EP20K200CF484C7ES - 200K Gate APEX-20KC FPGA 484-BGA | Intel
MPN: EP20K200CF484C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP20K200CF484C7ES Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the high-density logic of gate arrays with the design flexibility of programmable interconnect. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and sit above CPLDs (Complex Programmable Logic Devices) in density and complexity. APEX-20KC devices extend the APEX architecture with embedded memory blocks and multiplier-friendly Carry-Switch interconnect that accelerates arithmetic, DSP, and datapath functions commonly found in telecom, video, and DSP designs.
Key features of the EP20K200CF484C7ES include 8,320 logic elements, 376 LABs (Logic Array Blocks), 106,496 RAM bits distributed across embedded array blocks (EABs), and dedicated clock management circuitry with up to 4 phase-locked loops (PLLs). The 484-ball FineLine BGA package provides a 1.27 mm pitch and supports high pin-count designs that require extensive I/O. The 'C7' speed grade and 'ES' engineering sample designation indicate a 7 ns commercial-grade timing characterization and pre-production silicon.
Architecturally, the APEX-20KC family integrates a Logic Array Block (LAB) fabric with Embedded Array Blocks (EABs), enabling both fine-grained logic implementation and high-density on-chip memory. MultiTrack interconnect with DirectDrive technology provides predictable timing across the device, while the MultiVolt I/O interface supports interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without external level shifters.
Typical applications include high-speed digital signal processing, telecom baseband and channel-card designs, video processing pipelines, industrial control and instrumentation, and prototype ASIC development. The on-chip EAB memory blocks can be configured as RAM, ROM, or FIFO, eliminating the need for external memory in many subsystems. Designers migrating from older APEX-20K designs can leverage existing Quartus II development environments and IP cores for rapid prototyping.
When designing with this FPGA, ensure the PCB layout supports the BGA-484 footprint with appropriate escape routing and matched-length impedance-controlled traces for high-speed I/O. Power distribution requires multiple 1.8 V and 3.3 V rails with substantial decoupling to maintain signal integrity across the MultiTrack interconnect. The engineering sample ('ES') designation indicates the device should be validated in production-equivalent conditions before volume deployment.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX-20KC family, and practical design notes not consolidated in the manufacturer datasheet, helping engineers verify supply, identify pin-compatible drop-ins, and accelerate FPGA design-in decisions.
Drop-in alternatives for EP20K200CF484C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200CF484C7ES (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Process Technology, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200CF484C7
✅ Drop-In✓ In Stock
$82 / Unit
View Datasheet →EP20K200CF484I7ES
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K200CF484C8ES
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$89 / Unit
View Datasheet →EP20K200BC484-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$75.1 / Unit
View Datasheet →EP20K200CB652C7ES
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$275 / Unit
View Datasheet →EP20K100CF484C7ES
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K200CF484C7ES Maximum Ratings & Electrical Characteristics
| Family | APEX-20KC |
| Series | APEX 20KC |
| Logic Elements / Cells | 8,320 |
| Typical Gates | 200,000 |
| Number of LABs/CLBs | 376 |
| Total RAM Bits | 106,496 |
| Number of I/O | 377 (max) |
| Voltage - Supply | 1.8 V core |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Package / Case | 484-BBGA (FineLine BGA) |
| Process Technology | 0.18 µm CMOS |
| Speed Grade | C7 (7 ns) |
| Silicon Status | ES (Engineering Sample) |
| Maximum Internal Frequency | 375.94 MHz |
EP20K200CF484C7ES 484-bbga (fineline bga) Pin Configuration Guide
Pin configuration for EP20K200CF484C7ES (484-bbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200CF484C7ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200CF484C7ES is suitable for 6 applications: Telecom Baseband Processing, ASIC Prototyping, Digital Signal Processing (DSP), Industrial Control Systems, Video Processing Pipelines, Test & Measurement Instrumentation.
Telecom Baseband Processing
The EP20K200CF484C7ES fits telecom baseband processing due to its 8,320 logic elements and 106,496 bits of EAB memory, which together deliver enough DSP datapath capacity for medium-complexity channel cards. The 484-BGA FineLine package supports the high pin-count interface typical of telecom line cards with multiple SERDES lanes, control interfaces, and external memory buses. At C7 speed grade the device sustains internal operation up to 375.94 MHz, sufficient for symbol-rate processing in EDGE/UMTS base stations. Embedded EAB memory blocks configured as dual-port RAM eliminate external FIFOs in symbol-rate conversion paths, reducing board complexity.
Recommended
ASIC Prototyping
The EP20K200CF484C7ES is well suited to ASIC prototyping because its 200K gates and 8,320 LEs deliver logic capacity comparable to mid-density cell-based ASICs while retaining design-rewrite flexibility. The MultiTrack interconnect with DirectDrive provides predictable timing that maps cleanly to ASIC synthesis constraints, accelerating design migration. The EAB memory blocks serve as on-chip SRAM and FIFO equivalents, allowing engineers to validate memory subsystems before tap-out. The 377 user I/O pins accommodate wide external buses for ASIC verification environments, and the Quartus II toolchain supplies mature timing-driven synthesis flows.
Recommended
Digital Signal Processing (DSP)
The EP20K200CF484C7ES targets digital signal processing applications through its Carry-Switch interconnect, which accelerates arithmetic adders, multipliers, and accumulate paths. At C7 speed grade the device sustains 375.94 MHz internal operation, supporting FIR filter clock rates above 300 MHz. EAB memory blocks can implement coefficient ROM and dual-port sample RAM, eliminating external memory in many DSP pipelines. The 484-BGA FineLine package provides the signal integrity required for parallel multiplier trees at high clock rates. APEX-20KC devices are commonly used in audio codecs, software-defined radio baseband, and image preprocessing pipelines.
