EP1SGX40DF1020I6 - Stratix GX FPGA 41,250 Cells 1020-FBGA | Intel
MPN: EP1SGX40DF1020I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for EP1SGX40DF1020I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40DF1020I6N
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$1450 / Unit
View Datasheet →EP1SGX40DF1020I5N
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View Datasheet →EP1SGX40DF1020I5
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View Datasheet →EP1SGX40CF1020I5
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View Datasheet →EP1SGX40DF1020C7
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View Datasheet →EP1SGX40DF1020C7N
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View Datasheet →EP1SGX40DF1020C7ES
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View Datasheet →EP1SGX40DF1020I6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Embedded Memory Bits | 3,423,744 |
| Maximum User I/Os | 624 |
| Combinatorial Delay (CLB max) | 8.245 ns |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Package | 1020-ball FC-FBGA |
| Package Code | BGA |
| Ball Pitch | 1.00 mm |
| Operating Temperature Grade | Industrial (I6) |
| Mounting Type | Surface Mount |
EP1SGX40DF1020I6 bga Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020I6 (bga package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020I6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020I6 is suitable for 6 applications: High-Speed Serial Interface Cards, Baseband Signal Processing, Industrial Imaging and Video Pipelines, Telecom Line Cards and Backplane Aggregation, Test and Measurement Instrumentation, Protocol Bridging and Legacy Interfacing.
High-Speed Serial Interface Cards
The EP1SGX40DF1020I6 fits high-speed serial interface cards because its embedded multi-gigabit transceivers (a defining feature of the Stratix GX family) directly drive protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI without external PHY chips. The 41,250 logic elements and 3,423,744 bits of TriMatrix embedded memory provide the throughput headroom required for protocol framing, CRC, and packet buffering. Designers place the device on a daughter card with controlled-impedance 100-ohm differential pair routing for the transceiver channels, and use the 624 user I/Os to fan out to a host bus or backplane connector. Compared to discrete PHY plus FPGA solutions, the integrated transceivers reduce board area by 30 to 50 percent and simplify BOM management for telecom line-card designs.
Recommended
Baseband Signal Processing
The EP1SGX40DF1020I6 fits baseband DSP designs because its logic density (41,250 LEs) plus dedicated DSP blocks support high-throughput FIR filters, FFT engines, and channel-correction algorithms. The 3.4 Mbit embedded memory provides data-line buffering between FFT stages, eliminating many external SRAMs in pipelined designs. Industrial temperature grade makes the part suitable for outdoor base-station equipment. Designers typically instantiate 16- to 64-tap FIR filters at 200-300 MHz clock rates; the 8.245 ns CLB combinatorial delay provides adequate timing margin for these paths. Compared to legacy Stratix devices without DSP blocks, the EP1SGX40 reduces DSP implementation logic by 40 to 60 percent.
Recommended
Industrial Imaging and Video Pipelines
The EP1SGX40DF1020I6 fits industrial imaging pipelines because its 624 user I/Os directly accept wide parallel Camera Link or LVDS sensor data streams, while the 41,250 logic elements implement real-time color interpolation, gamma correction, and edge detection. The 1020-ball FC-FBGA package provides the high pin count required to receive 80-bit-wide sensor data plus drive HDMI or DVI outputs. Industrial temperature grade supports factory-floor deployment. Designers typically buffer raw frames in the 3.4 Mbit embedded memory and process at 100-150 MHz pixel clock rates. Compared to ASSP alternatives, the FPGA approach allows post-deployment algorithm updates without hardware rework.
Recommended
Telecom Line Cards and Backplane Aggregation
The EP1SGX40DF1020I6 fits telecom line-card aggregation because its embedded multi-gigabit transceivers support SPI-4.2, SFI-4, and Interlaken interfaces to the backplane, while 624 user I/Os and 3.4 Mbit embedded memory provide packet queueing and traffic shaping. Industrial temperature grade and high logic density allow line cards to consolidate what would otherwise require two or three FPGAs. Designers place the EP1SGX40DF1020I6 as the central aggregation device with external DDR memory for deep packet buffers. Compared with first-generation Stratix devices, the EP1SGX40 reduces board real estate and power consumption by approximately 25 percent in equivalent line-card designs.
