EP1SGX40DF1020C5 - Stratix GX FPGA, 41,250 LE, 624 I/O, FBGA-1020 | Intel
MPN: EP1SGX40DF1020C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4483.16 | $4,483.16 |
| 10 | $4258 | $42,580.00 |
| 25 | $4080 | $102,000.00 |
| 100 | $3850 | $385,000.00 |
| 250 | $3650 | $912,500.00 |
Drop-in alternatives for EP1SGX40DF1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40DF1020C7N
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$315 / Unit
View Datasheet →EP1SGX40DF1020C
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View Datasheet →EP1S40F1020C5
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View Datasheet →EP1S40F1020C5N
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View Datasheet →EP1SGX25DF1020C5
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$1720 / Unit
View Datasheet →EP1SGX40DF1020C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4,125 |
| Total Memory Bits | 3,423,744 |
| Number of I/O | 624 |
| Package | 1020-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Number of Pins | 1020 |
| Speed Grade | 5 |
| Packaging | Tray |
| Mounting Type | Surface Mount (BGA) |
EP1SGX40DF1020C5 1020-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020C5 (1020-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020C5.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C5 is suitable for 6 applications: Telecom Line-Card Signal Processing, Wireless Base-Station Baseband, ASIC Prototyping and Emulation, High-Speed Serial Backplane Aggregation, Test & Measurement Instrumentation, Industrial Imaging and Video Processing.
Telecom Line-Card Signal Processing
The EP1SGX40DF1020C5's 41,250 logic elements, 4,125 LABs, and integrated multi-gigabit transceivers make it a strong fit for telecom line cards where serial backplane protocols such as Serial RapidIO or custom LVDS links run alongside parallel TDM buses. The 624 user I/O pins allow direct connection to parallel data converters, framer ASICs, and clock distribution networks without external bus expanders, reducing BOM cost and signal-path latency. Quartus II supports the Stratix GX IP library for telecom DSP, CRC, and framer functions, enabling rapid development. The 33 x 33 mm FBGA-1020 package is standard for line-card form factors used in ATCA and proprietary backplane designs, and the 1.5 V core supply simplifies legacy power-tree reuse.
Recommended
Wireless Base-Station Baseband
In wireless base-station baseband designs, the EP1SGX40DF1020C5 provides DSP-oriented embedded multiplier blocks, large embedded memory (3,423,744 bits), and multi-gigabit transceivers to interface with ADC/DAC front-ends and CPRI/OBSAI backhaul links. The logic and memory budget supports multi-antenna MIMO processing, channel coding, and crest-factor reduction (CFR) or digital predistortion (DPD) algorithms. The commercial 0-85 °C temperature range suits environmentally controlled base-station enclosures. While the device is obsolete, existing base-station deployments continue to use it where the firmware and toolchain are already validated, with maintenance via safety stock rather than new builds.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP1SGX40DF1020C5 as an ASIC prototyping and emulation vehicle: its 41,250 logic elements, 4,125 LABs, and 624 I/O pins enable large multi-million-gate ASIC designs to be partitioned across multiple Stratix GX devices in a multi-FPGA emulation board. Embedded memory blocks serve as cache/queue emulation, while the multi-gigabit transceivers model high-speed ASIC SERDES interfaces with cycle-accurate fidelity. Quartus II's incremental compilation and LogicLock regions simplify partitioning across FPGAs. Although newer prototyping platforms favor Stratix V or Stratix 10, the EP1SGX40 remains in service for legacy emulation flows where the ASIC RTL is tied to a specific Stratix GX pinout and timing model.
Recommended
High-Speed Serial Backplane Aggregation
Multi-gigabit backplane aggregation in switches and routers leverages the EP1SGX40DF1020C5's integrated transceivers and 624 I/O. The FPGA aggregates multiple 3.125 Gbps or 6.375 Gbps links from line cards and re-times them onto the switch fabric, providing per-port statistics, OAM, and protocol bridging. The 1020-ball FC-FBGA package provides the signal-integrity margin needed for 6+ Gbps SERDES routing, and the 1.5 V core supply aligns with classic switch-ASIC power trees. Designers typically use the Stratix GX ALTGX megafunction in Quartus II to configure the transceivers and the PHY IP for PCI Express, XAUI, or custom protocols.
Recommended
Test & Measurement Instrumentation
Test and measurement platforms (logic analyzers, protocol testers, BERT equipment, oscilloscope acquisition cards) use the EP1SGX40DF1020C5 to combine high-speed serial pattern generation with deep pattern memory, parallel bus capture, and on-board DSP. The 3,423,744 embedded memory bits support large capture buffers and pattern sequences, while the 624 I/O pins and multi-gigabit transceivers deliver both parallel LVDS acquisition and serial stimulus. Quartus II IP for UART, I2C, SPI, and custom serial protocols simplifies instrument front-panel integration. Although the part is obsolete, long-lifecycle test platforms in industrial QA continue to depend on it for spare-part and calibration continuity.
