EP1S40F780I6 - Stratix FPGA 41250 Cells 780-FBGA | Intel
MPN: EP1S40F780I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $330 | $165,000.00 |
| 1,000 | $305 | $305,000.00 |
EP1S40F780I6 Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture comprises an array of configurable logic blocks (CLBs / LABs), programmable routing channels, dedicated DSP blocks, embedded memory blocks, and high-speed transceiver lanes, all controlled by a configuration bitstream loaded at power-up. Within the broader semiconductor hierarchy, an FPGA sits between fixed-function ASICs (lower NRE, higher unit cost at volume) and CPLDs (lower density, non-volatile), offering hardware-level parallelism with re-programmability, making it well-suited to digital signal processing, high-speed interfacing, and prototyping workflows where design iteration is required.
Key features of the EP1S40F780I6 include 4,125 Logic Array Blocks (LABs) supporting up to 41,250 logic elements, dedicated embedded multiplier blocks for DSP arithmetic, embedded TriMatrix memory delivering approximately 3.42 Mbits of on-chip RAM, and a high-performance external memory interface supporting DDR, DDR-II, QDR, and RLDRAM. The device supports configuration via passive serial, passive parallel, fast passive parallel, active serial, and JTAG modes, and integrates on-chip termination (OCT) for clean high-speed signal integrity. Per-device phase-locked loops (PLLs) provide flexible clock synthesis and distribution.
Architecturally, the Stratix family introduced a multi-level interconnect hierarchy and dedicated DSP blocks optimized for high-throughput arithmetic, allowing deterministic timing closure on complex pipelines. The 780-pin FineLine BGA exposes 615 user I/O pins, supporting LVDS, LVPECL, SSTL, HSTL, and other high-speed differential and single-ended I/O standards, with each I/O bank configurable for a dedicated voltage reference.
Typical applications include digital signal processing and baseband prototyping, high-throughput data acquisition front-ends, telecommunications line cards, video and image processing pipelines, military and aerospace signal processing platforms, and ASIC prototyping for SoC verification. The industrial temperature grade extends deployment to factory automation, transportation systems, and outdoor communication equipment.
A key design consideration for the EP1S40F780I6 is multi-rail power sequencing: core (1.5 V), I/O banks (multiple voltages), PLL analog supply, and auxiliary supply must be ramped in the order specified in the device handbook to avoid latch-up. The 780-pin flip-chip BGA also requires a high-layer-count PCB with microvia technology and matched-impedance routing for the DDR memory interface.
This page synthesizes distributor pricing, verified Stratix-family drop-in alternatives from the Site MPN list, and practical design notes not found on individual distributor product pages, providing a consolidated engineering reference for the EP1S40F780I6.
Drop-in alternatives for EP1S40F780I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S40F780I6 (same form factor and footprint) — differing in Package, Speed Grade, Logic Elements, Embedded Memory, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F780C8N
✅ Drop-In✓ In Stock
$130 / Unit
View Datasheet →EP1S40F780C8
✅ Drop-In✓ In Stock
$820 / Unit
View Datasheet →EP1S40F780C7N
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP1S40F780C7
✅ Drop-In✓ In Stock
$1150 / Unit
View Datasheet →EP1S40F780C6
✅ Drop-In✓ In Stock
$125 / Unit
View Datasheet →EP1S40F780C5
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP1S30F780I6
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP1S40F780I6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Series | EP1S40 |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Embedded Memory | 3,423,744 bits (approx. 3.42 Mbit) |
| User I/O Pins | 615 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 450.05 MHz |
| Package | 780-pin FC-FBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial |
| Configuration Modes | Passive Serial, Passive Parallel, Fast Passive Parallel, Active Serial, JTAG |
| I/O Standards Supported | LVDS, LVPECL, SSTL, HSTL, LVCMOS, LVTTL |
| RoHS Status | Compliant |
EP1S40F780I6 780-pin fc-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP1S40F780I6 (780-pin fc-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F780I6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S40F780I6 is suitable for 7 applications: Digital Signal Processing (DSP) Front-End, Telecommunications Line Card, High-Speed Data Acquisition System, ASIC Prototyping Platform, Video and Image Processing Pipeline, Industrial Automation Controller, Military and Aerospace Signal Processing.
