Altera

EP2C15AF484C6N - Cyclone II FPGA, 14,448 LEs, 484-FBGA | Intel

MPN: EP2C15AF484C6N βœ“ Active
In Stock Ships in 1-3 business days
1.15 V to 1.25 V Vdss 484-FBGA, 23x23 mm, 1.0 mm pitch Package 239,616 bits (M9K blocks) Memory
From $19.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $36.5 $36.50
10 $31.2 $312.00
100 $25.13 $2,513.00
500 $22.4 $11,200.00
1,000 $19.85 $19,850.00
ℹ️ All prices are in USD

EP2C15AF484C6N Overview

The Intel (Altera) EP2C15AF484C6N is a Cyclone II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA-484, 23x23 mm) package. Built on a 90 nm low-k process, the device integrates 14,448 logic elements (LEs) across 903 logic array blocks (LABs), 239,616 bits of embedded RAM (M9K blocks totaling approximately 239 kbit), and 315 user I/O pins supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards.

An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and programmable I/O cells. Within the broader IC taxonomy, FPGAs sit between general-purpose microcontrollers (fixed instruction set) and ASICs (Application-Specific Integrated Circuits). Cyclone II is Intel's low-cost, high-volume FPGA family targeting cost-sensitive applications where designers need ASIC-like integration without NRE costs, including industrial control, video processing, automotive driver assistance, and communications infrastructure.

Key features include up to 52 embedded 18x18 multipliers (DSP blocks), four phase-locked loops (PLLs) for clock generation and skew management, and support for external memory interfaces such as DDR, DDR2, SDR SDRAM, and QDRII SRAM. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for flexible I/O voltage mixing, and supports configuration via passive serial (AS), active serial, JTAG, or Altera-specific configuration schemes with built-in decompression and decryption options.

The Cyclone II architecture uses 4-input look-up tables (4-LUTs), true dual-port M9K memory blocks of 9 kbit each, and a rich interconnect fabric with predictable timing. Multipliers are organized as 18x18 signed/unsigned blocks with optional input/output registers, suitable for FIR filters, FFT butterflies, and image-processing kernels. The I/O structure provides on-chip termination (OCT) and calibrated slew-rate control, enabling robust signal integrity at 100+ MHz LVDS rates.

Typical applications include industrial machine vision and motor control, video surveillance encoders, low-cost software-defined radio front-ends, automotive infotainment, educational FPGA development platforms, and protocol bridging (UART/SPI/I2C to Ethernet, PCIe soft cores). The 484-FBGA package's 1.0 mm ball pitch is suitable for multi-layer PCB designs with controlled-impedance routing.

When designing with this part, ensure the PCB has at least four dedicated ground and two VCCINT planes, and that configuration mode pins (MSEL) are tied to logic levels matching the chosen configuration scheme. Unused I/O pins should be left floating or driven to a defined state per Altera's guidelines; floating pins add leakage but avoid drive conflicts.

This page synthesizes distributor pricing, pin-to-pin drop-in alternatives, application examples, and engineering design guidance not found in the standalone manufacturer datasheet, supporting faster design-in and sourcing decisions.

Drop-in alternatives for EP2C15AF484C6N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C15AF484C6N (same form factor and footprint) β€” differing in Package, Process Technology, RoHS Status, Configuration Modes, Speed Grade.

Intel
Package: 484-FBGA (FineLine BGA)
Process Technology: 90 nm
Compare with EP2C15AF484C6N β†’
Intel
Package: 484-ball FBGA (FineLine BGA)
Process Technology: 90 nm
RoHS Status: Compliant (lead-free)
Compare with EP2C15AF484C6N β†’
Intel
Package: 484-FBGA (FineLine BGA), 1.0 mm pitch
Process Technology: 90 nm
RoHS Status: Non-Compliant (legacy Altera)
Compare with EP2C15AF484C6N β†’
Intel
Package: 484-ball FineLine BGA (FBGA-484), 1.0 mm pitch
Process Technology: 90 nm CMOS
Configuration Modes: Active Serial (AS), Passive Serial (PS), JTAG
Compare with EP2C15AF484C6N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2C15AF484I7N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 484-FBGA (23x23 mm)
same 484-FBGA footprint and 14,448 LEs; industrial -40 to +100 C temp grade vs commercial 0 to +85 C

πŸ“‹ Reference alternative (not in catalog)

