EP20K100CF324C8ES - APEX 20K FPGA, 100K Gates, 324-FBGA | Intel
MPN: EP20K100CF324C8ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256 | $2,560.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199 | $99,500.00 |
| 1,000 | $175 | $175,000.00 |
EP20K100CF324C8ES Overview
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor that belongs to the broader category of programmable logic devices (PLDs) within the integrated circuit (IC) taxonomy: FPGA -> PLD -> logic IC -> integrated circuit. APEX 20K devices were among the first to merge LUT-based logic with embedded memory blocks (EABs), allowing designers to implement wide datapaths, FIFOs, and multiplier functions without external SRAM.
Key features of the EP20K100CF324C8ES include 4,160 logic elements, 26 EABs providing up to 53,248 RAM bits, 246 maximum user I/O pins, and multi-voltage I/O support (1.8 V, 2.5 V, 3.3 V, 5.0 V) through dedicated bank reference pins. It uses SRAM-based configuration loaded from a serial PROM or via JTAG, and integrates four Phase-Locked Loops (PLLs) for clock multiplication, division, and phase shifting across the device.
Architecturally, the APEX 20K family employs a MultiCore architecture that ties MegaLAB structures together via a FastTrack continuous routing network. This delivers high predictable performance for synchronous designs, with tpd (pin-to-pin) and fmax figures characteristic of the C8 speed grade suitable for 80–100 MHz internal operation in typical datapath applications.
Typical applications include telecommunications line cards, glue-logic replacement, high-speed DSP co-processing, industrial control and instrumentation backplanes, and legacy design maintenance for products shipped in the late 1990s and early 2000s. The large 246-I/O count makes the 324-FBGA package appropriate for parallel bus bridging applications.
When designing with this device, ensure your configuration scheme (EPC16/EPC8 serial PROM or JTAG) matches the board layout. Because the APEX 20K family is mature and approaching end-of-life, confirm long-term availability before starting new production designs; consider Cyclone or MAX series for new projects.
This page consolidates distributor pricing, same-brand drop-in alternatives within the EP20K100 family, and practical design notes that go beyond the manufacturer's datasheet summary, including cross-brand note that no third-party drop-in exists in the same 324-FBGA footprint.
Drop-in alternatives for EP20K100CF324C8ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K100CF324C8ES (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Process Technology, Family, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100CF324C8
✅ Drop-In✓ In Stock
$50 / Unit
View Datasheet →EP20K100CF324C7
✅ Drop-In✓ In Stock
$27.8 / Unit
View Datasheet →EP20K100CF324C7ES
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →EP20K100CF324C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$71 / Unit
View Datasheet →EP20K100CF324I8
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K100CF324C8ES Maximum Ratings & Electrical Characteristics
| Series | APEX 20K |
| Family | EP20K100 |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Logic Elements / Cells | 4,160 |
| Embedded Array Blocks (EABs) | 26 |
| Total RAM Bits | 53,248 |
| Maximum User I/O | 246 |
| Number of I/O Banks | 8 |
| Supply Voltage (Core) | 1.8 V |
| I/O Standards Supported | 1.8 V / 2.5 V / 3.3 V / 5.0 V LVTTL/LVCMOS |
| Number of PLLs | 4 |
| Package | 324-BGA (FineLine BGA) |
| Speed Grade | C8 (commercial) |
| Operating Temperature | 0 C to +85 C (commercial) |
| Configuration Method | SRAM, serial PROM or JTAG |
| Process Technology | 0.18 um CMOS |
| Mounting Type | Surface Mount |
EP20K100CF324C8ES 324-bga (fineline bga) Pin Configuration Guide
Pin configuration for EP20K100CF324C8ES (324-bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100CF324C8ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K100CF324C8ES is suitable for 6 applications: Telecommunications Line Cards, Industrial Control Backplanes, DSP Co-Processing and FIR Filters, Legacy Design Maintenance, High-Speed Data Acquisition Front-Ends, Embedded Computing and Prototyping.
Telecommunications Line Cards
The EP20K100CF324C8ES fits legacy telecommunications line-card designs that require 246 user I/O pins for parallel TDM bus interfacing and a dense LUT/EAB fabric for protocol termination. With 4,160 logic elements and 26 EABs providing 53,248 bits of dual-port RAM, the device absorbs HDLC framing, ATM SAR, and DSP pre-processing functions without external memory. The 324-FBGA package keeps the design compact on a line-card PCB while the four on-chip PLLs generate multiple clock domains from a single backplane reference. Designers should reserve one PLL for the TDM bit-clock and another for the system-side reference to maintain sub-bit jitter margins.
Recommended
Industrial Control Backplanes
For industrial backplane glue logic, the EP20K100CF324C8ES bridges legacy parallel buses (ISA, VME, PC/104) to modern processors. The 246 I/O count supports full 32-bit data plus 24-bit address buffering, while the embedded EABs implement FIFO buffers for asynchronous clock-domain crossing. Multi-voltage I/O banks (1.8 V, 2.5 V, 3.3 V, 5.0 V) allow direct connection to mixed-logic families without level shifters. Designers should note that the C8 commercial grade (0 C to +85 C) limits deployment; for industrial temperature range, the I8 grade variant is recommended.
