EP1K10FC256-3 - ACEX 1K FPGA, 10K Gates, 256-BGA | Intel
MPN: EP1K10FC256-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.95 | $15,950.00 |
EP1K10FC256-3 Overview
A FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the density of gate arrays with the flexibility of user-programmable interconnect, enabling designers to implement custom digital logic, glue logic, glue-less interfaces, state machines, and arithmetic pipelines on a single chip. Within the broader taxonomy of integrated circuits, an FPGA sits between standard logic ICs (fixed function) and ASICs (application-specific) - offering hardware-level parallelism and re-programmability without NRE costs.
Key features of the EP1K10FC256-3 include 72 logic array blocks (LABs), dual-port EAB (Embedded Array Block) memory, in-system programmability via IEEE 1149.1 JTAG, MultiVolt I/O support for interfacing with 2.5 V, 3.3 V, and 5.0 V systems, and a -3 speed grade. The device supports 12,288 bits of embedded RAM distributed across EAB blocks, enabling efficient on-chip buffering for FIFOs, lookup tables, and small data paths without consuming general-purpose logic.
The ACEX 1K architecture combines logic elements (LEs) with embedded array blocks (EABs), where each EAB provides up to 4 Kbits of RAM that can be configured as synchronous SRAM, ROM, or specialized logic functions such as multipliers and megafunctions. The -3 speed grade designates a mid-tier performance bin, balancing timing margin against cost for glue logic, bus bridging, and low-to-mid complexity state machines rather than high-speed DSP or SERDES workloads.
Typical applications include bus-interface bridging between microcontrollers and peripherals, glue logic replacement in telecom and industrial control equipment, low-density control and signal processing in test and measurement, and prototyping platforms for ASIC verification. Its dual-port EAB structure also makes it well suited to small FIFO buffers and lookup-table-based waveform synthesis.
When designing with this part, pay attention to the 256-ball FBGA land pattern, the 2.5 V VCCINT/VCCIO rail requirements, and the JTAG chain integration with any boundary-scan test infrastructure. Engineers migrating from the original ACEX 1K family should also evaluate the Cyclone-series successors for new designs, while keeping the EP1K10FC256-3 as a long-term production component for legacy boards.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP1K10FC256-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K10FC256-3 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K10FC256-3N
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →EP1K10FC256-2
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EP1K10FC256-2N
✅ Drop-In✓ In Stock
$5.62 / Unit
View Datasheet →EP1K10FC256-1
✅ Drop-In✓ In Stock
$22.62 / Unit
View Datasheet →EP1K10FC256-3 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements | 576 |
| Typical Gates | 10,000 |
| Maximum User I/Os | 136 |
| Embedded RAM Bits | 12,288 |
| Logic Array Blocks (LABs) | 72 |
| Embedded Array Blocks (EABs) | 3 |
| Core Voltage | 2.5 V |
| Speed Grade | -3 |
| Package | 256-BGA (FBGA) |
| Pin/Ball Count | 256 |
| Operating Temperature | 0°C to +70°C (Commercial) |
| Process Technology | 0.18 µm SRAM |
| Programming Interface | IEEE 1149.1 JTAG, in-system programmable |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5.0 V |
| Mounting Type | Surface Mount |
EP1K10FC256-3 Pin Configuration
| Pin A1 | I/O — User I/O (bank 1) |
| Pin A2 | I/O — User I/O (bank 1) |
| Pin B1 | I/O — User I/O (bank 1) |
| Pin B2 | GND — Ground |
| Pin C1 | VCCIO1 — I/O bank 1 supply (2.5/3.3/5.0 V) |
| Pin C2 | TDI — JTAG test data in |
| Pin D1 | TMS — JTAG test mode select |
| Pin D2 | TCK — JTAG test clock |
| Pin E1 | nCONFIG — Configuration control (active low) |
| Pin E2 | VCCINT — Core supply 2.5 V |
| Pin F1 | nSTATUS — Configuration status (active low) |
| Pin F2 | CONF_DONE — Configuration done |
| Pin G1 | TDO — JTAG test data out |
| Pin G2 | GND — Ground |
| Pin H1 | I/O — User I/O (bank 2) |
| Pin H2 | I/O — User I/O (bank 2) |
Typical Applications
EP1K10FC256-3 is suitable for 6 applications: Bus Interface Bridging, Industrial Control and Glue Logic, ASIC Prototyping Platform, Test and Measurement Equipment, Telecom and Datacom Line Cards, Educational and Development Boards.