Digital Signal Processing (DSP) Front-End
The EP1S40F780I6 fits DSP front-end applications because its 41,250 logic elements and dedicated embedded multiplier array deliver high-throughput parallel arithmetic for baseband processing, radar, and software-defined radio front-ends. With 3.42 Mbits of embedded TriMatrix memory it can buffer packet-sized data blocks without stalling the pipeline. Per the Stratix device handbook, the EP1S40 die sustains DSP block throughput above 250 MHz on industrial speed grades. Placed on a multi-layer PCB between high-speed ADCs and the host processor, the EP1S40F780I6 handles FFT, FIR, and modulation functions in hardware while reducing host CPU loading. Compared with smaller Stratix members (e.g. EP1S30F780I6), the EP1S40 provides headroom for additional DSP blocks, larger memory banks, and more parallel channels on the same 780-pin FC-FBGA footprint. Designers should budget for 1.5 V core supply regulation within ±3% and a dedicated PLL analog supply, plus matched-impedance routing for high-speed LVDS I/O banks.
Recommended
Telecommunications Line Card
The EP1S40F780I6 fits telecommunications line-card designs because its 615 user I/O pins, multi-standard support (LVDS, SSTL, HSTL, LVPECL), and dedicated SERDES-supporting clock networks enable bridging between TDM/SONET framer chips and network processors. Per the Stratix device handbook, the EP1S40's I/O bank architecture supports eight independent bank voltages, allowing direct interfacing with mixed-voltage legacy ASICs without level shifters. Deployed on a backplane alongside high-density DDR-II RLDRAM, the EP1S40F780I6 can buffer cell/packet traffic with deterministic latency, while the 3.42 Mbits of embedded memory provide on-chip queuing. The 130 nm CMOS process and industrial temperature grade make it suitable for telecom central-office environments. Compared to larger Stratix-II members (EP2S...), the EP1S40 remains attractive for cost-sensitive line-card redesigns where board real-estate matches the 780-pin FC-FBGA land pattern. Designers should pay attention to multi-rail sequencing and per-bank VCCIO decoupling on the PCB.
Recommended
High-Speed Data Acquisition System
The EP1S40F780I6 fits high-speed data-acquisition systems because its 615 LVDS-capable I/O pins, dedicated PLLs, and on-chip termination (OCT) preserve signal fidelity for wide parallel ADC/DAC buses at hundreds of MSPS sample rates. Per the Stratix handbook, on-chip OCT eliminates external resistor networks at LVDS receivers, simplifying routing on the 780-pin FC-FBGA land pattern. With 3.42 Mbits of embedded memory, the EP1S40 can buffer multiple acquisition frames before transferring to DDR-II external memory via the embedded PHY interface. The 450.05 MHz internal clock headroom supports pipelined front-end signal processing for radar, medical imaging, and instrumentation scopes. Compared with mid-density Cyclone devices, the EP1S40F780I6 provides more DSP blocks for FFT/DDC functions, reducing host CPU post-processing load. Designers must isolate noisy ADC supplies from the FPGA core and route differential pairs with controlled 100 ohm differential impedance.
Recommended
ASIC Prototyping Platform
The EP1S40F780I6 fits ASIC prototyping because its 41,250 logic elements map sizeable SoC subsystems into real silicon while preserving accurate timing relative to the target ASIC. Per the Stratix handbook, the EP1S40 contains dedicated memory and DSP resources that map common ASIC building blocks (cache controllers, DMA engines, signal-processing paths) with deterministic behavior. Multiple EP1S40F780I6 devices can be assembled across one or more boards to prototype SoCs whose gate count exceeds a single FPGA. Compared with smaller EP1S10 or EP1S20 variants, the EP1S40 expands prototype capacity by approximately 2x to 4x without changing the 780-pin FC-FBGA footprint, allowing prototype board reuse. Designers typically use the Quartus-II design flow, configuring the EP1S40 via JTAG for rapid design iteration; industrial temperature grade supports prototype bring-up in outdoor or rugged environments.
Recommended
Video and Image Processing Pipeline
The EP1S40F780I6 fits video and image processing pipelines because its 41,250 logic elements and 3.42 Mbits of embedded memory can buffer multiple video frames and implement motion-estimation, scaling, and color-space conversion at real-time rates. Per the Stratix handbook, the EP1S40's DSP blocks accelerate 2-D convolution and DCT operations required for JPEG/MPEG codecs; the 615 user I/O pins aggregate parallel BT.1120/parallel-RGB sensor buses. The industrial temperature grade makes the EP1S40F780I6 suitable for video-conferencing appliances, broadcast equipment, and outdoor digital signage. Compared with smaller EP1S25F780I6 variants, the EP1S40 provides approximately 65% more logic capacity on the same 780-pin FC-FBGA footprint, enabling multi-stream processing. Designers should route DDR-II external memory lines with controlled impedance and isolate high-speed video I/O from analog front-end ground returns.
