EP1C12F324C6AA - Cyclone FPGA 12K LE 324-BGA | Intel | Industrial
MPN: EP1C12F324C6AA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $58.5 | $58.50 |
| 10 | $53.2 | $532.00 |
| 100 | $47.8 | $4,780.00 |
| 500 | $42.1 | $21,050.00 |
| 1,000 | $36.9 | $36,900.00 |
Drop-in alternatives for EP1C12F324C6AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C12F324C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$37.2 / Unit
View Datasheet →EP1C12F324C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$51.75 / Unit
View Datasheet →EP1C12F324I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$52.1 / Unit
View Datasheet →EP1C12F324C6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1C12F324C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$40.26 / Unit
View Datasheet →EP1C12F324C6AA Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Family | Cyclone I |
| Logic Elements | 12,060 |
| Total RAM Bits | 239,616 |
| Number of I/O | 249 |
| Number of Logic Cells | 12,060 |
| Number of Multipliers | 52 (18x18) |
| Number of PLLs | 4 |
| Maximum Operating Frequency | 405.2 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to +85 C |
| Package | 324-BGA (FineLine BGA) |
| Mounting Type | Surface Mount |
EP1C12F324C6AA 324-bga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1C12F324C6AA (324-bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C12F324C6AA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12F324C6AA is suitable for 6 applications: Industrial Control and Automation, Video Processing and Image Capture, Telecommunications Line Cards, ASIC Prototyping and Design Validation, Embedded Digital Signal Processing, Automotive Infotainment and Driver Assistance.
Industrial Control and Automation
The EP1C12F324C6AA fits industrial control applications where 12,060 logic elements and 249 user I/O pins support multi-axis motor control, PLC backplane interfaces, and protocol bridging between Ethernet, RS-485, and CAN networks. The 52 dedicated 18x18 multipliers enable hardware-accelerated PID loops and field-oriented control algorithms at update rates exceeding 50 kHz. Its 1.5 V core and LVTTL/LVCMOS/PCI-compatible I/O banks integrate directly with industrial sensor front-ends and 24 V optically-isolated signal chains. Compared with discrete logic or MCU-only solutions, this FPGA centralizes deterministic I/O timing, parallel DSP, and custom peripheral logic in one device. Designers must respect the commercial 0-85 C range and add external thermal management for factory-floor enclosures. Companion MPNs include EPCS4 configuration memory and EP1K100 companion devices for design portability.
Recommended
Video Processing and Image Capture
The EP1C12F324C6AA is well matched to mid-resolution video processing tasks such as NTSC/PAL capture, VGA/HDMI preprocessing, and image pipeline color-space conversion. Its 239,616 bits of embedded M4K RAM buffer entire video lines without external memory for 640x480 designs, while the 249 I/O pins accept parallel ITU-R BT.656 sensor data and drive TFT/LCD controllers simultaneously. The 52 hardware multipliers accelerate 2D convolution, Sobel edge detection, and DCT blocks at pixel clock rates up to 100 MHz. Compared with general-purpose DSPs, the FPGA delivers deterministic latency critical for real-time display synchronization. For HD or higher resolutions, external SDRAM or DDR memory controllers must be instantiated, leveraging the dedicated PLL outputs for pixel-clock synthesis.
Recommended
Telecommunications Line Cards
The EP1C12F324C6AA serves as a glue-logic and packet-processing engine on telecom line cards handling T1/E1 aggregation, HDLC framing, and low-density ATM/Ethernet bridging. With 12,060 logic elements the device implements serializer/deserializer interfaces, UTOPIA-level PHY glue, and per-channel state machines in parallel without CPU intervention. The four PLLs derive independent bit clocks for upstream and downstream tributaries, while 52 multipliers accelerate CRC-32 and Reed-Solomon forward error correction. Compared with ASIC line-card solutions, the FPGA offers field-upgradable firmware and multi-protocol flexibility. Industrial temperature variants such as EP1C12F324I7N are recommended for outside-plant deployments where ambient temperatures exceed 70 C.
Recommended
ASIC Prototyping and Design Validation
The EP1C12F324C6AA is widely used as a hardware prototyping vehicle for mid-complexity ASIC designs, allowing RTL verification at near-real-time speeds before committing to mask sets. Its 12,060 logic elements map roughly to 200K ASIC gates, sufficient for UART/SPI/I2C subsystems, small microcontrollers, and peripheral bridges. The 249 I/O pins expose wide bus interfaces and emulated memory buses for connecting to prototype daughter boards. Designers can iterate logic revisions in minutes via JTAG and the Quartus II toolchain, drastically compressing verification cycles. For larger ASIC prototypes, multiple Cyclone FPGAs can be chained using their LVDS-capable I/O to partition the design across devices.
