EP2A15B724C - APEX II 15K LEs FPGA, 724-BGA | Altera (Intel)
MPN: EP2A15B724C ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 100 | $235 | $23,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
EP2A15B724C Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to configure digital logic blocks and interconnect via a hardware-description language. FPGAs sit above ASICs and below microcontrollers in the design hierarchy: a microcontroller runs software sequentially, while an FPGA implements fully parallel custom hardware. The APEX II architecture specifically combines Look-Up Tables (LUTs), embedded system blocks (ESBs) for memory and arithmetic, and a high-bandwidth MultiTrack interconnect for predictable timing closure.
Key features of the EP2A15B724C include 16,640 logic elements (LEs), 425,984 bits of embedded RAM, 492 maximum user I/O pins, and a 724-ball FCBGA package. APEX II devices support up to 1.5M gates of logic and incorporate PLLs, LVDS support, and dedicated dual-port RAM blocks. The device is offered in commercial and industrial temperature grades and is fabricated on a 0.18-micron CMOS process.
The APEX II architecture integrates embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers. Combined with the MultiTrack interconnect, this allows deterministic timing across deep pipelines and is why APEX II was widely adopted for high-speed protocol bridging and data-path designs before the Stratix generation replaced it.
Typical applications for the EP2A15B724C include high-speed serial protocol bridging, telecom backplane switching, image-processing front-ends, ASIC prototyping, and military/aerospace signal processing. The high I/O count makes it suitable for designs that need to drive many parallel LVDS or TTL interfaces simultaneously.
When designing with EP2A15B724C, engineers should use the Altera Quartus II design suite for synthesis, place-and-route, and timing analysis. Power-supply sequencing, decoupling, and JTAG programming considerations follow standard fine-pitch BGA guidelines, and the FCBGA substrate requires careful PCB stack-up planning to maintain signal integrity on high-speed LVDS pairs.
This page synthesizes distributor stock, drop-in alternatives within the same APEX II family, and practical design notes not consolidated in the original datasheet.
Drop-in alternatives for EP2A15B724C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A15B724C (same form factor and footprint) — differing in Package, Process Technology, Family, Mounting Type, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A15B724C9
✅ Drop-In✓ In Stock
$268.5 / Unit
View Datasheet →EP2A15B724C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$185 / Unit
View Datasheet →EP2A15B724C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$125 / Unit
View Datasheet →EP2A15B724C Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements (LEs) | 16,640 |
| Maximum User I/O Pins | 492 |
| Embedded RAM | 425,984 bits |
| Package | 724-Ball FCBGA (FineLine BGA) |
| Process Technology | 0.18 micron CMOS |
| Maximum System Gates | Up to 1.5M gates (family-level) |
| Embedded System Blocks (ESBs) | Configurable as dual-port RAM / ROM / FIFO |
| Interconnect | MultiTrack, deterministic |
| I/O Standards | LVTTL, LVCMOS, LVDS, PCI, GTL+ (family-level) |
| PLLs | Yes (family-level, up to 4 per device) |
| Mounting Type | Surface Mount (BGA) |
| JTAG / Configuration | IEEE 1149.1 JTAG; passive serial / PS configuration supported (family-level) |
EP2A15B724C 724-ball fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2A15B724C (724-ball fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A15B724C.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A15B724C is suitable for 6 applications: Telecom Backplane Switching, High-Speed Protocol Bridging, ASIC Prototyping, Image Processing Front-End, Military and Aerospace Signal Processing, Industrial Automation and Control.
Telecom Backplane Switching
The EP2A15B724C fits telecom backplane switching applications because its 492 user I/O pins can drive large parallel bus interfaces to line cards and switch fabrics simultaneously. The MultiTrack interconnect delivers deterministic timing closure even at deep pipeline depths, which is critical for backplane rates in the hundreds of megahertz. Engineers typically use the embedded system blocks (ESBs) as dual-port FIFOs for cross-clock-domain bridging between backplane and payload domains. The 425,984-bit embedded RAM buffers cells or packets in transit without requiring external SRAM, lowering BOM and latency. The 0.18-micron CMOS APEX II architecture, while older, has proven reliability in carrier-grade equipment still in service.
Recommended
High-Speed Protocol Bridging
Bridging between RapidIO, POS-PHY, Utopia, and proprietary serial protocols is a canonical APEX II use case that fits the EP2A15B724C well. Its 16,640 logic elements provide the LUT count needed to implement multi-channel protocol engines, while the 425,984-bit embedded RAM serves as elastic buffers and lookup tables. Engineers typically configure the ESBs as FIFOs of configurable depth/width to absorb protocol bursts. Quartus II IP cores for PLLs and LVDS I/O simplify clock and serializer implementation. Compared with newer Stratix devices, APEX II has higher per-channel power but stable, mature tool flows in legacy designs.
Recommended
ASIC Prototyping
The EP2A15B724C is widely used for ASIC prototyping where the target gate count is in the 1M-system-gate range and many parallel I/Os are required. Its 16,640 LEs, 425,984-bit RAM, and 492 user I/Os give ASIC engineers enough headroom to map a multi-million-gate design into one or two APEX II devices. The MultiTrack interconnect preserves timing paths so prototype behavior closely mirrors the final ASIC. Quartus II supports gate-level synthesis flows that map standard-cell ASIC netlists to APEX II LEs. Engineers should plan for I/O voltage translation, since ASIC and FPGA I/O standards differ; LVDS and GTL+ support on APEX II helps close this gap.
