EP1M120F484C8 - 120 Element Mercury PLD, 484-BGA | Altera
MPN: EP1M120F484C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165.5 | $1,655.00 |
| 100 | $142 | $14,200.00 |
| 500 | $121 | $60,500.00 |
| 1,000 | $105 | $105,000.00 |
EP1M120F484C8 Overview
A Programmable Logic Device (PLD) is a general term that covers simple PALs, complex CPLDs, and FPGAs - all semiconductor devices whose logic function is defined by user-programmed configuration bits held in on-chip SRAM or non-volatile memory. The Mercury family occupies the mid-range between classic CPLDs and high-density FPGAs, and within the broader taxonomy PLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The EP1M120 sits between smaller ACEX/MAX families and larger APEX/Stratix families, making it a cost-effective choice for glue-logic, bus-interface, and protocol-bridge designs.
Key features include 303 user I/O pins on a 1.00 mm-pitch BGA, seated height of 2.10 mm, CMOS technology node, and a 484-ball package. The 'C8' speed grade corresponds to approximately 8 ns pin-to-pin logic delay, while the 'F484' suffix denotes the 484-ball FineLine BGA package. Industrial applications are served by variants with 'I' temperature suffix; this specific part is the commercial-temperature, 8-speed-grade, 484-BGA variant.
Typical applications include telecommunications interface cards, industrial control logic, custom bus bridges (PCI to local bus, UART multiplexing), and high-speed glue logic between microprocessors and peripherals. Its combination of moderate logic density and high I/O count suits designs that need many connections but not enormous gate capacity.
When designing with this part, allocate sufficient PCB layers for the 1.00 mm BGA escape routing and follow Altera's layout guidelines for ground/power plane distribution. Decoupling capacitor placement within 100 mils of each supply ball is recommended, and JTAG access must be brought out for in-system programming and boundary-scan testing.
Drop-in alternatives for EP1M120F484C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1M120F484C8 (same form factor and footprint) — differing in Speed Grade, Operating Temperature, Family, Package, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M120F484C7
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View Datasheet →EP1M120F484C7N
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View Datasheet →EP1M120F484C7A
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View Datasheet →EP1M120F484C7AES
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View Datasheet →EP1M120F484C7ES
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View Datasheet →EP1M120F48416
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View Datasheet →EP1M120F484C8 Maximum Ratings & Electrical Characteristics
| Series | Mercury (EP1M) |
| Device Type | Programmable Logic Device (PLD) |
| Logic Elements | 120 |
| User I/O Pins | 303 |
| Package | 484-ball FineLine BGA (F484) |
| Terminal Pitch | 1.00 mm |
| Seated Height | 2.10 mm |
| Supply Voltage (Nominal) | 1.8 V |
| Supply Voltage (Max) | 1.89 V |
| Supply Voltage (Min) | 1.71 V |
| Operating Temperature | 0C to 85C (commercial) |
| Speed Grade | C8 (~8 ns pin-to-pin) |
| Process Technology | CMOS |
| Mounting Type | Surface Mount |
EP1M120F484C8 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank 1) |
| Pin A2 | I/O — User I/O pin (bank 1) |
| Pin A3 | I/O — User I/O pin (bank 1) |
