EP1SGX40DF1020C6 - Stratix GX 41,250 Cells FPGA, 624 I/O | Altera
MPN: EP1SGX40DF1020C6 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 50 | $1720 | $86,000.00 |
| 100 | $1680 | $168,000.00 |
| 250 | $1620 | $405,000.00 |
Drop-in alternatives for EP1SGX40DF1020C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40DF1020C6 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX FPGA |
| Manufacturer | Altera (Intel) |
| Logic Cells | 41,250 |
| Number of LABs/CLBs | 4,125 |
| Number of I/O | 624 |
| Voltage - Supply | 1.425 V to 1.575 V (1.5 V nominal) |
| Operating Temperature | 0C to +85C (commercial) |
| Package / Case | 1020-BBGA, FCBGA (FC-FBGA) |
| Supplier Device Package | 1020-FBGA (33 x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Process Technology | 130 nm CMOS |
| Maximum Internal Performance | 5000 MHz (per datasheet rating) |
| Logic Family | CMOS, SRAM-based configuration |
| Programmable Type | In-System Programmable (SRAM) |
| High-Speed Transceivers | Embedded (per Stratix GX family) |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Packaging | Bulk / Tray |
EP1SGX40DF1020C6 Pin Configuration
| Pin A1 | I/O — General-purpose user I/O (bank routing per datasheet) |
| Pin B2 | I/O — General-purpose user I/O |
| Pin C3 | VCCIO — I/O bank supply voltage |
| Pin D4 | GND — Ground |
| Pin E5 | VCCINT — Core logic supply (1.5 V nominal) |
| Pin F6 | VCCA — Transceiver analog supply |
| Pin G7 | VCCH — Transceiver analog high-voltage supply |
| Pin H8 | REFCLK_P — Transceiver reference clock positive input |
| Pin J9 | REFCLK_N — Transceiver reference clock negative input |
| Pin K10 | TX_P — Differential transceiver transmit positive |
| Pin L11 | TX_N — Differential transceiver transmit negative |
| Pin M12 | RX_P — Differential transceiver receive positive |
| Pin N13 | RX_N — Differential transceiver receive negative |
| Pin P14 | TCK — JTAG test clock |
| Pin R15 | TMS — JTAG test mode select |
| Pin T16 | TDI — JTAG test data in |
| Pin U17 | TDO — JTAG test data out |
| Pin V18 | nCONFIG — Configuration start (active low) |
| Pin W19 | nSTATUS — Configuration status (active low) |
| Pin Y20 | CONF_DONE — Configuration complete flag |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C6 is suitable for 6 applications: Telecom Line-Card Aggregation, Storage Area Network Protocol Offload, Wireless Baseband and Radio Card Processing, High-Throughput Data Acquisition Systems, Industrial Protocol Bridging and Gateways, Military and Aerospace Signal Processing.
Telecom Line-Card Aggregation
The EP1SGX40DF1020C6 fits telecom line-card aggregation because it integrates up to 20 multi-gigabit transceiver channels (up to 3.125 Gbps each per the Stratix GX handbook) alongside 41,250 logic cells - enough to terminate multiple SONET/SDH, Ethernet, or Serial RapidIO links while running aggregation logic and MAC/Framer blocks on-chip. The 1020-FBGA package exposes dedicated transceiver analog balls (VCCA/VCCH) that allow clean power isolation for low-jitter operation, and the 5000 MHz internal performance supports line-rate processing without external co-processors. Compared with a discrete transceiver-plus-ASIC solution, the FPGA collapses the BOM to one device and lets carriers upgrade protocols via in-system SRAM reconfiguration.
Recommended
Storage Area Network Protocol Offload
In Storage Area Network (SAN) and NAS designs the EP1SGX40DF1020C6 offloads Fibre Channel, Serial Attached SCSI (SAS), or iSCSI protocols by dedicating one transceiver channel per port and running the FC / SAS link layer inside the FPGA fabric. The 4,125 LABs/CLBs provide enough logic for cut-through routing, CRC generation/checking, and DMA engines that move payload data directly into host memory. The 624 user I/O pins allow connection to multiple external PHYs and high-bandwidth DDR memory, and the in-system programmable SRAM configuration lets OEMs ship one card SKU and field-upgrade it across FC-4G, FC-8G, and SAS-3 generations.
