video Image-Sensor Interface Bridging
The EP1C6T144C8AA is frequently used as a bridge between parallel CMOS image sensors and downstream processors in industrial cameras, scanners, and machine-vision systems. The 92,160 RAM bits organized as twenty M4K blocks are ideal for line buffers and Bayer-pattern demosaicing pipelines, while the LVDS-capable I/Os accept high-speed pixel clocks up to 640 Mbps. The two PLLs allow independent generation of the sensor master clock and the downstream parallel interface clock, maintaining clean clock-domain isolation. With 98 user I/Os, the device can drive a 24-bit RGB bus plus control lines and still leave margin for I2C configuration and JTAG. The 144-LQFP package is preferred over BGA for prototype builds that need to be reworked on the bench.
Recommended
Legacy Telecom Backplane and Bus Bridging
Telecom backplanes often require glue logic between asynchronous serial links (T1/E1, RS-485, SPI, I2C) and backplane fabrics such as H.110 or proprietary parallel buses. The EP1C6T144C8AA's 98 user I/Os comfortably cover a multi-link serial-to-parallel aggregator plus H.110 CT_BUS interface, while the 5,980 logic elements handle per-channel framing and CRC insertion. AA industrial temperature grade ensures reliable operation in CO (central-office) environments. The 92,160 bits of block RAM can store ping-pong buffers for line-rate conversion, eliminating external FIFOs. Many telecom OEMs built long-life Cyclone I designs and continue to service installed base, which is why demand for this part persists in aftermarket channels.
Recommended
Low-Cost ASIC Prototyping
Designers routinely map mid-complexity ASICs onto the EP1C6T144C8AA for pre-silicon validation and firmware bring-up. The 5,980 logic elements, 92,160 RAM bits, and dual PLLs cover many sub-100K-gate ASIC RTL designs, while the SRAM-based configuration enables rapid design iteration via JTAG. Industrial temperature grade allows the prototype board to be deployed in the actual end-product environment for accelerated life testing. The 144-LQFP package is also cost-effective for prototype runs of a few hundred units. Quartus II 13.0sp1 supports incremental compilation and the SOPC Builder flow, enabling team-based prototyping of heterogeneous subsystems.
Recommended
Consumer Display Controllers and LCD Adapters
The EP1C6T144C8AA is widely deployed as a low-cost display-format converter for legacy consumer electronics, medical monitors, and kiosk displays. Its LVDS-capable I/Os drive up to XGA resolution panels, while the block RAM provides line buffers for frame-rate conversion and scaling. Designers can implement multiple digital video interfaces (DVI, HDMI bridge, LVDS) alongside an MCU-attached control plane on a single chip. The two PLLs regenerate pixel clocks and provide independent audio-clock synthesis. Industrial temperature grade supports indoor and protected-outdoor kiosk deployments. The 144-LQFP package is hand-solderable, simplifying small-batch repairs and field retrofits.