Recommended
Industrial Automation Controller
The EP1S40F780I6 fits industrial-automation controllers because its industrial temperature grade, deterministic hardware logic, and 615 user I/O pins aggregate large numbers of digital and analog sensor interfaces without software jitter. Per the Stratix handbook, embedded PLLs provide multiple synchronized clocks for motor-control PWMs, encoder feedback, and fieldbus timing on the same die. The 3.42 Mbits of embedded memory support deterministic real-time protocol stacks (EtherCAT, Profinet) and small buffer pools. Compared with the smaller EP1S20F484I6 variant, the EP1S40F780I6 provides significantly more logic capacity on a 780-pin FC-FBGA footprint, enabling multiple real-time protocols to coexist. Designers must respect the FPGA's 1.5 V core and dedicated PLL analog supply sequencing at power-up to avoid latch-up; the FC-FBGA also requires multi-layer PCB design with microvia technology.
Recommended
Military and Aerospace Signal Processing
The EP1S40F780I6 fits military and aerospace signal-processing applications because its industrial temperature grade, radiation-resilience margin (per Stratix handbook characterization), and 41,250 logic elements support secure signal-processing chains in unmanned-vehicle payloads, radar front-ends, and electronic-warfare subsystems. The 780-pin FC-FBGA package provides the mechanical robustness required for shock- and vibration-stressed platforms, while 3.42 Mbits of embedded memory buffer mission-critical data with deterministic access latency. Compared with the EP1S30F780I6, the EP1S40F780I6 offers 37% more logic capacity on the same 780-pin FC-FBGA footprint, enabling higher-density channel-count beamforming and direction-finding algorithms. Designers must route JTAG and configuration interfaces away from sensitive analog domains and provide robust multi-rail sequencing at 1.5 V core and per-bank VCCIO levels.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F780C8N | EP1S40F780C7N | EP1S40F780C6 | EP1S30F780I6 |
|---|---|---|---|---|---|
| Package | 780-pin FC-FBGA | 780-pin FC-FBGA | 780-pin FC-FBGA | 780-pin FC-FBGA | 780-pin FC-FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 33,880 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I6 (industrial -6) | C8 (commercial -8) | C7 (commercial -7) | C6 (commercial -6) | I6 (industrial -6) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Industrial temperature grade for harsh-environment deployment (vs EP1S40F780C8N)
- Maximum internal frequency headroom among I-grade Stratix EP1S40 variants (vs EP1S40F780C7)
- Highest-density Stratix EP1S40 member in the 780-pin package (vs EP1S30F780I6)
Design Notes
Estimated: EP1S40F780I6 requires multi-rail power sequencing. VCCINT (1.5 V core), VCCIO (per-bank I/O voltages), VCCA_PLL (analog PLL supply), and VCCD_PLL (digital PLL supply) must be ramped in the order specified in the Stratix handbook to avoid latch-up. Each PLL analog rail should be filtered with ferrite beads and decoupled with 0.1 uF + 10 uF ceramic capacitors. Failure to sequence supplies correctly can permanently damage the device.
The 780-pin FC-FBGA requires a high-layer-count PCB (at least 8 layers) with 1.0 mm pitch BGA fan-out. Use microvia technology (stacked or staggered) for inner-row escape routing. Matched-impedance 100 ohm differential pairs must be used for LVDS lanes; SSTL/HSTL memory interface traces require controlled single-ended impedance of 50 ohm with reference to the appropriate VCCIO plane. Solid GND planes beneath the BGA provide both signal return paths and thermal dissipation.
Place configuration-mode jumpers and JTAG headers close to the EP1S40F780I6 to minimize configuration-clock trace length. Decoupling capacitors must be placed as close as possible to BGA power pins, with via-in-pad recommended for inner-row power balls. Keep PLL analog supply traces away from noisy digital switching regions; an isolated analog supply island improves PLL jitter performance.
Do not assume that all 615 user I/O pins are simultaneously usable; per-bank VCCIO constraints and LVDS pairing rules reduce the practical I/O count on most designs. Also avoid loading the configuration bitstream through JTAG and AS modes simultaneously - select the configuration mode via MSEL pins before power-up. Finally, the MSEL[2:0] strap resistors determine configuration mode; double-check strap values against the chosen configuration device (EPCS, EPC4, etc.).
Estimated: At maximum toggle activity on all 615 I/O pins driving 8 mA LVTTL loads, the EP1S40F780I6 can dissipate up to 5-7 W. A solid 4-layer GND plane plus thermal vias beneath the BGA die flag provides primary heat-spreading; a small heatsink (15 x 15 mm) is recommended for industrial temperature applications operating above 70C ambient. Always verify theta-JA from the device handbook against your board layout; thermal simulation is strongly recommended before production.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable (FPGA is not an automotive-grade discrete). Halogen-free status not stated in provided data. Conflict-minerals compliant per Intel supply-chain reporting.