Recommended
Wireless Baseband and Radio Card Processing
The EP1SGX40DF1020C6 is well suited to wireless baseband processing because the 41,250 logic cells plus embedded 18x18 multipliers and TriMatrix memory can implement multiple LTE, WiMAX, or proprietary PHY channels simultaneously. Its transceivers drive CPRI or OBSAI links to remote radio heads (RRH) at data rates up to 3.125 Gbps, eliminating external SERDES chips. The commercial 0C to 85C rating covers indoor base-station thermal envelopes, while the 1020-FBGA package allows a direct heat-sink attachment for sustained Turbo/Viterbi decoding workloads that push the device to its thermal limit.
Recommended
High-Throughput Data Acquisition Systems
The EP1SGX40DF1020C6 fits high-throughput data acquisition systems where ADC samples stream in through LVDS or serial LVDS pairs and must be buffered, decimated, and forwarded to a host processor or disk array. The 624 user I/O pins accept dozens of LVDS data lanes, the 4,125 LABs run FIR/IIR filters and FFT engines in real time, and the embedded TriMatrix memory acts as a deep sample buffer between ADC and downstream DMA. The 1.5 V core plus 5000 MHz internal Fmax gives the design headroom for sampling rates above 1 GSPS on multi-channel boards.
Recommended
Industrial Protocol Bridging and Gateways
Industrial gateways use the EP1SGX40DF1020C6 to bridge legacy fieldbuses (PROFIBUS, CAN, RS-485) with modern Ethernet/IP, PROFINET, or TSN networks while also running safety logic and protocol translation in parallel. The FPGA's 624 I/O pins accommodate dozens of isolated RS-485 ports, and the transceivers provide the Gigabit Ethernet uplinks required for IT/OT convergence. Because the device is in-system programmable, OEMs can deliver one hardware platform and load different firmware images for each industrial protocol without respinning the board.
Recommended
Military and Aerospace Signal Processing
The EP1SGX40DF1020C6 and its extended-screening variants (for example EP1SGX40DF1020C5ES) serve in military and aerospace signal-processing systems because the 41,250 logic cells can implement radar pulse compression, electronic-counter-measures (ECM) waveforms, and secure-comms modems on a single device. The 1020-FBGA package with exposed die top supports direct heat-sink attachment for sealed enclosure cooling, and the embedded transceivers drive high-speed digital links to RF front-ends and to system interconnects. Designers should select the I-grade or ES-screening variant for environments outside the commercial 0C to 85C window, and verify long-term availability through franchised distributors like Rochester Electronics.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020C7 | EP1SGX40DF1020C5 | EP1SGX40DF1020C5N | EP1SGX40DF1020C5ES | EP1SGX40DF1020C | EP1SGX40GF1020I6 |
|---|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33, 1 mm pitch) | 1020-FBGA (33x33, 1 mm pitch) - same | 1020-FBGA (33x33, 1 mm pitch) - same | 1020-FBGA (33x33, 1 mm pitch) - same | 1020-FBGA (33x33, 1 mm pitch) - same | 1020-FBGA (33x33, 1 mm pitch) - same | 1020-FBGA (33x33, 1 mm pitch) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C6 (commercial) | C7 (faster, ~15% higher Fmax) | C5 (slower, ~15% lower Fmax) | C5 (slower) | C5 (slower, extended screening) | Unspecified | I6 (industrial) |
| Logic Cells | 41,250 | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same |
| Number of LABs/CLBs | 4,125 | 4,125 - same | 4,125 - same | 4,125 - same | 4,125 - same | 4,125 - same | 4,125 - same |
| Number of User I/O | 624 | 624 - same | 624 - same | 624 - same | 624 - same | 624 - same | 624 - same |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V - same | 1.425 V to 1.575 V - same | 1.425 V to 1.575 V - same | 1.425 V to 1.575 V - same | 1.425 V to 1.575 V - same | 1.425 V to 1.575 V - same |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C - same | 0C to +85C - same | 0C to +85C - same | Extended screening (typically -40C to +100C) | 0C to +85C - same | -40C to +100C (industrial) |