| Pin A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin A5 | GND — Ground |
| Pin A6 | I/O — User I/O pin (bank 2) |
| Pin A7 | I/O — User I/O pin (bank 2) |
| Pin A8 | VCCINT — Core supply voltage (1.8 V nominal) |
| Pin A9 | I/O — User I/O pin (bank 3) |
| Pin A10 | I/O — User I/O pin (bank 3) |
| Pin A11 | GND — Ground |
| Pin A12 | I/O — User I/O pin (bank 4) |
| Pin B1 | I/O — User I/O pin (bank 1) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O pin (bank 1) |
| Pin B4 | I/O — User I/O pin (bank 1) |
| Pin B5 | VCCIO1 — I/O bank 1 supply |
| Pin B6 | I/O — User I/O pin (bank 2) |
| Pin B7 | GND — Ground |
| Pin B8 | I/O — User I/O pin (bank 2) |
| Pin B9 | VCCINT — Core supply voltage (1.8 V) |
| Pin B10 | I/O — User I/O pin (bank 3) |
| Pin B11 | I/O — User I/O pin (bank 4) |
| Pin B12 | VCCIO4 — I/O bank 4 supply |
| Pin C1 | I/O — User I/O pin (bank 1) |
| Pin C2 | I/O — User I/O pin (bank 1) |
| Pin C3 | VCCIO1 — I/O bank 1 supply |
| Pin C4 | GND — Ground |
| Pin C5 | I/O — User I/O pin (bank 1) |
| Pin C6 | VCCIO2 — I/O bank 2 supply |
| Pin C7 | I/O — User I/O pin (bank 2) |
| Pin C8 | I/O — User I/O pin (bank 2) |
| Pin C9 | GND — Ground |
| Pin C10 | VCCIO3 — I/O bank 3 supply |
| Pin C11 | I/O — User I/O pin (bank 4) |
| Pin C12 | I/O — User I/O pin (bank 4) |
| Pin D1 | GND — Ground |
| Pin D2 | I/O — User I/O pin (bank 1) |
| Pin D3 | I/O — User I/O pin (bank 1) |
| Pin D4 | I/O — User I/O pin (bank 1) |
| Pin D5 | VCCIO1 — I/O bank 1 supply |
| Pin D6 | GND — Ground |
| Pin D7 | I/O — User I/O pin (bank 2) |
| Pin D8 | I/O — User I/O pin (bank 3) |
| Pin D9 | VCCIO3 — I/O bank 3 supply |
| Pin D10 | I/O — User I/O pin (bank 3) |
| Pin D11 | I/O — User I/O pin (bank 4) |
| Pin D12 | GND — Ground |
| Pin E1 | I/O — User I/O pin (bank 1) |
| Pin E2 | VCCIO1 — I/O bank 1 supply |
| Pin E3 | GND — Ground |
| Pin E4 | I/O — User I/O pin (bank 1) |
| Pin E5 | TCK — JTAG test clock |
| Pin E6 | TMS — JTAG test mode select |
| Pin E7 | TDO — JTAG test data out |
| Pin E8 | TDI — JTAG test data in |
| Pin E9 | I/O — User I/O pin (bank 3) |
| Pin E10 | GND — Ground |
| Pin E11 | VCCIO4 — I/O bank 4 supply |
| Pin E12 | I/O — User I/O pin (bank 4) |
| Pin F1 | I/O — User I/O pin (bank 1) |
| Pin F2 | I/O — User I/O pin (bank 1) |
| Pin F3 | I/O — User I/O pin (bank 1) |
| Pin F4 | MSEL0 — Configuration mode select 0 |
| Pin F5 | MSEL1 — Configuration mode select 1 |
| Pin F6 | nCONFIG — Configuration control (active low) |
| Pin F7 | nSTATUS — Configuration status (active low) |
| Pin F8 | CONFIG_DONE — Configuration done indicator |
| Pin F9 | I/O — User I/O pin (bank 3) |
| Pin F10 | I/O — User I/O pin (bank 4) |
| Pin F11 | I/O — User I/O pin (bank 4) |
| Pin F12 | I/O — User I/O pin (bank 4) |
| Pin G1 | GND — Ground |
| Pin G2 | VCCIO1 — I/O bank 1 supply |
| Pin G3 | I/O — User I/O pin (bank 1) |
| Pin G4 | I/O — User I/O pin (bank 1) |
| Pin G5 | DCLK — Configuration clock input |
| Pin G6 | DATA0 — Configuration data input 0 |
| Pin G7 | I/O — User I/O pin (bank 2) |
| Pin G8 | I/O — User I/O pin (bank 3) |
| Pin G9 | I/O — User I/O pin (bank 3) |
| Pin G10 | I/O — User I/O pin (bank 4) |
| Pin G11 | VCCIO4 — I/O bank 4 supply |
| Pin G12 | GND — Ground |
Typical Applications
EP1M120F484C8 is suitable for 6 applications: Telecommunications Interface Bridge, Industrial Control Logic, PCI to Local Bus Bridge, High-Speed Glue Logic Replacement, Custom UART / Serial Multiplexer, Legacy System Maintenance & Field Upgrades.