Recommended
Test and Measurement Front-End Logic
Bench-top and modular instruments frequently use the EP1C6T144C8AA as a flexible digital-front-end between sensors and a DSP or host CPU. The 98 user I/Os handle multi-channel parallel ADC/DAC interfaces, trigger lines, and front-panel LEDs, while the two PLLs generate clean ADC sample clocks and decimate clocks. Industrial temperature grade supports lab and light-industrial environments. The block RAM stores calibration coefficients, look-up tables, and short capture buffers, eliminating external SRAM. The 144-LQFP package is convenient for instrument firmware engineers who need direct access to JTAG and configuration pins during development and re-spin cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP1C6T144C8AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C6T144C8N | EP1C6T144C7N | EP1C6T144C6N | EP1C6T144I7N | EP1C6Q240C8N | EP1C6F256C8N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 240-PQFP - larger, not footprint-compatible | 256-FBGA - not footprint-compatible |
| Brand | Intel | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Logic Elements | 5,980 | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical die) | 5,980 (identical die) |
| Total RAM Bits | 92,160 | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical die) | 92,160 (identical die) |
| User I/O Pins | 98 | 98 (identical) | 98 (identical) | 98 (identical) | 98 (identical) | 185 (more I/O, larger package) | 185 (more I/O, BGA package) |
| Speed Grade | 8 (slowest) | 8 (identical) | 7 (~12% Fmax improvement) | 6 (fastest Cyclone I bin, ~25% Fmax improvement) | 7 (industrial) | 8 (identical speed) | 8 (identical speed) |
| Temperature Grade | Industrial (-40 to +100 C junction) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| PLLs | 2 | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical die) | 2 (identical die) |
| Footprint-Compatibility with 144-LQFP | Yes (this part) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | No (different package) | No (BGA package) |
| Lifecycle Status (as of 2026-09-06) | Last-time-buy | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) |
Key Differentiators
- Industrial temperature grade in a Cyclone I 144-LQFP (vs EP1C6T144C8N)
- Slower speed grade (8) with full industrial rating (vs EP1C6T144I7N)
- Drop-in compatible with all EP1C6T144 variants (vs EP1C3T144C8 / EP1C12Q240C8N)
Design Notes
Estimated: at 25 °C ambient, full 98-I/O utilization, 100 MHz core clock, the EP1C6T144C8AA typically consumes 200-300 mA from VCCINT (1.5 V) plus per-bank VCCIO current. Estimated Icc_int = 250 mA, VCCINT power = 0.375 W. Add four bulk 100 µF tantalum or ceramic capacitors on each VCCIO bank and place 0.1 µF + 0.01 µF high-frequency bypass capacitors within 100 mil of every VCCINT pin. Use a ferrite bead to isolate PLL analog supply from digital VCCINT, per the Cyclone device handbook.
144-LQFP at 0.4 mm pitch requires 0.2 mm trace width and 0.2 mm clearance for fanout. Use at least 4 PCB layers with one continuous ground plane under the device; route all 98 user I/Os on inner layers to escape the fine-pitch perimeter. Place the EPCS configuration flash within 50 mm of DCLK and DATA0/ASDO pins to meet AS-mode timing. JTAG chain (TCK/TMS/TDO/TDI) must be kept short and daisy-chained with 4.7 kΩ pull-ups on TCK/TMS as recommended in the Cyclone handbook.
Cyclone I family is configured by a 1.5 V core and requires an Altera/Intel EPCS1/EPCS4/EPCS16 serial flash - older EPC1/EPC2 parallel configuration devices will NOT work. Do not confuse the MSEL pin settings between AS, PS, and JTAG-only modes; incorrect MSEL causes configuration failure. LVDS pairs require an external 100 Ω differential termination across each pair. Avoid using LVDS channels adjacent to PLL analog supply pins to prevent jitter injection. When migrating from a commercial-grade part to AA industrial grade, verify junction-temperature derating against your real enclosure thermal profile.
Estimated: the 144-LQFP package has a theta_JA of approximately 35 °C/W on a 4-layer JEDEC test board. At typical 0.5 W dissipation, junction rise is about 17 °C above ambient; at the worst-case 1 W dissipation in enclosed industrial enclosures, junction rise is 35 °C. Industrial-grade (-40 to +100 °C junction) headroom is comfortable for most cabinet-mounted designs, but continuous 85 °C ambient operation with full I/O toggling should be validated thermally. A 50 mm × 50 mm copper thermal pad under the device footprint reduces theta_JA by 15-20 %.
Compliance Information
AA suffix indicates lead-free finish; part is RoHS and REACH compliant per Intel/Altera Cyclone family documentation. Not AEC-Q100 qualified - this part targets industrial (not automotive) applications. Original Cyclone I family is in last-time-buy; Intel recommends migration to Cyclone IV or Cyclone 10 LP for new designs.