Bus Interface Bridging
The EP1K10FC256-3 fits bus-bridging between microcontrollers, DSPs, and peripherals by combining 576 logic elements and 12,288 bits of embedded dual-port RAM in a single 256-FBGA device. Its MultiVolt I/O supports direct interfacing to 5.0 V, 3.3 V, and 2.5 V rails, eliminating external level shifters. Typical designs use 3-4 EABs as FIFO buffers for protocol translation (e.g., UART↔SPI or PCI-to-ISA bridges), with the remaining LEs implementing handshake state machines. The 136 user I/Os comfortably accommodate 16-32-bit bus widths plus chip selects and interrupts. Engineers benefit from in-system JTAG programmability, which simplifies iterative glue-logic bring-up versus hand-routing discrete 74-series logic.
Recommended
Industrial Control and Glue Logic
In industrial PLCs, motor controllers, and instrumentation front-ends, the EP1K10FC256-3 replaces dozens of 74-series logic ICs with one programmable device. The 72 LABs comfortably implement encoder-decoder state machines, PWM generation, and quadrature decoding. Its 0.18 µm process and 2.5 V core deliver moderate power consumption for 24/7 industrial environments. The 256-FBGA package suits compact controller boards where board area is at a premium. Designs requiring deterministic timing below 50 ns benefit from the -3 speed grade. For new industrial platforms, designers should evaluate the Cyclone-series for active lifecycle and longer-term support.
Recommended
ASIC Prototyping Platform
ASIC verification teams use the EP1K10FC256-3 as a fast-prototyping target for control-plane RTL blocks prior to mask tape-out. The 576 logic elements and 12,288 bits of dual-port RAM allow one or two IP blocks (e.g., a register file plus DMA engine) to be validated at near-ASIC clock rates. In-system JTAG programming enables rapid iteration: a new bitstream downloads in seconds versus multi-week ASIC re-spins. The MultiVolt I/O allows direct connection to surrounding ASIC-validation test chips at 2.5/3.3/5.0 V. Engineers often pair multiple EP1K10FC256-3 devices on a single prototyping board to mimic larger ASICs.
Recommended
Test and Measurement Equipment
The EP1K10FC256-3 powers custom logic in low-to-mid complexity test gear such as protocol analyzers, signal generators, and data-acquisition front-ends. Its EAB blocks serve as waveform lookup tables (storing sine, ramp, or arbitrary stimulus patterns), while LEs implement counters, sequencers, and trigger logic. The 136 user I/Os accommodate parallel digital stimulus buses plus trigger inputs/outputs. Designers benefit from reconfigurability: a single board can host multiple instrument personalities via different bitstreams. For new T&M products, the Cyclone-series is recommended, but the EP1K10FC256-3 remains a stable option for long-life test platforms.
Recommended
Telecom and Datacom Line Cards
In legacy telecom and datacom line cards (T1/E1 framers, low-density cross-connects, fan-out buffers), the EP1K10FC256-3 implements framing, alarm processing, and clock-recovery glue logic around discrete PHY devices. The 2.5 V core with 3.3 V I/O directly interfaces to classic telecom ASICs. The 12,288-bit embedded RAM hosts small elastic stores and pattern-matching buffers. The 256-FBGA package fits the compact 6-8 layer PCBs typical of line-card designs. Service providers still maintaining installed bases rely on the EP1K10FC256-3 for spares and incremental upgrades before migrating to modern FPGAs.