Recommended
Embedded Digital Signal Processing
The EP1C12F324C6AA excels at embedded DSP tasks including audio sample-rate conversion, FIR/IIR filtering, FFT computation, and motor-control PWM generation. Its 52 dedicated 18x18 multipliers perform 26 simultaneous 36-bit MAC operations per clock cycle, supporting 1024-point FFT in under 50 microseconds at 200 MHz. The M4K memory blocks provide dual-port coefficient and sample storage without consuming logic elements, freeing fabric for control logic. Compared with software DSP on microcontrollers, this FPGA delivers 10x to 100x throughput at deterministic latency. The four PLLs synthesize arbitrary sample rates from a single master clock, ideal for multi-standard audio or sensor-fusion platforms.
Recommended
Automotive Infotainment and Driver Assistance
Within its commercial 0-85 C operating window, the EP1C12F324C6AA powers automotive infotainment subsystems such as rear-seat entertainment controllers, CAN/LIN gateway modules, and low-resolution driver-assistance displays. Its 52 hardware multipliers accelerate H.264 baseline decode at CIF resolution, and 249 I/O pins aggregate multiple camera inputs plus LVDS display outputs. The flexible PLL architecture generates pixel clocks, audio clocks, and CAN bit-streams from one crystal reference, reducing BOM cost. For AEC-Q100 qualified applications, the I-suffix industrial variants (EP1C12F324I7N) should be specified since the C6AA is not automotive-grade. Companion MPNs include CAN transceivers such as TJA1050 and TFT display controllers.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12F324C6AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12F324C7N | EP1C12F324C8N | EP1C12F324I7N | EP1C12F324C6 | EP1C12F324C7 |
|---|---|---|---|---|---|---|
| Package | 324-BGA (FineLine BGA) | 324-BGA (FineLine BGA) - same | 324-BGA (FineLine BGA) - same | 324-BGA (FineLine BGA) - same | 324-BGA (FineLine BGA) - same | 324-BGA (FineLine BGA) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Speed Grade | C6 | C7 (faster) | C8 (slower) | C7 (faster) | C6 (same) | C7 (faster) |
| Temperature Range | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| User I/O Count | 249 | 249 | 249 | 249 | 249 | 249 |
| Embedded RAM | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Mid-tier C6 speed grade at lowest unit cost (vs EP1C12F324C7N)
- Lead-based C6AA termination for legacy manufacturing (vs EP1C12F324C6)
- Commercial 0-85 C temperature at lowest tier price (vs EP1C12F324I7N)
Design Notes
The EP1C12F324C6AA requires a clean 1.5 V core supply capable of delivering up to approximately 1.5 A under maximum logic utilization at 405 MHz. Use a dedicated LDO regulator (such as the TI TPS7A4501 or equivalent) rather than sharing the 1.5 V rail with analog circuitry. Place 10 uF bulk and 0.1 uF high-frequency decoupling capacitors within 5 mm of every VCCINT pin, and connect all GND balls to a solid ground plane. Add a 10 kohm pull-up on the nCONFIG pin and a 1 kohm pull-up on nSTATUS to ensure proper configuration initialization at power-up.
The 324-ball FineLine BGA requires a 6-layer PCB minimum with microvia technology for fan-out from the 1.0 mm pitch ball array. Route all four PLL power pins (VCCA_PLL) with dedicated filtered supplies and keep PLL analog ground separate from digital ground, joining only at the board-level ground plane. Match length on differential pairs (LVDS) to within 150 mils for reliable 640 Mbps signaling. Provide exposed test points for JTAG TCK, TMS, TDI, and TDO to enable in-system programming and debug with the Quartus II programmer toolchain.
Estimated: at 100 percent logic utilization and 405 MHz clock rate, the EP1C12F324C6AA core can dissipate up to 2.5 W. The 324-BGA package has a typical theta-JA of approximately 15 C/W with a properly designed thermal via array beneath the package. For commercial 0-85 C operation this leaves adequate margin; however, designers targeting industrial temperatures with the I-suffix variant should consider forced-air cooling or attach a small heatsink. Monitor junction temperature during initial board bring-up using the built-in Cyclone temperature-sensing diode accessible via JTAG.
The EP1C12F324C6AA supports four configuration modes: JTAG, Passive Serial (PS), Passive Parallel Asynchronous (PPA), and Active Serial (AS) using an EPCS configuration device. For production boards, AS mode with an EPCS4SI8N is the most common pattern, providing non-volatile storage and fast field upgrades. Always include a fallback JTAG header on every design for recovery from corrupted configuration images. Verify the configuration clock (DCLK) signal integrity with a 31-segment impedance-controlled trace, especially when chaining multiple FPGAs in PS mode.
Compliance Information
Lead-based termination (Pb) per the AA suffix. RoHS and REACH compliance status not explicitly confirmed in available web data; marked unknown pending manufacturer verification. Industrial temperature variants (I-suffix) are not AEC-Q100 qualified - choose dedicated automotive FPGAs for AEC-Q100 requirements.
