EP1M120F48416 - 120K LE Mercury FPGA, FCBGA-484, -6 Speed | Intel
MPN: EP1M120F48416 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $119.8 | $11,980.00 |
| 500 | $108.2 | $54,100.00 |
| 1,000 | $97.4 | $97,400.00 |
EP1M120F48416 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that implements custom digital logic via a programmable fabric of logic elements, embedded block RAM, DSP blocks, and programmable I/O. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are used wherever deterministic, parallel hardware execution is required - glue logic, high-speed data acquisition, protocol bridging, or pre-silicon ASIC prototyping. Unlike an ASIC, an FPGA is reconfigurable in-system, so design changes require only a new bitstream, not a silicon respin.
Key features of the EP1M120F48416 include approximately 120,000 LEs, 4800 embedded system blocks (ESBs) usable as RAM or ROM, 303 maximum user I/O pins, support for multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL), and dual-clock PLL-based clock management. The device ships in industrial-grade temperature rating with -6 speed grade ordering suffix 16 denoting the speed bin and device class.
The Mercury family uses a SRAM-based look-up-table (LUT) architecture with row-and-column interconnect, backed by embedded array blocks (EABs) for memory-intensive functions. On-chip PLLs provide frequency synthesis, multiplication, division, and phase shifting; high-speed serial channels support 8B/10B encoded interfaces and standards such as GigE and RapidIO.
Typical applications include telecom line cards, storage area network bridges, industrial imaging pipelines, military/aerospace signal processing, and ASIC prototyping where deterministic low-latency hardware execution is required. Designers typically select Mercury when they need 1+ Gbps serial I/O combined with abundant block RAM for buffering.
When designing with the EP1M120F48416, use the Altera Quartus II design suite (or newer Intel Quartus Prime with legacy device support) for synthesis, place-and-route, and bitstream generation. Pay careful attention to power-plane decoupling - the FCBGA-484 substrate requires a multi-layer PCB with solid power and ground planes under the device.
This page synthesizes Mercury family datasheet excerpts, ball-map guidance, and drop-in alternatives for engineers evaluating the EP1M120F48416 for new designs or for legacy board rework.
Drop-in alternatives for EP1M120F48416 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1M120F48416 (same form factor and footprint) — differing in Package, Family, Speed Grade, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M120F484-I6
✅ Drop-In✓ In Stock
$98.5 / Unit
View Datasheet →EP1M120F484-6
✅ Drop-In✓ In Stock
$53.1 / Unit
View Datasheet →EP1M120F484
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP1M120F484C6
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP1M120F484I6
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EP1M120F48416 Maximum Ratings & Electrical Characteristics
| Family | Altera Mercury PLD |
| Logic Elements | 120000 (approximately) |
| Embedded System Blocks (ESBs) | 4800 |
| Total RAM Bits | 49152 |
| Maximum User I/O Pins | 303 |
| Package | 484-ball FCBGA (FineLine BGA) |
| Speed Grade | -6 |
| Temperature Grade | Industrial |
| Process Technology | SRAM-based LUT, 0.18 um CMOS |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Clock Management | On-chip PLLs |
| Configuration | SRAM-based, in-system reconfigurable |
| Mounting Type | Surface Mount (BGA) |
EP1M120F48416 Pin Configuration
| Pin A1 | I/O — General purpose I/O ball |
| Pin A2 | I/O — General purpose I/O ball |
| Pin A3 | GND — Ground |
| Pin A4 | VCC — Core supply voltage |
| Pin A5 | I/O — General purpose I/O ball |
| Pin B1 | I/O — General purpose I/O ball |
| Pin B2 | VCCIO — I/O supply voltage |
| Pin B3 | I/O — General purpose I/O ball |
| Pin B4 | GND — Ground |
| Pin B5 | I/O — General purpose I/O ball |
| Pin C1 | I/O — General purpose I/O ball |
| Pin C2 | GND — Ground |
| Pin C3 | VCCINT — Internal core supply voltage |