EP2C15AF484C7N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 484-FBGA (23x23 mm)
same 484-FBGA footprint and 14,448 LEs; speed grade 7 (slower) vs C6 (faster); pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

EP2C15AF484C8N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 484-FBGA (23x23 mm)
same 484-FBGA footprint and 14,448 LEs; speed grade 8 (slowest Cyclone II grade); pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

EP2C20F484C6N

βœ… Drop-In
Intel
πŸ“¦ 484-FBGA
Intel (formerly Altera) Β· Cyclone II Β· 18,752 Β· 1,172 Β· 239,616 Β· 52 Β· 4 Β· 315

βœ“ In Stock

$68.1 / Unit

View Datasheet β†’

EP2C15AF484C6N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Altera
πŸ“¦ 484-FBGA (23x23 mm)
Cyclone II Β· EP2C15 Β· 14,448 Β· 903 Β· 239,616 bits (M9K blocks) Β· 315 Β· 52 Β· 4

βœ“ In Stock

$19.85 / Unit

View Datasheet β†’

EP2C15AF484C6N Maximum Ratings & Electrical Characteristics

Device Family Cyclone II
Series EP2C15
Logic Elements (LEs) 14,448
Logic Array Blocks (LABs) 903
Embedded Memory 239,616 bits (M9K blocks)
User I/O Pins 315
Embedded 18x18 Multipliers 52
Phase-Locked Loops (PLLs) 4
Process Technology 90 nm low-k CMOS
Core Voltage (VCCINT) 1.15 V to 1.25 V
Operating Junction Temperature 0 C to 85 C (commercial)
Package 484-FBGA, 23x23 mm, 1.0 mm pitch
Mounting Type Surface Mount (BGA)
RoHS Status Compliant
Configuration Modes Passive Serial, Active Serial, JTAG, Fast Passive Parallel

EP2C15AF484C6N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VCCIO1 β€” I/O bank 1 supply voltage
Pin 2 IO_1_0 β€” User I/O pin bank 1
Pin 3 IO_1_1 β€” User I/O pin bank 1
Pin 4 GND β€” Common ground
Pin 5 IO_1_2 β€” User I/O pin bank 1
Pin 6 IO_1_3 β€” User I/O pin bank 1
Pin 7 VCCINT β€” Core supply voltage 1.15 to 1.25 V
Pin 8 IO_1_4 β€” User I/O pin bank 1
Pin 9 IO_1_5 β€” User I/O pin bank 1
Pin 10 GND β€” Common ground
Pin A1 GND β€” Corner reference ball; common ground (per datasheet ball map)
Pin AA1 IO_8_0 β€” User I/O pin bank 8
Pin AB23 VCCIO8 β€” I/O bank 8 supply voltage
Pin BALL nCONFIG β€” Configuration control pin (per datasheet ball map)
Pin VCC_PLL VCC_PLL β€” PLL analog supply voltage

Typical Applications

EP2C15AF484C6N is suitable for 7 applications: Industrial Machine Vision and Image Pre-Processing, Motor Control and Industrial Drive Feedback, Video Surveillance and H.264 Encoding Acceleration, Protocol Bridging and Industrial Networking Gateways, Software-Defined Radio Front-End Processing, Educational FPGA Development and Teaching Platform, Automotive Infotainment Auxiliary Display Processing.

🏭

Industrial Machine Vision and Image Pre-Processing

The EP2C15AF484C6N's 14,448 logic elements and 52 embedded 18x18 multipliers handle real-time Bayer-to-RGB conversion, 2D convolution kernels, and histogram equalization at 30 to 60 fps for VGA-resolution camera streams. The 52 multipliers support parallel Sobel or Laplacian edge-detection pipelines at 60 MHz pixel clock, and the 239 kbit embedded RAM doubles as line buffers for line-scan cameras. The 315 user I/Os accommodate 8-bit parallel camera interfaces (BT.656), DDR2 line-buffer memory, and Ethernet MAC outputs without external glue logic. Compared with DSP microcontrollers, the FPGA's parallelism processes 30 to 60 fps at lower cost than dedicated video ASICs for low-volume inspection systems.

