EP1SGX40GF800I5N - Stratix GX 40K LEs FPGA | Intel / Altera | 800-pin FBGA
MPN: EP1SGX40GF800I5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1390 | $1,390,000.00 |
EP1SGX40GF800I5N Overview
What is a Stratix GX FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic, memory blocks, and high-speed serial interfaces in a single device. Stratix GX is Intel/Altera's family that embeds dedicated multi-gigabit transceivers (MGTs) supporting protocols such as Gigabit Ethernet, PCI Express, Serial RapidIO, XAUI, and Fibre Channel up to 3.125 Gbps per channel. FPGAs sit hierarchically within programmable logic -> reconfigurable computing -> digital ICs -> semiconductors.
Key features of the EP1SGX40GF800I5N include 20 transceiver channels with embedded 8B/10B encoding and clock data recovery (CDR), up to 376 user I/O pins across 11 I/O banks, dedicated DDR memory interface circuitry, and Stratix DSP blocks for high-throughput signal processing. The -5 speed grade targets higher internal clock frequencies compared to -6/-7 grades at the cost of typical internal logic performance trade-offs.
Architecturally the device combines a logic fabric of adaptive logic modules (ALMs), TriMatrix embedded memory (MRAM blocks), DSP blocks, and MGT channels arranged around a high-bandwidth multi-track interconnect. Internal configuration uses SRAM cells, requiring an external configuration device such as the EPC16 or EPCS family for in-system programming. JTAG (IEEE 1149.1) supports boundary-scan test and in-circuit programming.
Typical applications for the EP1SGX40GF800I5N include multi-gigabit serial backplane designs, edge routers, telecom line cards, military/aerospace signal processing, and prototyping of PCI Express endpoints. Industrial-grade temperature rating and 20 transceivers make it suitable for ruggedized communications platforms requiring high channel density.
Design considerations include careful power-rail decoupling for each MGT supply (VCCA, VCCP, VCCH), matched-length differential routing on all serial channels, and thermal management via the exposed-die FBGA substrate. FPGA bitstream encryption via AES is recommended for production deployments.
This page synthesizes distributor pricing, drop-in package alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP1SGX40GF800I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1SGX40GF800I5N (same form factor and footprint) — differing in Package, Speed Grade, Embedded Memory, Logic Elements, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF800C5N
✅ Drop-In✓ In Stock
$198.75 / Unit
View Datasheet →EP1SGX40GF800C7N
✅ Drop-In✓ In Stock
$110 / Unit
View Datasheet →EP1SGX40GF1020I5N
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP1SGX40CF672I5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$370 / Unit
View Datasheet →EP1SGX25FF800I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$128.4 / Unit
View Datasheet →EP1S40F780I6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$305 / Unit
View Datasheet →EP1SGX40GF800I5N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 LEs |
| Equivalent LEs | 41,250 |
| Embedded Memory | 3.42 Mbit |
| Total RAM Bits | 3,423,744 bits |
| Multi-Gigabit Transceivers | 20 channels |
| Maximum User I/O | 376 |
| I/O Banks | 11 |
| Package | 800-pin FBGA (FineLine BGA) |
| Speed Grade | -5 (faster) |
| Operating Temperature (Junction) | -40C to +100C (industrial) |
| Process Node | 130 nm |
| Supply Voltage - Core (VCCINT) | 1.5 V |
| Configuration Mode | SRAM, JTAG, EPC16/EPCS |
EP1SGX40GF800I5N 800-pin fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP1SGX40GF800I5N (800-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF800I5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1SGX40GF800I5N is suitable for 7 applications: Multi-Gigabit Serial Backplane, Telecom Line Card / Edge Router, PCI Express Endpoint / Root Complex, Military / Aerospace Signal Processing, Video Broadcast / Studio Equipment, Industrial Automation Controller, Test & Measurement Instrumentation.
Multi-Gigabit Serial Backplane
The EP1SGX40GF800I5N's 20 multi-gigabit transceiver (MGT) channels, each capable of 3.125 Gbps with embedded 8B/10B encoding and CDR, make it ideal for high-density backplane designs such as ATCA, MicroTCA, and proprietary SERDES fabrics. Placing 10 channels on each port direction supports full-duplex protocols like XAUI (4 lanes per link), 10G Ethernet (4 channels per 10G link), Serial RapidIO, and PCI Express. The 376 user I/O pins handle parallel sideband signals, control registers, and management interfaces. Unlike pure logic FPGAs, the integrated MGTs eliminate external PHY chips, simplifying BOM and reducing PCB area. Power-supply decoupling for VCCA/VCCP/VCCH must be tightly designed; reference Stratix GX Device Handbook chapter 4 for MGT PCB layout guidelines.