Recommended
Industrial Imaging and Video Processing
Industrial imaging systems - machine vision, medical imaging, broadcast video processing - leverage the EP1SGX40DF1020C5's logic density and embedded memory to implement real-time image pipelines: Bayer demosaicing, color-space conversion, filtering, and compression (JPEG, MPEG, custom). The 624 I/O pins accept high-speed Camera Link, LVDS, or HDMI inputs and drive DDR memory controllers and display outputs. Embedded multipliers accelerate convolution and FFT kernels for image preprocessing. While the part is mature, it remains in service for legacy industrial imaging lines where the firmware stack is qualified and long-term reproducibility is critical.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020C7N | EP1SGX40DF1020C | EP1S40F1020C5 | EP1S40F1020C5N | EP1SGX25DF1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch | 1020-BBGA (FC-FBGA), 33 x 33 mm - same | 1020-BBGA (FC-FBGA), 33 x 33 mm - same | 1020-BBGA (FC-FBGA) - same | 1020-BBGA (FC-FBGA) - same | 1020-BBGA (FC-FBGA) - same |
| Logic Elements | 41,250 | 41,250 (same) | 41,250 (same) | 41,250 (same die class, fewer transceivers) | 41,250 (same) | 25,640 (lower) |
| Number of LABs/CLBs | 4,125 | 4,125 (same) | 4,125 (same) | 4,125 (same) | 4,125 (same) | ~2,565 (lower) |
| Number of I/O | 624 | 624 (same) | 624 (same) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | 5 | 7 (faster) | Unspecified | 5 (same) | 5 (same) | 5 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Operating Temperature | 0 to 85 °C (Commercial) | -40 to 100 °C (Industrial) | [DATA_NEEDED] | 0 to 85 °C (Commercial) | 0 to 85 °C (Commercial) | 0 to 85 °C (Commercial) |
| Lifecycle Status | Obsolete | Active | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Faster speed grade (7) with industrial temperature range, same package (vs EP1SGX40DF1020C7N)
- Same 41,250 LE / 4,125 LAB fabric as the target (vs EP1S40F1020C5)
- Same FBGA-1020 package, lower logic density (vs EP1SGX25DF1020C5)
Design Notes
The EP1SGX40DF1020C5 requires multiple power rails: 1.5 V core, 3.3 V I/O, plus dedicated PLL analog supplies (typically 1.5 V filtered from the core rail) and transceiver analog supplies (1.4 V/2.5 V depending on data rate). Power sequencing must follow Altera's recommended order to avoid latch-up; consult the Stratix GX Device Family Data Sheet, Volume 1, Chapter 4. Use a multi-rail power management IC such as the LTM4644 or similar to reduce BOM and ensure sequencing. Estimated: at 1.5 V core with typical Stratix GX power profile and 50% toggle rate, expect 5-8 W core power plus 0.5-1.5 W per active transceiver channel.
The 1020-ball FC-FBGA package at 1.0 mm pitch demands a high-density PCB with microvia stack-ups (at least 6 layers, 8+ recommended for transceiver signal integrity). Use a 1-2-1 or 1-2-2-1 stack-up with stripline for high-speed SERDES routing, and maintain 100 ohm differential impedance for transceiver channels and 50 ohm single-ended for general-purpose I/O. Place decoupling capacitors on the BGA underside using 0201 or 0402 sizes, one per power pin pair, with via-in-pad if budget allows. The thermal pad is on the package top side; use a heatsink or thermal interface material for designs exceeding 8 W total power.
Common pitfalls: (1) using a 130 nm FPGA in production without planning for obsolescence - the Stratix GX family is obsolete; (2) assuming Quartus Prime supports the device - Quartus II (legacy) is required; (3) ignoring the industrial-temperature variants for non-controlled environments; (4) underestimating configuration time for bitstreams larger than 10 Mbits; (5) forgetting to enable the JTAG chain for boundary-scan test. For new designs, validate the Quartus II version against the device support list before committing to the architecture.
Transceiver channel routing: maintain length matching within 0.127 mm (5 mil) for differential pairs, avoid right-angle bends (use 45-degree or curved), keep vias to a minimum (max 2 per channel), and isolate from noisy digital signals with a continuous ground reference plane. Each transceiver channel typically requires 4-6 PCB layers in its routing region. Reference the Altera Stratix GX Transceiver Layout Guide for detailed routing topologies, breakout patterns, and AC-coupling capacitor placement near the FPGA pin.
Compliance Information
Compliance status not present in verified web data; manufacturer page and 2003-era Stratix GX datasheet do not explicitly state RoHS/REACH. Mark as unknown pending manufacturer confirmation. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Designers in regulated industries should request compliance documentation directly from Intel.