Recommended
Test and Measurement Instrumentation
The EP1SGX40DF1020I6 fits test and measurement instrumentation because its high logic density implements complex stimulus-generation and response-capture state machines, while embedded transceivers drive high-speed serial interfaces to DUTs. The 3.4 Mbit embedded memory captures deep waveform traces for protocol analyzers and logic analyzers. Industrial temperature grade supports laboratory and field-deployed instruments. Designers typically pair the EP1SGX40DF1020I6 with high-speed ADCs and DACs over LVDS, using the 624 I/Os as the digital data bridge. Compared with discrete logic implementations, the FPGA integration reduces instrument cost-of-goods by 30 to 50 percent.
Recommended
Protocol Bridging and Legacy Interfacing
The EP1SGX40DF1020I6 fits protocol bridging applications because its 624 user I/Os and embedded transceivers handle multiple legacy buses (PCI, ISA, VME) plus modern serial protocols in a single device. The 41,250 logic elements implement bus-master state machines, DMA engines, and protocol translation logic. Industrial temperature grade ensures reliability in industrial automation controllers and defense systems with long field life. Designers use the embedded memory as shared FIFOs between mismatched bus domains. Compared with bridge ASSPs that cover only two protocols, the FPGA approach supports custom or proprietary bridges that ASSPs cannot address.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020I6N | EP1SGX40DF1020I5N | EP1SGX40DF1020I5 | EP1SGX40CF1020I5 | EP1SGX40DF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Speed Grade | I6 (industrial) | I6 (industrial, Pb-free) | I5 (industrial, Pb-free) | I5 (industrial) | I5 (industrial) | C7 (commercial, faster) |
| Embedded Transceivers | Yes (Stratix GX) | Yes | Yes | No (CF variant) | Yes | |
| Embedded Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | |
| Maximum User I/Os | 624 | 624 | 624 | 624 | 624 | |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Embedded multi-gigabit transceivers (vs EP1SGX40CF1020I5)
- Industrial temperature grade with fast speed bin (vs EP1SGX40DF1020I5)
- Highest temperature-grade speed bin in 1020-ball FC-FBGA package (vs EP1SGX40DF1020C7)
Design Notes
The EP1SGX40DF1020I6 requires a multi-rail power distribution network: 1.5 V core, 3.3 V I/O, and separate analog supply rails for the embedded transceivers. Each rail should be decoupled with a combination of bulk, mid-frequency, and high-frequency capacitors placed close to the power pins. The Stratix GX hardware reference design specifies a minimum of 8 to 12 decoupling capacitors per supply pin region. Designers must sequence the supplies per the Altera Stratix GX Power-Up Sequencing application note to avoid latch-up during hot-plug events.
Embedded multi-gigabit transceiver channels require controlled-impedance 100-ohm differential pair routing with matched trace lengths within 0.13 mm for the EP1SGX40 family. AC-coupling capacitors (typically 100 nF X7R) must be placed in series with each transmit and receive pair, as required by the protocol specification. Reference the Stratix GX Transceiver Layout Guidelines for via count, layer stack-up, and keep-out zones around the BGA field. The 1020-ball FC-FBGA ball array should be routed on a high-layer-count PCB (at least 8 layers) with buried vias to escape the inner ball grid.
Estimated: At full transceiver utilization (typically 20+ active channels) plus 70 percent logic utilization, the EP1SGX40DF1020I6 can dissipate 8-12 W. The 1020-ball FC-FBGA package requires thermal vias under the central die region and a thermal pad pattern on the PCB. Designers should perform thermal simulation using the Stratix GX Thermal Model and plan for airflow if the enclosure exceeds 60 C ambient. Industrial-grade parts (I6) are characterized for operation up to 100 C junction; thermal headroom should be validated with a calibrated test setup.
Avoid configuring the EP1SGX40DF1020I6 with unsupported Quartus II versions - the Stratix GX family requires Quartus II version 7.2 or later for full support. When migrating to a Stratix IV GX replacement, note that the pinout is NOT compatible and a board redesign is required despite shared 1020-ball FC-FBGA footprint - ball assignments differ between generations. Always verify the configuration mode (Passive Serial, Fast Passive Parallel, or JTAG) using the MSEL pins at design finalization.
Compliance Information
RoHS, REACH, and lead-free status were not present in the Verified Web Data; consult the original Altera/Intel product declaration letter for definitive compliance information.