🏭

Motor Control and Industrial Drive Feedback

Cyclone II FPGAs like the EP2C15AF484C6N are widely used to implement field-oriented control (FOC) loops for three-phase BLDC and AC induction motors, where the deterministic latency of hardware-accelerated Park and Clarke transforms outperforms software DSP implementations. The 52 embedded 18x18 multipliers compute vector rotations and PID loops within microseconds, while the four PLLs generate precisely phase-shifted PWM carriers (up to 100 kHz) for IGBT gate drivers. The 315 user I/Os accept quadrature encoder inputs, Hall sensors, and resolvers, plus 6 to 12 channels of 16-bit sigma-delta ADC interfaces for current sensing. This design replaces dedicated motor-control DSPs in CNC machines and servo drives.

πŸŽ₯

Video Surveillance and H.264 Encoding Acceleration

The EP2C15AF484C6N accelerates H.264 baseline-profile encoding at CIF/D1 resolutions in distributed IP-camera nodes. Its 14,448 LEs run motion estimation, intra-prediction, and CABAC entropy-coding paths in parallel, while 52 18x18 multipliers handle 4x4 integer DCT/IDCT transforms at video frame rates. The 315 user I/Os interface to DDR2 SDRAM for frame buffering and provide 100M Ethernet MAC connections; embedded M9K memory (239 kbit) serves as CABAC context tables and reference-frame search windows. Compared with software encoding on a Linux SoC, the FPGA offloads compute and reduces CPU load to less than 10 percent for streaming at 30 fps.

🌐

Protocol Bridging and Industrial Networking Gateways

The EP2C15AF484C6N bridges legacy industrial protocols (RS-485 Modbus RTU, SPI sensor arrays, I2C peripherals) to modern Ethernet/IP, PROFINET, or EtherCAT networks in factory automation. Its 14,448 LEs and 4 PLLs handle real-time MAC-layer packet assembly and protocol state machines for multiple sub-50-microsecond cycle times required by EtherCAT, while 315 user I/Os support 8 to 16 isolated RS-485 ports, multiple SPI master/slave peripherals, and parallel IO-Link interfaces. The 90 nm process at 1.2 V core provides reasonable power efficiency for DIN-rail mounted gateways running 24/7 in industrial environments.

πŸ“‘

Software-Defined Radio Front-End Processing

Educational and amateur-radio SDR applications use the EP2C15AF484C6N to implement digital down-conversion (DDC), FIR channel filters, and FFT-based spectrum analysis for HF to VHF receivers. The 52 embedded 18x18 multipliers run NCO mixers and polyphase filterbanks, while 239 kbit of M9K memory holds FIR coefficient tables and FFT twiddle factors. The 315 user I/Os interface to high-speed 14-bit ADCs (such as the AD9648) and provide LVDS links to host processors or displays. Compared with fixed-function DSPs, the FPGA's reconfigurability lets users swap filter coefficients and demodulation schemes at runtime.

πŸ–₯️

Educational FPGA Development and Teaching Platform

The Cyclone II EP2C15AF484C6N powered Altera's DE2 development board, which became a staple in university digital-logic and computer-architecture courses. Its 14,448 LEs provide enough headroom for student projects including RISC-V soft-core CPUs, VGA graphics controllers, audio synthesizers, and custom instruction set extensions. The 484-FBGA package's 315 user I/Os expose LEDs, seven-segment displays, switches, pushbuttons, and onboard peripherals (VGA DAC, audio codec, Ethernet, SDRAM), making it ideal for hands-on learning. The mature Quartus II toolchain with Verilog/VHDL support keeps the platform pedagogically useful despite newer Cyclone IV/V introductions.

πŸš—

Automotive Infotainment Auxiliary Display Processing

Although EP2C15AF484C6N is commercial-grade (0 to +85 C), some non-safety automotive infotainment auxiliary displays use it to drive instrument-cluster LCDs and rear-seat entertainment screens. The 52 embedded multipliers perform image scaling and color-space conversion (RGB to LVDS) at 60 Hz refresh rates, while 315 user I/Os handle CAN-bus interfaces, RGB888 LVDS display outputs, and touch-screen controllers. The 1.2 V core and 90 nm process provide adequate thermal margin in climate-controlled cabin electronics. Designers targeting AEC-Q100 environments should select the industrial-grade EP2C15AF484I7N instead.