Recommended
Industrial Control Systems
The EP20K200CF484C7ES supports industrial control designs where flexible logic integration and embedded memory replace discrete CPLD-and-memory partitions. The 200K-gate capacity integrates PLC scan engines, motor control state machines, and fieldbus protocol stacks on a single device. MultiVolt I/O (1.5/1.8/2.5/3.3 V) interfaces directly to industrial sensors, encoder ICs, and LVDS transceivers without external level shifting. The 0C to +85C commercial operating range suits factory-floor enclosures. For harsher environments the EP20K200CF484I7ES (industrial temp) variant is pin-compatible.
Recommended
Video Processing Pipelines
The EP20K200CF484C7ES integrates video processing datapaths including color-space conversion, scaling, and frame-rate conversion. The 106,496 bits of EAB memory buffer scan-line data and implement dual-port line buffers commonly required by horizontal scalers. C7-grade internal operation sustains 375.94 MHz, supporting 720p/1080i video pipelines with sufficient headroom. The 377 user I/O pins accommodate parallel ITU-R BT.656 / BT.1120 buses and DDR2 memory interfaces. APEX-20KC has been historically used in broadcast video format converters and surveillance DVR front-ends.
Recommended
Test & Measurement Instrumentation
The EP20K200CF484C7ES fits test and measurement instruments where protocol bridging, custom timing generation, and DSP preprocessing are required. The 200K-gate logic capacity implements protocol-aware state machines for LXI, GPIB-to-Ethernet bridges, and arbitrary waveform generators. EAB memory blocks configured as deep FIFOs buffer acquisition data before DSP post-processing. The 484-BGA FineLine package supports high pin-count parallel ADC/DAC interfaces commonly found in oscilloscope and logic analyzer front-ends. MultiVolt I/O interfaces directly to 1.8/2.5/3.3 V ADCs without external level shifters.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200CF484C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200CF484C7 | EP20K200CF484I7ES | EP20K200CF484C8ES | EP20K200BC484-1X | EP20K100CF484C7ES |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BBGA FineLine | 484-BBGA FineLine - same | 484-BBGA FineLine - same | 484-BBGA FineLine - same | 484-BBGA FineLine - same | 484-BBGA FineLine - same |
| Family | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20K (no EAB) | APEX-20KC |
| Typical Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 100,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 4,160 |
| Total RAM Bits | 106,496 | 106,496 | 106,496 | 106,496 | 12,288 (EAB-less) | 53,248 |
| Speed Grade | C7 (7 ns) | C7 (7 ns) | I7 (industrial, 7 ns) | C8 (8 ns) | -1X (legacy APEX-20K speed grade) | C7 (7 ns) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Silicon Status | ES (Engineering Sample) | Production | ES (Engineering Sample) | ES (Engineering Sample) | Production | ES (Engineering Sample) |
Key Differentiators
- On-chip EAB memory with Carry-Switch interconnect (vs EP20K200BC484-1X)
- Maximum internal frequency (vs EP20K200CF484C8ES)
- Engineering sample silicon with same die as production (vs EP20K200CF484C7 (production))
Design Notes
The 484-ball FineLine BGA package uses a 1.27 mm ball pitch, requiring 4- or 6-layer PCB stack-up with microvia escape routing. Estimated: routing density allows breakout to inner layers via microvias; full BGA fanout requires at least 6 routing layers plus 2 reference planes. Match impedance to 50 ohms single-ended for LVTTL/LVCMOS I/O. Place decoupling capacitors (0.1 µF, 10 µF) within 100 mil of every supply pin to maintain MultiTrack interconnect signal integrity.
The EP20K200CF484C7ES requires multiple supply rails: 1.8 V core (VCCINT), 3.3 V I/O banks (VCCIO), and PLL analog supply (VCCA_PLL). Estimated: based on 200K gates typical operating current, VCCINT current draw reaches 300-500 mA at C7 speed grade, requiring low-dropout regulators rated at least 1 A. Sequence VCCINT before VCCIO during power-up to prevent latch-up; use a power-good supervisor with at least 10 ms rise-time monitoring. Decouple each PLL supply pin with separate 0.1 µF + 10 µF capacitors to suppress jitter.
Engineering-sample (ES) silicon may exhibit timing behavior that differs from production parts - validate timing closure across process-voltage-temperature corners before committing to volume production. APEX-20KC EAB memory blocks support dual-port mode but only when block size is configured as a power of two; verify your design uses supported configurations. The MultiVolt I/O interface requires each I/O bank to be configured to a single VCCIO voltage - mixing 1.8 V and 3.3 V peripherals in the same bank requires external level shifters.
Place configuration PROM (EPCS4 or compatible) within 1 inch of the FPGA to ensure clean JTAG configuration signals. Route clock inputs on inner PCB layers with ground reference on adjacent layers; maintain 50 ohm controlled impedance and avoid 90-degree bends. Estimated: clock skew across the device should be budgeted below 100 ps; use PLL outputs to drive internal clock networks for matched-skew distribution. Keep high-speed differential pairs matched within 10 mil length tolerance.
Compliance Information
RoHS / REACH / lead-free status was not explicitly stated in the verified web data. APEX-20KC family was originally released in early 2000s and many base parts were lead-free by mid-2000s transition; verify the specific 'ES' suffix variant's compliance with the manufacturer. AEC-Q100 is not applicable - this is a commercial-grade FPGA family.