EP20K1500EBC652-1X - APEX 20KE 1.5M Gates FPGA | Altera | BGA-652
MPN: EP20K1500EBC652-1X β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EP20K1500EBC652-1X Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O blocks into a semiconductor device. APEX 20KE sits within Altera's MultiCore architecture, which integrates look-up table (LUT) logic, embedded system blocks (ESBs) for memory, and product-term blocks in one fabric - this is the first device family marketed as a System-on-a-Programmable-Chip (SOPC) solution, sitting within the broader taxonomy of FPGA -> programmable logic -> digital IC -> semiconductor.
Key features include 3,456 Macros (logic cells), 488 user I/Os, on-chip RAM via embedded system blocks, MultiCore architecture combining LUT and product-term logic, JTAG-based configuration, and 0.22 Β΅m CMOS process technology. The 1.8 V core supply minimizes power consumption while supporting high-speed signal processing in compute-intensive designs. The 652-ball BGA package supports industrial-grade thermal performance and high pin density.
The APEX 20KE architecture integrates PLLs, memory, and logic in a single die, enabling designers to implement complex glue logic, bus interfaces, and DSP functions on one chip. The MultiCore structure allows portions of the fabric to behave as either fine-grained LUT logic or coarse-grained product-term logic, optimizing silicon for mixed control-and-datapath designs.
Typical applications include telecommunications infrastructure, ASIC prototyping, high-speed data acquisition, industrial control systems, and network switching equipment. The 488 I/O count also makes it suitable for legacy interface bridging and high-bandwidth parallel processing.
When designing with this device, ensure proper power-plane decoupling and thermal management for the large BGA - allocate at least 4-layer PCB with dedicated VCCINT and VCCIO planes. Quartus II software is required for synthesis, place-and-route, and timing analysis; design compilations can take significant runtime for full-fabric utilization.
This page synthesizes distributor stock levels, drop-in alternatives within the APEX 20K family, and PCB-layout guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP20K1500EBC652-1X β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K1500EBC652-1X (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Operating Temperature, Total RAM Bits.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP20K1500EBC652-2X
β Drop-Inπ Reference alternative (not in catalog)
EP20K1500EBC652-2
β Drop-Inπ Reference alternative (not in catalog)
EP20K1500EBC652-1N
β Drop-Inπ Reference alternative (not in catalog)
EP20K1500CB652C8ES
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP20K1000EBC652-2X
β Drop-Inβ In Stock
$99 / Unit
View Datasheet βEP20K1000EBI652-2
β Drop-Inβ In Stock
$105 / Unit
View Datasheet βEP20K1500EBC652-1X Maximum Ratings & Electrical Characteristics
| Family | APEX 20KE |
| Logic Elements / Cells | 51840 |
| System Gates | 1.5 M |
| Macros | 3456 |
| Total RAM Bits | 442368 |
| User I/O | 488 |
| Propagation Delay | 1.84 ns |
| Internal Frequency | 160 MHz (per digchip) / 400 MHz (per fpgakey) |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 Β΅m CMOS |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial) |
| Package | 652-ball BGA (FCBGA / PBGA652) |
| Mounting Type | Surface Mount |
| Configuration Method | JTAG / SRAM |
| Architecture | MultiCore (LUT + product-term) |
EP20K1500EBC652-1X 652-ball bga (fcbga / pbga652) Pin Configuration Guide
Pin configuration for EP20K1500EBC652-1X (652-ball bga (fcbga / pbga652) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1500EBC652-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K1500EBC652-1X is suitable for 6 applications: Telecommunications Infrastructure, ASIC Prototyping and Emulation, Industrial Control Systems, High-Speed Data Acquisition, Network Switching Equipment, Legacy Interface Bridging.
Telecommunications Infrastructure
The EP20K1500EBC652-1X's 1.5 M system gates and 488 user I/Os make it well suited for legacy telecommunications infrastructure such as TDM cross-connects, ATM switching fabrics, and protocol-conversion line cards. Its 1.84 ns propagation delay supports high-speed serializer/deserializer bridging and bus-width adaptation. The MultiCore architecture allows LUT logic for datapath and product-term logic for control-plane state machines in one fabric. Placed on the line-card PCB with 1.8 V core and 3.3 V I/O rails, the part replaces multiple discrete CPLDs and ASICs. Designers should note the part is obsolete; existing telecom platforms with 10-20 year lifecycles continue to source it from broker distributors.
Recommended
ASIC Prototyping and Emulation
The 51,840 logic elements and 442 Kbits of embedded memory make the EP20K1500EBC652-1X a strong candidate for ASIC and ASSP prototyping and emulation. Engineers map RTL designs onto the MultiCore fabric to validate functionality before committing to mask costs. The 488 I/Os support wide parallel buses for connecting to real-world peripherals and DUT boards. The Quartus II toolchain provides synthesis, place-and-route, and timing analysis. Power consumption scales with utilization; full-fabric designs require multi-layer PCB power planes. As an obsolete part, it remains in service labs maintaining long-running emulation setups for legacy silicon.
Recommended
Industrial Control Systems
With 488 user I/Os and on-chip RAM, the EP20K1500EBC652-1X integrates multi-axis motor control, PLC backplane logic, and sensor-fusion glue logic in industrial automation equipment. The product-term blocks efficiently encode Boolean control logic, while LUT blocks implement DSP and PID loops. The 0-85 Β°C commercial temperature grade suits factory-floor enclosures with controlled climate. PLC and DCS vendors continue to deploy APEX 20KE parts in long-lifecycle machinery, often preferring drop-in replacement over redesign. Broker distributors supply replacement units when field failures occur.