Recommended
Telecom Line Card / Edge Router
Edge routers and telecom line cards aggregate multiple 1G/10G Ethernet links and require packet processing, traffic shaping, and protocol bridging. The EP1SGX40GF800I5N's 41,250 LEs deliver sufficient logic for IPv4/IPv6 forwarding tables, QoS engines, and encryption accelerators, while 20 MGT channels connect to SFP/SFP+ cages or backplane SERDES. Industrial -40C to +100C junction temperature supports outdoor cabinet deployment. The 3.42 Mbit embedded RAM buffers packet bursts between PHY and switch fabric ASIC. Compared to non-GX Stratix, the integrated transceivers reduce BOM cost by ~30% and PCB area by ~25% per port. Pair with an external TCAM for L2/L3 lookup acceleration.
Recommended
PCI Express Endpoint / Root Complex
Implementing PCI Express Gen1 (2.5 Gbps) endpoints or root complexes requires at least 4 MGT lanes per x4 link, with the EP1SGX40GF800I5N supporting up to 5 x4 links or 1 x16 link (16 lanes) plus sideband connections. Hard PCI Express IP cores from Intel/Altera handle transaction layer, data link layer, and physical layer, freeing LE resources for application logic. The 800-ball FBGA provides dedicated PERn/PETn lane routing with matched-impedance ball breakout, critical for Gen1 signal integrity. Industrial temp grade supports server NIC, HBA, and storage controller applications. Designers must implement reference clock distribution per the Stratix GX PCIe user guide.
Recommended
Military / Aerospace Signal Processing
Defense and aerospace platforms demand ruggedized FPGAs with extended temperature operation and high serial bandwidth for radar, electronic warfare, and satellite communications. The EP1SGX40GF800I5N's -40C to +100C industrial temperature range and 20 MGT channels support phased-array radar beamforming, where each antenna element connects via a dedicated transceiver. The 41,250 LEs host FFT engines, digital down-conversion, and pulse compression algorithms. The 800-ball FBGA is available with MIL-STD-883 screening through Altera/Intel's military partner network. Bitstream encryption via the EPC16 with AES prevents reverse engineering of classified algorithms.
Recommended
Video Broadcast / Studio Equipment
SDI (Serial Digital Interface) video routers and broadcast switchers require multi-rate serial I/O up to 3 Gbps for HD-SDI and 6 Gbps emerging standards. The EP1SGX40GF800I5N's MGT channels handle SDI physical-layer receive/transmit with on-chip clock recovery, while the 41,250 LEs implement video format conversion, embedding, and multiplexing. The 800-ball FBGA supports up to 376 parallel GPIO for control panel interfaces, tally lights, and audio embedding. Industrial temp rating ensures reliable operation in mixed-temperature broadcast studios. Designers can leverage reference designs from the Altera Broadcast IP library.
Recommended
Industrial Automation Controller
Factory automation controllers interconnect EtherCAT, PROFINET, SERCOS III, and proprietary fieldbus networks, all of which require real-time deterministic serial communication. The EP1SGX40GF800I5N's 20 MGT channels can host multiple EtherCAT masters or PROFINET IRT controllers simultaneously, while the 41,250 LEs run motion control algorithms and PLC logic. The industrial temperature grade and 800-ball FBGA with controlled-impedance ball breakout ensure reliable operation on the factory floor. The 3.42 Mbit embedded RAM buffers deterministic I/O updates with sub-microsecond jitter. Designers should use Altera's Industrial Ethernet IP cores for protocol compliance.