Recommended
Image Processing Front-End
Image-processing front-ends in legacy industrial and medical imaging systems commonly use the EP2A15B724C to perform pixel-level pipeline processing. Its 16,640 LEs accommodate line buffers, color-space converters, and basic morphological operators in a single device. The 425,984-bit embedded RAM is sufficient for line-buffer storage at moderate resolutions (VGA to XGA class). 492 user I/O pins allow direct connection to image sensors, ADCs, and display drivers without external bus muxing. The MultiTrack interconnect enables deterministic pipeline latency, critical for synchronous video timing. APEX II LVDS I/O supports direct connection to flat-panel display interfaces common in medical imaging.
Recommended
Military and Aerospace Signal Processing
The EP2A15B724C is suitable for military and aerospace signal-processing applications where long lifecycle support and radiation-aware design heritage are valued. APEX II is a mature, well-characterized Altera family, and the 724-FCBGA package is compatible with industrial ruggedization processes. 16,640 LEs support moderate-complexity DSP pipelines including FFTs, FIR filters, and down-converters when paired with APEX II ESBs. The 492 user I/O count accommodates parallel ADC/DAC interfaces typical of radar and electronic-warfare front-ends. Designers should verify temperature-grade availability with their distributor since some APEX II variants are industrial-only.
Recommended
Industrial Automation and Control
Industrial automation and control systems benefit from the EP2A15B724C's high I/O count, deterministic MultiTrack interconnect, and abundant embedded RAM. It can act as a centralized controller handling multiple fieldbus interfaces (Profibus, CAN, Ethernet/IP) and motion-control loops in parallel. The 16,640 LEs implement PID loops, state machines, and protocol stacks concurrently. 492 user I/Os eliminate the need for external I/O expanders in many cabinet designs. APEX II's industrial temperature options and BGA package robustness make it well suited to factory-floor vibration and thermal environments. Engineers should budget for adequate PCB thermal vias under the FCBGA to dissipate the 0.18-micron CMOS quiescent and dynamic power.
Recommended
Recommended Products Summary
Engineering reference data for EP2A15B724C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A15B724C9 | EP2A15B724C8 | EP2A15B724C7 |
|---|---|---|---|---|
| Package | 724-Ball FCBGA | 724-Ball FCBGA - same | 724-Ball FCBGA - same | 724-Ball FCBGA - same |
| Brand | Altera | Altera - same | Altera - same | Altera - same |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded RAM | 425,984 bits | 425,984 bits | 425,984 bits | 425,984 bits |
| Maximum User I/O | 492 | 492 | 492 | 492 |
| Speed Grade | C | C9 (faster) | C8 (slower than C) | C7 (slowest) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in speed-grade flexibility within same package (vs EP2A15B724C7 / EP2A15B724C8 / EP2A15B724C9)
- High I/O count for parallel interface designs (vs EP20K600EBC652)
- Mature APEX II tool chain for legacy designs (vs Newer Stratix / Cyclone families)
Design Notes
The 724-ball FCBGA package requires a 4- to 6-layer PCB with controlled-impedance routing for LVDS and GTL+ signals. Use 0.8 mm pitch escape routing from the BGA fanout and stack vias appropriately; signal-via stubs longer than 1.5 mm degrade signal integrity at >500 Mbps. A continuous ground plane beneath the BGA improves power delivery and reduces SSO noise. Decoupling must use 0.1 uF X7R ceramics placed within 3 mm of each power pin, with a bulk 22 uF tantalum or polymer cap per power rail.
Estimated: at quiescent VCCA=1.8V, VCCIO=3.3V, and a typical APEX II toggle rate of 100 MHz with 60% utilization, total power is roughly 2-3 W. The 724-FCBGA theta_JA is approximately 15 C/W in still air, giving a junction temperature rise of 30-45 C above ambient. For sealed enclosures with no airflow, add a small heatsink or thermal pad bonded to the BGA lid to keep Tj below 100 C. Confirm exact power with the Quartus II PowerPlay early in design.
Do not assume newer Quartus versions support APEX II - Quartus dropped APEX II device support after v9.1. Use Quartus II 9.0 or earlier for this device. JTAG configuration requires the older ByteBlasterMV or USB-Blaster download cable; newer cables may need driver-mode compatibility settings. Verify power sequencing: VCCIO must not exceed VCCA by more than 4.0V during power-up, or ESD cells in the I/O ring can latch up.
Differential LVDS pairs on APEX II require matched trace lengths within 150 mil to keep skew under 50 ps; use a serpentine routing pattern rather than random jogging. Place PLLs close to high-speed LVDS channels to minimize reference-clock routing distance, and keep PLL analog supply pins (VCCA_PLL) filtered with a ferrite bead plus 10 uF and 0.1 uF caps. JTAG TMS, TCK, TDI, TDO traces should be length-matched within 1 inch to avoid configuration issues.
Compliance Information
RoHS/REACH/lead-free status not stated in the verified web data for EP2A15B724C; Altera APEX II family was generally lead-free per Altera's standard product policy at the time of manufacture, but specific RoHS/REACH statements for this exact MPN could not be confirmed from the provided sources and are marked [DATA_NEEDED].