Recommended
DSP Co-Processing and FIR Filters
The EP20K100CF324C8ES is widely used as a co-processor for fixed-point FIR/IIR filter acceleration. Each EAB can be preloaded with coefficient tables and combined with distributed-LUT adders to deliver 16-bit multiply-accumulate throughput at 80-100 MHz in the C8 speed grade. With 53,248 bits of on-chip RAM, designers can implement 64-tap FIR filters directly without external SRAM. The four PLLs provide per-channel clock generation for multi-rate DSP pipelines. This is a strong fit for audio processing, baseband demodulation, and adaptive filter prototyping where the LUT fabric outperforms general-purpose DSPs.
Recommended
Legacy Design Maintenance
The EP20K100CF324C8ES is the production reference for installed systems originally designed in the early 2000s. The 'ES' engineering sample suffix and the 324-FBGA pinout allow direct replacement of end-of-life units in fielded equipment where board redesign is not feasible. The 100K-gate capacity is sufficient for the original glue logic, peripheral controllers, and protocol bridges used in telecom infrastructure, medical imaging controllers, and avionics subsystems. Customers maintaining installed bases should qualify the non-ES EP20K100CF324C8 production part for long-term supply continuity.
Recommended
High-Speed Data Acquisition Front-Ends
In data-acquisition front-ends, the EP20K100CF324C8ES implements trigger logic, channel multiplexing, and DMA controllers between high-speed ADCs and host processors. The 246 I/O pins accept wide parallel ADC outputs and the EABs absorb sample buffers for burst capture. With multi-voltage I/O banks, the device connects directly to 1.8 V LVDS and 3.3 V CMOS ADC interfaces on a single die. Designers should use the four PLLs to derive the ADC sample clock from an external reference, and reserve the CONF_DONE pin for system-level board-test handshake during manufacturing.
Recommended
Embedded Computing and Prototyping
For embedded computing prototypes and FPGA development platforms, the EP20K100CF324C8ES offers enough logic (4,160 LEs) and I/O (246 pins) for RISC soft-core implementations, custom peripherals, and peripheral bridges. The SRAM-based configuration supports rapid JTAG iteration during development and serial-PROM standalone operation in deployed prototypes. Students and engineers can experiment with the Altera/Intel Quartus II toolchain (legacy version supported). For new embedded designs, Intel recommends the MAX II CPLD family or Cyclone IV FPGAs as modern replacements.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100CF324C8ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100CF324C8 | EP20K100CF324C7 | EP20K100CF324C7ES | EP20K100CF324C9 | EP20K100CF324I8 |
|---|---|---|---|---|---|---|
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Series | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Speed Grade | C8 (commercial) | C8 production | C7 (faster) | C7 ES | C9 (slower) | I8 industrial |
| Engineering Sample (ES) Suffix | Yes | No | No | Yes | No | No |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C |
Key Differentiators
- Engineering-sample qualification with production silicon (vs EP20K100CF324C8)
- C8 speed grade balances cost and timing margin (vs EP20K100CF324C7)
- Commercial temperature grade covers 0 C to +85 C (vs EP20K100CF324I8)
Design Notes
The APEX 20K family requires four power rails: VCCINT (1.8 V core), VCCIO (1.8/2.5/3.3 V I/O per bank), VCC_PLL (1.8 V PLL analog), and VREF (bank reference for SSTL/GTL). Estimated: at 50 percent toggle rate and 50 percent utilization, core current is approximately 1.2 A from 1.8 V; I/O current depends on bank voltage and switching frequency. Use low-ESR ceramic decoupling (10 uF bulk + 0.1 uF per VCC pin) within 5 mm of each supply ball.
The 324-FBGA uses 1.0 mm ball pitch on a 19 mm x 19 mm body. Recommended PCB land pattern is a non-solder-mask-defined (NSMD) pad of 0.5 mm diameter with a 0.65 mm solder-mask opening. Microvia (8-mil laser-drilled) stack-up with full ground plane underneath the BGA is required for signal and power integrity. Avoid routing signals through the BGA field; escape on the top layer to perimeter.
Place the EPC16 configuration PROM within 50 mm of the EP20K100CF324C8ES to keep DATA, DCLK, nCONFIG, and CONF_DONE traces short and impedance-controlled (50 ohm). Series-terminate DCLK with 33 ohm near the FPGA. Tie nCONFIG to VCCIO via 10 kohm and provide a tactile reset switch to ground for JTAG fallback. CONF_DONE should be pulled up to VCCIO via 10 kohm and visible to the system controller for boot-status monitoring.
Do not mix 5 V TTL inputs with 3.3 V VCCIO without verifying the bank's VREF tolerance - the APEX 20K 5 V-tolerant inputs require specific VCCIO settings per Altera application note AN117. Avoid using the JTAG TCK pin for any non-JTAG purpose; it must be held low during configuration. Always include a reset sequence delay of at least 10 ms after VCCINT reaches 1.8 V before nCONFIG is released, otherwise configuration may fail intermittently.
Compliance Information
RoHS status depends on date code - pre-2005 units may contain lead BGA balls, post-2006 units are Pb-free. Verify date code with distributor. APEX 20K family is not AEC-Q100 qualified; for automotive, contact Intel sales for legacy automotive-grade parts.
