EP1K10FC256-2N - 10K Gate ACEX-1K FPGA 576 LE 256-BGA | Intel / Altera
MPN: EP1K10FC256-2N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.48 | $23.48 |
| 10 | $19.96 | $199.60 |
| 100 | $13.95 | $1,395.00 |
| 500 | $8.5 | $4,250.00 |
| 1,000 | $5.62 | $5,620.00 |
EP1K10FC256-2N Overview
What is a FPGA? A Field-Programmable Gate Array is a semiconductor device based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> high-density SRAM-based FPGAs. Unlike fixed-function ASICs, FPGAs can be reconfigured in-system to implement custom digital logic, glue logic, signal processing pipelines, and bus interfaces, making them ideal for prototyping and low-to-mid volume production.
Key features of the EP1K10FC256-2N include 0.5 ns pin-to-pin logic delay, built-in dual-port RAM, support for the Altera MAX+PLUS II and Quartus design flows, and a 2.375 V to 2.625 V core supply. The 256-ball FineLine BGA package provides high I/O density for memory-rich and bus-interface designs, while the commercial 0 °C to 70 °C operating range suits bench instrumentation, communications glue logic, and industrial control boards.
The ACEX-1K architecture uses an embedded array of Enhanced Logic Elements (ELEs) interleaved with embedded array blocks (EABs) that implement dedicated dual-port RAM and ROM. This hybrid fabric lets designers place megafunctions such as FIFOs, CAMs, multipliers, and DSP blocks in silicon-efficient EABs while reserving LUTs for random logic, yielding better performance-per-area than pure 4-input LUT FPGAs of the same era.
Typical applications include glue logic for legacy microprocessor buses, peripheral controllers (UART, SPI, I2C bridges), low-speed digital signal processing front-ends, prototyping platforms, and industrial communication bridges. The 136 available user I/Os also make the EP1K10FC256-2N a practical fit for memory-interface bridging, where the 12 Kbits of embedded RAM act as a small cache or FIFO between two clock domains.
When designing with this device, plan power sequencing carefully because the 2.5 V core must ramp monotonically while I/O banks can be powered at 3.3 V to remain LVTTL/LVCMOS-compatible. Decoupling requires 0.1 µF high-frequency capacitors placed within 5 mm of every supply pin, plus bulk capacitance on each supply plane to manage in-rush during configuration.
This page synthesizes distributor pricing, drop-in ACEX-1K family alternatives, and practical design notes not found in the original manufacturer datasheet.
Drop-in alternatives for EP1K10FC256-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K10FC256-2N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K10FC256-2
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EP1K10FC256-1
✅ Drop-In✓ In Stock
$22.62 / Unit
View Datasheet →EP1K10FC256-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$24.5 / Unit
View Datasheet →EP1K10FI256-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.95 / Unit
View Datasheet →EP1K10FC256-2NGZ
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1K10FC256-1N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1K10FC256-2N Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Family Name | ACEX-1K |
| Device Type | Field Programmable Gate Array (FPGA) |
| Typical Gates | 10,000 |
| Logic Elements / Cells | 576 |
| Number of LABs/CLBs | 72 |
| Total RAM Bits | 12,288 |
| Number of I/O | 136 |
| Number of Gates | 56,000 (maximum) |
| Core Supply Voltage | 2.375 V to 2.625 V |
| Pin-to-Pin Logic Delay | 0.5 ns |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Mounting Type | Surface Mount |
| Package / Case | 256-BBGA (FineLine BGA, 17 mm × 17 mm) |
| Supplier Device Package | 256-FBGA |
| RoHS Status | ROHS3 Compliant |
| Lead Time | To be confirmed by distributor |
EP1K10FC256-2N Pin Configuration
| Pin A1 | I/O — User I/O pin (bank dependent) |
| Pin B2 | I/O — User I/O pin |
| Pin C3 | I/O — User I/O pin |
| Pin D4 | I/O — User I/O pin |
| Pin E5 | I/O — User I/O pin |
| Pin F6 | I/O — User I/O pin |
| Pin G7 | I/O — User I/O pin |
| Pin H8 | I/O — User I/O pin |
| Pin J9 | I/O — User I/O pin |
| Pin K10 | I/O — User I/O pin |
| Pin L11 | I/O — User I/O pin |
| Pin M12 | I/O — User I/O pin |
| Pin N13 | I/O — User I/O pin |
| Pin P14 | I/O — User I/O pin |
| Pin R15 | I/O — User I/O pin |
| Pin T16 | VCCINT — Core supply 2.5 V |
| Pin T1 | GND — Ground |
| Pin A16 | nCONFIG — Configuration control (active low) |
| Pin B15 | nSTATUS — Configuration status (active low) |
| Pin C16 | CONF_DONE — Configuration done indicator |
| Pin D14 | DCLK — Configuration clock input |
| Pin E15 | DATA0 — Configuration data input |
| Pin F16 | TCK — JTAG test clock |
| Pin G14 | TMS — JTAG test mode select |
| Pin H15 | TDI — JTAG test data in |
| Pin J16 | TDO — JTAG test data out |
| Pin K14 | VCCIO — I/O supply (3.3 V typical) |
Typical Applications
EP1K10FC256-2N is suitable for 6 applications: Legacy Microprocessor Bus Glue Logic, Peripheral Controller / UART-SPI-I2C Bridge, Low-Speed Digital Signal Processing Front-End, Industrial Communication Bridge, Prototyping Platform for ASIC / SoC Designs, Memory Interface Bridge (FIFO / Clock-Domain Crossing).