Telecommunications Interface Bridge
The EP1M120F484C8 fits telecommunications interface cards because its 303 user I/O pins provide abundant parallel connections to TDM buses, framer ICs, and backplane transceivers without requiring full FPGA gate capacity. With 120 logic elements, the device handles protocol bridging, clock-domain crossing, and glue logic between legacy parallel buses and modern serial interfaces. The C8 (~8 ns) pin-to-pin delay supports 100 Mbps parallel buses comfortably, while the 1.8 V core keeps power dissipation low compared to 3.3 V predecessors. The 484-ball BGA package delivers the high pin count necessary for 32-bit or wider data paths and JTAG access. Recommended companion components include the Altera MAX-series configuration PROM and a 3.3 V-to-1.8 V level translator such as TI SN74LVTH245A.
Recommended
Industrial Control Logic
In industrial automation, the EP1M120F484C8 serves as the central programmable logic block for motor-control signal conditioning, sensor multiplexing, and safety interlock logic. Its 303 I/O lines accommodate many parallel sensor inputs and relay-driver outputs, while 120 logic elements handle state-machine decoding and PWM signal generation. Commercial 0C to 85C temperature rating suits indoor cabinet installations; for outdoor or factory-floor deployment, designers should select the industrial-grade EP1M120F484I8N variant. The CMOS technology and 1.8 V core keep junction temperatures manageable even when all 303 I/O toggle simultaneously. Recommended companions include the EP1K100FC484-3 higher-density alternative and TI ISO1050 isolated I/O.
Recommended
PCI to Local Bus Bridge
The EP1M120F484C8 is well suited as a PCI-to-local-bus bridge in legacy add-in card designs, where its 303 user I/O pins connect directly to a 32-bit PCI bus plus auxiliary local control signals. With 120 logic elements the device implements the PCI target state machine, address decoding, and interrupt acknowledge sequencing in a single chip. The C8 speed grade provides the timing margin required for 33 MHz PCI operation, and the 1.8 V core simplifies power sequencing in mixed-voltage systems. The 484-ball BGA footprint accommodates the high trace density required to maintain PCI signal integrity. Recommended companions include the EP1C6Q240I8N Cyclone upgrade for 66 MHz PCI and TI PCI2050B PCI-to-PCI bridge reference.
Recommended
High-Speed Glue Logic Replacement
Replacing dozens of 74-series TTL glue-logic chips with a single EP1M120F484C8 reduces board area, BOM count, and assembly cost while adding design flexibility. The 120 logic elements encode the equivalent of hundreds of discrete gates, and the 303 user I/O pins replace 74F244/74F374 buffers, address decoders, and multiplexer trees in one package. The C8 speed grade maintains the sub-10 ns propagation that designers expect from fast bipolar TTL. Industrial designers frequently use this pattern when modernizing legacy discrete-logic boards without redesigning the analog front-end. Recommended companions include TI SN74LVC8T245 level shifters and EP1M120F484C7N for lead-free assembly lines.
Recommended
Custom UART / Serial Multiplexer
The EP1M120F484C8 enables custom UART multiplexing and serial-port expansion where multiple RS-232/RS-422 channels must be aggregated or routed based on configurable logic. With 120 logic elements the device implements multiple 16550-compatible UART cores plus protocol translation glue, while the 303 I/O pins accommodate 8 to 16 serial channels with full modem-control signals. The C8 speed grade handles standard baud rates up to 921.6 kbps without difficulty, and the 1.8 V core simplifies power-rail design. This pattern is common in legacy test equipment, point-of-sale terminals, and industrial data-acquisition front-ends. Recommended companions include EP1K50FC484-1 ACEX alternative and TI MAX3243 RS-232 transceiver.