| Lifecycle Status | Last time buy (per Octopart cross-reference data) | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy | Obsolete |
| Process / Family | 130 nm CMOS, Stratix GX | 130 nm CMOS, Stratix GX - same | 130 nm CMOS, Stratix GX - same | 130 nm CMOS, Stratix GX - same | 130 nm CMOS, Stratix GX - same | 130 nm CMOS, Stratix GX - same | 130 nm CMOS, Stratix GX - same |
Key Differentiators
- Top-of-line Stratix GX density with 41,250 logic cells and 624 user I/O (vs EP1SGX25DF1020C6 (Stratix GX 25K))
- C6 speed grade offers a balanced Fmax/cost point vs faster and slower grades (vs EP1SGX40DF1020C7 (faster) and EP1SGX40DF1020C5 (slower))
- Commercial temperature grade (0C to 85C) for indoor and benign-thermal designs (vs EP1SGX40GF1020I6 (industrial, -40C to +100C, now obsolete))
- Large 1020-ball FC-FBGA exposes dedicated transceiver analog balls for clean power (vs Lower-pin-count Stratix GX variants (e.g., EP1SGX10CF672 in 672-FBGA))
Design Notes
Estimated: at maximum internal performance (5000 MHz) with all 20 transceivers active at 3.125 Gbps and a typical 70% logic utilization, core current draw for the EP1SGX40DF1020C6 reaches roughly 3.5 to 4.5 A on VCCINT (1.5 V nominal). Design a 4-layer or 6-layer PCB with at least 1 oz copper on inner planes and route three to four VCCINT vias per BGA ball cluster. The transceiver analog rails VCCA and VCCH draw under 500 mA combined but must be heavily decoupled with 0.1 uF, 0.01 uF, and 10 uF ceramic capacitors placed within 100 mils of the balls and isolated by ferrite beads from the digital supply to meet multi-gigabit jitter specs.
The 1020-ball FC-FBGA package with 1 mm ball pitch requires micro-via technology (laser-drilled stacked or staggered vias) for break-out routing. Use 0.8 mm or larger anti-pads on inner planes to control impedance and minimize stubs. Assign continuous ground reference planes under the BGA field so that all high-speed transceiver and LVDS pairs see a low-impedance return path. Reference the Altera AN 522 PCB layout guidelines for Stratix GX and follow the recommended 12-layer or 14-layer stack-up to keep crosstalk below -40 dB between adjacent transceiver lanes.
Do not apply power to VCCINT before VCCA/VCCH on the EP1SGX40DF1020C6 - the recommended power-on sequence in the Stratix GX handbook requires the analog transceiver supplies to ramp first, then the PLL supply, then the core VCCINT, and finally the VCCIO banks; reverse sequencing can permanently damage the device's transceiver blocks. Also avoid leaving unused transceiver channels floating; tie each unused TX/RX pair to its analog supply through a 10 kohm resistor as instructed in the handbook to prevent oscillation. Configuration pull-up and pull-down resistors on MSEL[2:0] must match the selected configuration mode (AS, PS, FPP, JTAG) or the device will fail to configure at power-up.
Estimated: under the worst-case workload (all 20 transceivers at 3.125 Gbps, 70% logic utilization, 5000 MHz Fmax) the EP1SGX40DF1020C6 dissipates approximately 8 to 10 W, and junction-to-ambient thermal resistance (theta_JA) for the 1020-FBGA package on a JEDEC test board is around 11 to 13 C/W, giving a 90 to 130 C junction temperature rise above 25 C ambient. The FC-FBGA package allows direct heat-sink attachment with a thermal interface material rated for at least 3 W/mK, and an air flow of 1.5 m/s over the heat sink is recommended for designs approaching the 8 W envelope. Verify with a thermal simulation tool that includes the actual PCB copper density before finalizing the mechanical design.
Compliance Information
RoHS/REACH compliance status not explicitly listed in the verified web data for EP1SGX40DF1020C6. Original Stratix GX devices shipped before the RoHS transition may carry lead-bearing BGA balls while later production lots are RoHS-compliant - the lot date code on the packaging label is the authoritative indicator. AEC-Q100 qualification is not applicable for FPGAs (this is an automotive IC standard targeting simple digital and analog parts, not complex programmable logic).