Recommended
High-Speed Data Acquisition
The EP20K1500EBC652-1X's 488 I/Os and 442 Kbit embedded memory support multi-channel data-acquisition front-ends, including parallel ADC aggregation, digital downconversion, and FIFO buffering between converters and a host processor. Its 1.84 ns propagation delay allows tight timing closure on parallel LVDS buses. The on-chip ESBs (Embedded System Blocks) configure as dual-port RAM or FIFO without external SRAM. Industrial and scientific data-acquisition vendors use the 652-BGA on PCI/PMC carrier cards. Engineers targeting new boards should consider newer Cyclone IV/V parts; the 1500E remains valid for legacy DAQ modules.
Recommended
Network Switching Equipment
The 488 I/O count of the EP20K1500EBC652-1X accommodates high-port-count Ethernet switch backplanes, where the FPGA bridges PHY devices, lookup TCAMs, and management CPUs. The MultiCore fabric processes Layer-2/3 forwarding tables at wire speed using combinational logic and on-chip RAM for queue management. OEMs of legacy enterprise switches retain APEX 20KE parts for service-board replacements. Pin-compatible variants like the EP20K1500EBC652-2X extend product lifecycles when faster timing closure is required. New designs should target Cyclone V SoC or Stratix families for active Intel support.
Recommended
Legacy Interface Bridging
The EP20K1500EBC652-1X is widely deployed in legacy interface bridges that translate between ECL/TTL, parallel LVDS, PCI, and VME protocols in test equipment and military systems. Its 488 I/Os accept wide parallel buses without external bus multiplexers, while embedded RAM absorbs protocol skew and rate-matching FIFOs. The 1.8 V core and 3.3 V I/O bank support mixed-voltage legacy interfaces. Test-and-measurement OEMs continue to maintain APEX 20KE designs because PCBs and software are validated for that footprint. Broker channels remain the primary supply source as of 2026-09-07.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1500EBC652-1X β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1500EBC652-2X | EP20K1500EBC652-2 | EP20K1500EBC652-1N | EP20K1500CB652C8ES | EP20K1000EBC652-2X | EP20K1000EBI652-2 |
|---|---|---|---|---|---|---|---|
| Package | 652-ball BGA (FCBGA) | 652-ball BGA (FCBGA) - same | 652-ball BGA (FCBGA) - same | 652-ball BGA (FCBGA) - same | 652-ball BGA - same | 652-ball BGA (FCBGA) - same | 652-ball BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K | APEX 20KE | APEX 20KE |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.0 M | 1.0 M |
| Logic Cells | 51840 | 51840 | 51840 | 51840 | 51840 | ~38400 | ~38400 |
| Speed Grade | -1X | -2X (faster) | -2 (faster) | -1N (same speed, lead-free) | -8 (slower) | -2X (faster) | -2 (faster) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density pin-compatible drop-in within APEX 20KE 652-BGA family (vs EP20K1000EBC652-2X)
- Faster speed grade available as drop-in upgrade (vs EP20K1500EBC652-1N)
- First SOPC-integrated FPGA family with MultiCore LUT + product-term fabric (vs EP20K1500CB652C8ES)
Design Notes
The 652-ball BGA package requires at least a 4-layer PCB with dedicated VCCINT (1.8 V) and VCCIO planes to deliver clean power across all balls. Use 0.8 mm or 1.0 mm pitch BGA fanout with via-in-pad or dog-bone fanout; signal layers should be kept clear directly under the BGA for via breakout. Match trace lengths within each I/O bank to within 50 mil for LVDS pairs. Add 0.1 Β΅F and 10 Β΅F decoupling capacitors adjacent to every power ball group, plus bulk capacitors at the voltage-supply entry points. Estimated: thermal dissipation for full-fabric utilization at 1.8 V core can reach 3-5 W; copper pours on top and inner layers help spread heat.
The EP20K1500EBC652-1X at full utilization (51840 cells, ~80% logic, 50% memory) dissipates an estimated 4-5 W on a 4-layer JEDEC board. Junction-to-ambient thermal resistance for the 652-ball FCBGA is approximately 18-22 C/W per Altera APEX 20KE package thermal data, yielding a junction rise of 70-110 C above ambient. Derate clock frequency or gate utilization if ambient exceeds 60 Β°C. Use thermal vias under the center power balls to a copper heatsink pad on the bottom layer for improved theta_JA. Forced airflow is recommended in enclosed chassis.
Three pitfalls to avoid when designing with EP20K1500EBC652-1X: (1) Do not confuse the APEX 20KE (E-suffix) with the original APEX 20K - the 20KE adds MultiCore architecture and ESBs, but pinouts are largely compatible. (2) Verify the exact MPN suffix (1X vs 1N vs 2 vs 2X) matches your datasheet revision - speed grades and RoHS finishes vary. (3) The legacy Quartus II toolchain (not Quartus Prime) is required; newer tool versions do not support APEX 20KE compilation. Plan firmware validation cycles accordingly.
Place configuration and JTAG pins (TDI, TDO, TMS, TCK, nCONFIG, nSTATUS, CONF_DONE) within easy reach of the configuration EEPROM and JTAG header. Keep JTAG trace lengths under 6 inches and add 10 kΞ© pull-ups on nCONFIG and 10 kΞ© pull-down on nSTATUS per Altera reference designs. Route global clock inputs to dedicated CLK pins with matched-length traces; skew on global clocks propagates into all logic and memory. Reserve the top-layer copper under the BGA for thermal dissipation.
Compliance Information
RoHS status not explicitly stated in verified web data; the -1X suffix may indicate a specific finish variant. All alternatives are obsolete Altera/Intel parts. Compliance data not available from any of the verified distributor pages.