Recommended
Educational and Development Boards
Universities and FPGA training labs value the EP1K10FC256-3 for teaching digital design, RTL synthesis, and JTAG-based debugging on a real, JTAG-programmable silicon platform. Its 576 logic elements are large enough for meaningful projects (UART, VGA controller, simple RISC core) yet small enough to map cleanly onto a single semester's assignments. The 256-FBGA package is challenging for hand-soldering, so development boards with pre-routed land patterns are typical. Instructors can demonstrate timing closure trade-offs across -1/-2/-3 speed grades using drop-in variants on identical boards.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10FC256-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10FC256-3N | EP1K10FC256-2 | EP1K10FC256-2N | EP1K10FC256-1 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-BGA (FBGA) | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same | 256-BGA (FBGA) - same |
| Family / Die | ACEX 1K (576 LEs) | ACEX 1K (576 LEs) - same die | ACEX 1K (576 LEs) - same die | ACEX 1K (576 LEs) - same die | ACEX 1K (576 LEs) - same die |
| Speed Grade | -3 | -3 (same) | -2 (faster) | -2 (faster) | -1 (slower) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| Maximum User I/Os | 136 | 136 | 136 | 136 | 136 |
| Ball Finish / RoHS | SnPb / Non-RoHS | Pb-free / RoHS | SnPb / Non-RoHS | Pb-free / RoHS | SnPb / Non-RoHS |
Key Differentiators
- RoHS-compliant drop-in alternative available without footprint change (vs EP1K10FC256-3N)
- Faster speed-grade drop-in upgrade path (vs EP1K10FC256-2)
- Dual-port embedded RAM for FIFO and lookup-table designs (vs Discrete 74-series glue logic)
Design Notes
The 256-FBGA package uses a fine-pitch ball grid that typically requires via-in-pad or dog-bone fan-out on a 4-6 layer PCB. Per the ACEX 1K datasheet, all VCCINT and VCCIO pins must have a 0.1 µF decoupling capacitor placed within 100 mils of each pin, with bulk 10-47 µF tantalum or ceramic capacitors on each supply rail. Place a ground pour directly under the BGA to provide low-impedance return paths for simultaneous-switching outputs.
The EP1K10FC256-3 requires a 2.5 V VCCINT core and one or more VCCIO supplies (2.5/3.3/5.0 V MultiVolt) for the I/O banks. Estimated: with all 136 I/Os switching at 50 MHz and 50% toggle rate, peak supply current can exceed 500 mA on VCCINT - use a switching regulator with at least 1 A rating plus 2-stage LC filtering to meet simultaneous-switching-noise (SSN) budgets of ±5% on VCCINT.
MultiVolt I/O allows mixed-voltage interfacing, but each I/O bank must be powered from a single VCCIO rail. Mixing 5 V and 3.3 V inputs on the same bank is not supported. For long-trace or high-speed (>50 MHz) outputs, use 22-33 Ω series termination near the FPGA pin to dampen reflections; for LVTTL/LVCMOS receivers on the far end, place the resistor within 200 mils of the FPGA output.
Do not confuse the EP1K10FC256-3 (SnPb ball finish, non-RoHS) with the EP1K10FC256-3N (Pb-free, RoHS-compliant) - both share the same 256-FBGA footprint but require different reflow profiles and may be flagged by component-placement systems enforcing material compliance. Also note that the ACEX 1K family is NRND; new designs should evaluate Cyclone-series successors, but the EP1K10FC256-3 remains in service for long-life industrial platforms.
Compliance Information
EP1K10FC256-3 is non-RoHS due to SnPb ball finish. Use EP1K10FC256-3N for RoHS-compliant assembly. REACH compliance declared via Intel/Altera material declaration. AEC-Q100 not applicable - this is a commercial-grade FPGA, not automotive-qualified.