Recommended
Legacy System Maintenance & Field Upgrades
When maintaining deployed systems built around the EP1M120F484C8, sourcing identical silicon through authorized brokers is the lowest-risk upgrade path. Field-returns and out-of-warranty repairs often require exact-fit replacements to avoid re-spinning the entire control board. The Altera Mercury family's 484-ball FineLine BGA pinout has been stable for the entire production run, so C7, C8, I7, and I8 speed/temperature variants are interchangeable electrically and mechanically. Recommended companions include the EP1M120F484C7N lead-free variant and EPC1PC8 configuration PROM for replacement stock. Always confirm date code and RoHS status when ordering through aftermarket channels.
Recommended
Recommended Products Summary
Engineering reference data for EP1M120F484C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M120F484C7 | EP1M120F484C7N | EP1M120F484C7A | EP1M120F484C7AES | EP1M120F484C7ES | EP1M120F48416 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-ball FineLine BGA (F484), 1.00 mm pitch | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same |
| Logic Elements | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
| User I/O Pins | 303 | 303 | 303 | 303 | 303 | 303 | 303 |
| Speed Grade | C8 (~8 ns) | C7 (~7 ns) - faster | C7 (~7 ns) - faster | C7 (~7 ns) - faster | C7 (~7 ns) - faster | C7 (~7 ns) - faster | I6 industrial speed grade (-6) |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial, lead-free | Automotive/extended | Automotive/extended, ES silicon | Commercial, ES silicon | Industrial (-40C to 100C) |
| Core Voltage (Nominal) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND - ES silicon | NRND - ES silicon | NRND |
Key Differentiators
- Only Mercury variant with default commercial C8 speed grade for cost-sensitive designs (vs EP1M120F484C7)
- Standard commercial temperature grade matches the majority of indoor cabinet applications (vs EP1M120F484I8N)
- Mid-density Mercury positioning bridges classic CPLD and high-density FPGA (vs EP1K100FC484-2)
Design Notes
The 484-ball FineLine BGA at 1.00 mm pitch requires a minimum of 4 PCB layers for reliable escape routing. Use microvia stackups (laser-drilled 0.1 mm vias on capture pads) for the inner rows, and allocate one solid ground plane directly beneath the device for thermal dissipation and controlled impedance. Power planes should be split to support the four VCCIO banks plus VCCINT (1.8 V core); bypass each supply ball with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the ball, plus a bulk 10 uF tantalum per supply rail.
Do not assume VCCIO bank voltages are interchangeable: this Mercury device supports mixed-voltage I/O with each of the four banks independently powered. A common mistake is tying all VCCIO balls to a single 3.3 V rail, which forces all I/O to 3.3 V and prevents interfacing with 2.5 V or 1.8 V peripherals. Verify each bank's voltage against the connected peripherals before PCB layout finalization. Also, do not omit the EPC1PC8 configuration PROM if your design needs stand-alone power-on configuration - the Mercury device does not retain its SRAM configuration through power cycles without external storage.
Estimated: With all 303 user I/O toggling at 50 MHz and 15 pF load per pin, dynamic power dissipation is approximately 0.5 W (P = 0.5 x C x V^2 x f). At 0.85 V core (VCCINT nominal for Mercury is 1.8 V, dynamic power scales linearly with V^2 so 1.8 V core yields ~1.6 W). The FineLine BGA theta_JA is approximately 15 C/W with standard 4-layer PCB, giving a 24C junction rise above 85C ambient - approaching the 125C maximum. Add thermal vias under the central BGA balls and consider a small heat-spreader for fanless industrial enclosures.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status for the bare EP1M120F484C8 are not stated in the verified web data. The 'N' suffix variant (EP1M120F484C7N) is documented as lead-free; engineers should request specific compliance certificates from distributors for this exact MPN before assembly.