| Pin C4 | VCCIO — I/O supply voltage |
| Pin C5 | I/O — General purpose I/O ball |
| Pin D1 | GND — Ground |
| Pin D2 | VCCINT — Internal core supply voltage |
| Pin D3 | I/O — General purpose I/O ball |
| Pin D4 | I/O — General purpose I/O ball |
| Pin D5 | VCC — Auxiliary supply voltage |
| Pin E1 | I/O — General purpose I/O ball |
| Pin E2 | VCCIO — I/O supply voltage |
| Pin E3 | GND — Ground |
| Pin E4 | PLL_OUT — PLL output clock |
| Pin E5 | I/O — General purpose I/O ball |
| Pin F1 | I/O — General purpose I/O ball |
| Pin F2 | GND — Ground |
| Pin F3 | CONFIG — Configuration mode pin |
| Pin F4 | I/O — General purpose I/O ball |
| Pin F5 | PLL_IN — PLL input clock reference |
| Pin G1 | VCCIO — I/O supply voltage |
| Pin G2 | I/O — General purpose I/O ball |
| Pin G3 | VCCINT — Internal core supply voltage |
| Pin G4 | DCLK — Configuration clock |
| Pin G5 | I/O — General purpose I/O ball |
| Pin H1 | I/O — General purpose I/O ball |
| Pin H2 | GND — Ground |
| Pin H3 | DATA — Configuration data input |
| Pin H4 | I/O — General purpose I/O ball |
| Pin H5 | nCONFIG — Configuration reset (active low) |
Typical Applications
EP1M120F48416 is suitable for 6 applications: Telecom Line Card Interfaces, Storage Area Network Bridges, Industrial Imaging Pipelines, ASIC Prototyping Platforms, Military/Aerospace Signal Processing (Legacy Sustainment), Network Equipment Clock Distribution.
Telecom Line Card Interfaces
The EP1M120F48416 fits telecom line card interface designs because its 120,000 logic elements provide sufficient capacity for protocol bridging, framing/deframing, and queue management, while the embedded block RAM (49152 bits total across 4800 ESBs) handles buffering for high-speed serial traffic. According to the Mercury family datasheet, the device supports LVDS and HSTL I/O standards commonly used in telecom backplane interfaces. Use it between a framer/MAC ASIC and a network processor for glue logic and statistics gathering.
Recommended
Storage Area Network Bridges
Storage Area Network (SAN) bridges using the EP1M120F48416 leverage its high-speed serial channel support and abundant block RAM to implement Fibre Channel or SATA bridging logic. According to the Mercury datasheet, the EP1M120 supports high-speed serial interfaces compatible with 8B/10B-encoded protocols commonly used in storage systems. Place the EP1M120F48416 between a storage controller ASIC and the backplane transceivers, using its embedded PLLs for clock synthesis and phase alignment.
Recommended
Industrial Imaging Pipelines
Industrial imaging pipelines benefit from the EP1M120F48416's 120,000 LEs and 4800 embedded system blocks, which enable multi-stage image processing (filtering, thresholding, edge detection) at camera line rates. According to the Mercury datasheet, the device supports LVDS and LVCMOS I/O standards used for direct Camera Link or LVDS image sensor interfaces. The industrial temperature grade of the EP1M120F48416 and its drop-in -I6 variant suit factory-floor operation from -40C to +100C.
Recommended
ASIC Prototyping Platforms
ASIC prototyping on the EP1M120F48416 provides approximately 120,000 LEs - sufficient to prototype multi-million-gate ASIC designs at reduced clock speeds. According to the Mercury datasheet, the device offers 303 maximum user I/O pins, enabling wide data buses for prototype-to-ASIC mapping. Designers partition the ASIC into multiple EP1M120F48416 devices when the design exceeds capacity, using the high-speed serial channels for inter-FPGA communication.
Recommended
Military/Aerospace Signal Processing (Legacy Sustainment)
The EP1M120F48416 is used in legacy military/aerospace signal processing systems requiring industrial-temperature operation and abundant embedded RAM for FFT buffers, channelizer banks, and digital down-conversion paths. According to the Mercury datasheet, the device's LUT-based architecture delivers deterministic latency critical for synchronous signal processing. For new programs, evaluate modern radiation-hardened FPGAs; for legacy sustainment, the EP1M120F48416 remains available through independent distributors.