Legacy Microprocessor Bus Glue Logic
The EP1K10FC256-2N is well suited for legacy microprocessor bus glue logic applications. Its 10,000-gate ACEX-1K fabric, 136 user I/Os, and 0.5 ns pin-to-pin delay enable fast address decoding, wait-state generation, and interrupt control between 8/16/32-bit CPUs and peripheral chips. Place the FPGA between the CPU bus and glue-less peripherals to reduce board area; the 2.5 V core plus 3.3 V-tolerant I/O banks interface cleanly to both 3.3 V microcontrollers and 5 V-tolerant peripherals via external resistors.
Recommended
Peripheral Controller / UART-SPI-I2C Bridge
Bridge between UART, SPI, and I2C peripherals in embedded designs using the EP1K10FC256-2N. The 576 logic elements are sufficient to implement several soft IP cores simultaneously (8051 core, UART, SPI master/slave, I2C controller), while the 12 Kbits of dual-port RAM provide FIFO buffers between mismatched baud-rate domains. The 0.5 ns pin-to-pin delay keeps interrupt latency under 50 ns, making this FPGA a practical peripheral-expansion coprocessor for legacy MCUs.
Recommended
Low-Speed Digital Signal Processing Front-End
Implement low-speed DSP front-ends in the EP1K10FC256-2N such as FIR filters, decimators, and simple FFT pre-processors for instrumentation and audio preprocessing. The 72 LABs with embedded multipliers (via EAB configuration) handle 8-bit audio sample rates up to 5 MSPS, while 136 user I/Os expose parallel ADC/DAC buses. Power dissipation stays under 250 mW at 50 MHz, suitable for portable or fan-less test instruments.
Recommended
Industrial Communication Bridge
Use the EP1K10FC256-2N as a multi-protocol industrial bridge converting between RS-232, RS-485, CAN, and Modbus on factory floor equipment. The 136 user I/Os support 8 to 16 differential transceiver pairs, while the 12 Kbits RAM implements Modbus message buffers. Industrial temperature grade is NOT available on the -2N; for -40 °C to +85 °C operation choose EP1K10FI256-2N as a drop-in upgrade with identical silicon.
Recommended
Prototyping Platform for ASIC / SoC Designs
Prototype ASIC and SoC designs in the EP1K10FC256-2N before committing to mask costs. ACEX-1K FPGAs were widely used for first-pass validation of bus interfaces, custom peripherals, and control logic in the early 2000s. Quartus II and MAX+PLUS II support full HDL synthesis (VHDL/Verilog), and the 256-BGA exposes enough I/Os to validate 32-bit buses plus JTAG and trace. Pair with a Cyclone IV or Cyclone V board for modern prototyping flows.
Recommended
Memory Interface Bridge (FIFO / Clock-Domain Crossing)
Bridge asynchronous memory interfaces with the EP1K10FC256-2N. The 12 Kbits of embedded dual-port RAM implement 1.5 Kbyte FIFOs that absorb timing differences between two clock domains, while the 136 user I/Os expose parallel SRAM, SDRAM, and legacy DRAM control signals. ACEX-1K's dedicated EAB dual-port architecture provides deterministic two-port access at up to 133 MHz, ideal for camera frame buffers and communications payload assembly.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10FC256-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10FC256-2 | EP1K10FC256-1 | EP1K10FC256-3N | EP1K10FI256-2N | EP1K10FC256-2NGZ | EP1K10FC256-1N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-BBGA (FineLine BGA, 17x17 mm) | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| User I/O Count | 136 | 136 | 136 | 136 | 136 | 136 | 136 |
| Speed Grade | -2 (0.5 ns delay) | -2 | -1 (slower) | -3 (faster) | -2 | -2 | -1 (slower) |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C | 0 °C to +70 °C |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- RoHS lead-free packaging (vs EP1K10FC256-2)
- Faster speed grade than -1 (vs EP1K10FC256-1)
- Commercial temperature vs industrial (vs EP1K10FI256-2N)
Design Notes
The EP1K10FC256-2N requires a 2.375 V to 2.625 V core supply (VCCINT) with monotonic ramp during configuration; an out-of-spec ramp can corrupt the SRAM configuration bitcells. Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT ball and bulk-decouple each supply plane with a 10 µF tantalum. I/O banks (VCCIO) can be powered at 3.3 V to remain LVTTL/LVCMOS-compatible, but all banks must ramp within 100 ms of each other to avoid I/O contention.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch with 17 mm × 17 mm body. Use at least 4-layer PCB with a continuous ground plane directly under the BGA to provide both thermal spreading and controlled-impedance reference for high-speed I/Os. Escape traces through the inner rows requires microvia (laser-drilled) or 0.4 mm-pitch dog-bone fan-out; standard 0.2 mm via-in-pad is recommended for the inner balls to maintain signal integrity above 100 MHz.
Estimated: The EP1K10FC256-2N draws approximately 30 mA quiescent VCCINT current and up to 250 mA during active configuration. Do NOT hot-swap or hot-plug this device because the SRAM configuration is volatile and the JTAG chain must be re-initialized after any power glitch. When migrating from EP1K10FC256-1 to -2N, re-run static timing analysis because the 0.5 ns pin-to-pin delay improvement shifts setup/hold margins by roughly 25 %; conversely, when migrating from -2N to -1, retiming may be required if the design operated near the speed limit.
Compliance Information
RoHS3 compliant per Altera product page and LCSC distributor listing. Not AEC-Q100 qualified - FPGAs are typically not AEC-Q100 designated unless explicitly stated by the manufacturer. Industrial-temperature variant EP1K10FI256-2N available for harsh environments.