Recommended
Test & Measurement Instrumentation
High-speed oscilloscopes, protocol analyzers, and bit-error-rate testers require multi-channel serial data acquisition at 1-3 Gbps rates. The EP1SGX40GF800I5N's 20 MGT channels capture parallel serial streams with hardware-accelerated pattern matching and CDR, while the 41,250 LEs implement trigger logic, statistics counters, and protocol decoding. The 800-ball FBGA provides 376 GPIO for front-panel display interfaces and trigger I/O. Industrial temp rating supports bench and portable instrument deployments. The large embedded RAM (3.42 Mbit) captures deep trace buffers without external memory. Designers should reference Altera's Transceiver Toolkit for signal integrity characterization.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF800I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF800C5N | EP1SGX40GF800C7N | EP1SGX40GF1020I5N | EP1SGX40CF672I5 | EP1SGX25FF800I5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 800-pin FBGA | 800-pin FBGA (same) | 800-pin FBGA (same) | 1020-ball FBGA (larger) | 672-ball FBGA (smaller) | 800-pin FBGA (same) |
| Logic Elements | 41,250 LEs | 41,250 LEs (same) | 41,250 LEs (same) | 41,250 LEs (same) | 41,250 LEs (same) | 25,660 LEs (-38%) |
| Speed Grade | -5 (fastest) | -5 (same) | -7 (slower) | -5 (same) | -5 (same) | -5 (same) |
| Temperature Range | -40C to +100C (industrial) | 0C to +100C (commercial) | 0C to +100C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Embedded RAM | 3.42 Mbit | 3.42 Mbit (same) | 3.42 Mbit (same) | 3.42 Mbit (same) | 3.42 Mbit (same) | 2.21 Mbit (-35%) |
| Lifecycle Status | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy |
Key Differentiators
- Industrial temperature grade with 20 MGT channels (vs EP1SGX40GF800C5N)
- Fastest -5 speed grade for maximum Fmax (vs EP1SGX40GF800C7N)
- 800-ball FBGA with 376 user I/Os vs larger 1020-ball (vs EP1SGX40GF1020I5N)
- Higher density 41,250 LEs vs 25,660 LEs (vs EP1SGX25FF800I5N)
Design Notes
The EP1SGX40GF800I5N requires multiple power rails: VCCINT (1.5V core), VCCIO (per-bank 1.5V/1.8V/2.5V/3.3V), and dedicated MGT supplies VCCA (1.5V analog), VCCP (1.5V PLL), and VCCH (1.5V/1.8V TX driver). Estimated power consumption with 20 active MGT channels at 3.125 Gbps is approximately 15-20W. Designers must place 0.1uF MLCC bypass capacitors within 100 mils of every supply ball, plus bulk decoupling on each rail. Voltage regulators with ±3% tolerance and remote-sense feedback are recommended to compensate for PCB IR drops. Reference the Stratix GX PowerPlay Early Power Estimator (EPE) spreadsheet for accurate budgeting.
The 800-ball FBGA requires a minimum 4-layer PCB stackup with continuous ground plane beneath the device for signal integrity and thermal dissipation. MGT lane traces must use 100-ohm differential impedance with matched-length (±5 mil) skew control within a pair and across lanes. AC-coupling capacitors (0.01uF) are required on each TX/RX pair and should be placed within 600 mils of the FPGA ball. Reference the Stratix GX Device Handbook, Chapter 4, for detailed PCB layout guidelines including via-in-pad recommendations, ground via stitching, and break-out routing constraints.
Estimated: at full MGT utilization (20 channels at 3.125 Gbps) plus 70% LE utilization, total power reaches ~18W. With the FBGA's junction-to-ambient thermal resistance theta_JA of approximately 8-10 C/W on a 4-layer JEDEC test board, junction temperature rises 144-180C above ambient - exceeding the 100C industrial limit. Designers must implement a thermal management strategy: 1) maximize top-side cooling with forced airflow (>= 200 LFM), 2) use thermal vias under the die to conduct heat to internal copper planes, and 3) consider a heat spreader attached via thermal interface material. Reference the Altera Thermal Management application note (AN 358) for package-specific thermal data.
Common pitfalls with EP1SGX40GF800I5N designs: 1) Insufficient MGT reference clock distribution - each MGT bank requires its own low-jitter reference clock; use a dedicated clock buffer like CDCE62005 or similar; 2) Forgetting the external configuration device (EPC16 or EPCS) - SRAM FPGAs require configuration at every power-up; 3) Using incorrect speed grade assumptions - the -5 grade is fastest, but internal logic timing closure still requires SDC constraints in Quartus II; 4) Ignoring bitstream encryption for production - enable AES encryption in the EPC16 to protect IP; 5) Mismatched I/O standards on shared banks - all pins in an I/O bank must use the same VCCIO voltage.
Pin assignments must be planned early because the 800-ball FBGA has limited escape routing flexibility. Use the Quartus II Pin Planner or older legacy tool to assign MGT lanes to specific ball locations that align with your PCB layer stackup. Place the FPGA centrally on the board with shortest possible connections to MGT connectors (SFP+, backplane). Keep high-speed differential traces on the top layer or buried stripline layers with continuous reference planes. Avoid routing MGT signals across plane splits or noisy power regions. Maintain at least 3W (3x trace width) spacing between adjacent MGT lanes to minimize crosstalk.
Compliance Information
Compliance data not present in verified web sources; Altera/Intel legacy datasheet does not explicitly state RoHS for this -5 industrial variant. Recommend checking the official Intel/legacy Altera product declaration for definitive compliance information before production use.