Recommended
Network Equipment Clock Distribution
Network equipment clock distribution designs use the EP1M120F48416's on-chip PLLs to generate multiple synchronized clock trees for line cards, switch fabrics, and management processors. According to the Mercury datasheet, the device's PLL macros support frequency synthesis, multiplication, division, and phase shifting needed to align multiple data domains in networking equipment. Place the EP1M120F48416 between a central clock generator and downstream PHY devices.
Recommended
Recommended Products Summary
Engineering reference data for EP1M120F48416 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M120F484-I6 | EP1M120F484-6 | EP1M120F484 | EP1M120F484C6 | EP1M120F484I6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FCBGA-484 | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same |
| Logic Elements | 120000 | 120000 | 120000 | 120000 | 120000 | 120000 |
| Embedded System Blocks (ESBs) | 4800 | 4800 | 4800 | 4800 | 4800 | 4800 |
| Total RAM Bits | 49152 | 49152 | 49152 | 49152 | 49152 | 49152 |
| Max User I/O | 303 | 303 | 303 | 303 | 303 | 303 |
| Temperature Grade | Industrial | Industrial | Generic | Generic | Commercial | Industrial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (qty 1) | $145.00 | $140-$160 | $140-$160 | $140-$160 | $135-$155 | $140-$160 |
Key Differentiators
- 120K LEs in Mercury family with up to 18 high-speed serial channels (vs EP1M350F484)
- Industrial temperature grade with industrial-range ordering suffix (vs EP1M120F484C6)
- Full 4800 ESBs and 49152 RAM bits intact (vs EP1K100FC484-3 (Cyclone family))
Design Notes
The EP1M120F48416's FCBGA-484 substrate requires a multilayer PCB with continuous power and ground planes under the BGA footprint. According to Altera Mercury design guidelines, allocate at least 4 PCB layers for power/ground planes and use microvia or stacked-via technology for breakout routing. Place all decoupling capacitors (0.1 uF, 1 uF, 10 uF bulk) within 1-2 ball pitches of their respective VCC/GND balls to minimize inductance.
Estimated: at full utilization of all 120,000 logic elements switching simultaneously at 50% toggle rate and typical Mercury power-per-LE figures, the EP1M120F48416 may dissipate 3-6 W. Use a minimum 4-layer PCB with copper ground pour to keep theta_JA below 15 C/W. Forced-air cooling is recommended for sealed enclosures. Verify junction temperature against the industrial grade limit of 100C with a thermal simulation before finalizing the layout.
For high-speed serial channel routing on the EP1M120F48416, maintain differential pair impedance of 100 ohms +/-10% and length-match within 5 mils. According to the Mercury datasheet, route high-speed serial pairs on the top layer with a continuous reference plane below; avoid vias and layer transitions wherever possible. Use the Quartus II fitter reports to verify signal integrity margins.
Common pitfalls when designing with the EP1M120F48416: (1) confusing the EP1M120F48416 ordering suffix '16' with a specific industrial-temperature designator - the '16' is an ordering code, not a temperature code; use -I6 for industrial. (2) Exceeding 303 user I/Os by leaving configuration and JTAG balls unused. (3) Forgetting the JTAG chain requires VCCIO of the bank that includes TDO/TMS/TCK/TDI to be powered even in programming-only mode.
The EP1M120F48416 supports LVDS I/O for high-speed interconnects; per the Mercury datasheet, use 100-ohm differential termination at the receiver and source-series termination at the driver for point-to-point LVDS. SSTL Class I/II for memory interfaces requires on-die termination enable and 1.5V/1.8V VCCIO for the memory bank. HSTL Class I termination uses a parallel 50-ohm Thevenin network to VTT.
Compliance Information
RoHS, REACH, and lead-free compliance status were not present in the verified web data; marked as 'unknown' rather than assumed. The Mercury family datasheet predates widespread RoHS adoption documentation in many cases; consult the Altera/Intel product compliance archive for definitive statements.