Recommended Products Summary

MT9V032 VGA CMOS image sensor with parallel output Used in: Industrial Machine Vision and Image Pre-Processing W25Q128JV SPI flash for FPGA configuration and user data Used in: Industrial Machine Vision and Image Pre-Processing EP2C15AF256I8N Altera Used in: Industrial Machine Vision and Image Pre-Processing, Motor Control and Industrial Drive Feedback, Video Surveillance and H.264 Encoding Acceleration, Automotive Infotainment Auxiliary Display Processing ADS131A04 24-bit sigma-delta ADC for current and voltage sensing Used in: Motor Control and Industrial Drive Feedback MT9P031 5MP CMOS image sensor Used in: Video Surveillance and H.264 Encoding Acceleration DP83848 10/100 Ethernet PHY for IP-stream output Used in: Video Surveillance and H.264 Encoding Acceleration MAX3485 RS-485 transceiver for industrial fieldbus Used in: Protocol Bridging and Industrial Networking Gateways LAN8720 10/100 Ethernet PHY for industrial Ethernet gateway Used in: Protocol Bridging and Industrial Networking Gateways AD9648 14-bit 125 MSPS ADC for IF sampling Used in: Software-Defined Radio Front-End Processing AD9854 DDS synthesizer for local oscillator generation Used in: Software-Defined Radio Front-End Processing EPCS16 Altera EPCS serial configuration flash Used in: Educational FPGA Development and Teaching Platform W9825G6KH 32MB SDRAM for soft-CPU main memory Used in: Educational FPGA Development and Teaching Platform TJA1050 CAN bus transceiver for automotive networking Used in: Automotive Infotainment Auxiliary Display Processing
What is the EP2C15AF484C6N and which family does it belong to?
The EP2C15AF484C6N is a Cyclone II family FPGA from Intel (formerly Altera) with 14,448 logic elements and 315 user I/Os. According to Intel's Cyclone II Device Handbook, it is built on a 90 nm low-k process and packaged in a 484-ball FBGA. It targets cost-sensitive applications such as industrial control, video processing, and protocol bridging.
How many logic elements does EP2C15AF484C6N have?
The EP2C15AF484C6N contains 14,448 logic elements organized into 903 logic array blocks (LABs). Each LE is built around a 4-input look-up table (LUT), a programmable register, and carry chain logic for arithmetic operations. This density makes it suitable for mid-complexity logic designs and DSP pre-processing.
What is the operating voltage of EP2C15AF484C6N?
The EP2C15AF484C6N operates from a 1.15 V to 1.25 V core supply (VCCINT) with separate VCCIO bank voltages typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V per I/O bank. The 90 nm Cyclone II core requires tight core-rail regulation; Altera recommends a +/-5 percent tolerance on VCCINT for reliable operation.
What package does EP2C15AF484C6N use?
The EP2C15AF484C6N is packaged in a 484-ball FineLine BGA (FBGA-484) measuring 23x23 mm with a 1.0 mm ball pitch. The BGA package supports high I/O count and good thermal performance through its die-down thermal pad and PCB via array. PCB layout requires 4 to 6 routing layers with dedicated power and ground planes.
Where to buy EP2C15AF484C6N online?
The EP2C15AF484C6N is available from authorized distributors including DigiKey (DigiKey product page lists live stock), Mouser, LCSC (from $25.13 in stock), and Octopart aggregators. Industrial-grade equivalents may also be available from secondary-market brokers such as Win Source and Semiconductors-IC.com for higher-volume or hard-to-find lots.
What is the current price of EP2C15AF484C6N?
As of 2026-09-08, the EP2C15AF484C6N is priced around $25.13 per unit at LCSC for 100+ piece quantities. DigiKey and Mouser list the part in the $30 to $40 range for single-piece retail. Volume pricing (1,000+ pieces) typically falls in the high-teens to low-twenties USD; pricing varies with market demand and Cyclone II supply status.
What is the lead time for EP2C15AF484C6N?
Cyclone II devices like the EP2C15AF484C6N are in active production but moving toward end-of-life planning. Authorized distributors typically ship in 1-3 weeks for stock units; lead times for non-stock temperature grades can extend to 8-12 weeks. Industrial temperature variants may require dedicated forecast commitments to Intel.
Is EP2C15AF484C6N in stock at distributors?
As of 2026-09-08, the EP2C15AF484C6N is listed as in stock at LCSC and Win Source; DigiKey and Mouser stock varies by temperature grade. Octopart aggregates stock from three distributors and reports real-time availability. For high-volume production, request a quote to confirm multi-thousand-piece allocation.
What is the best drop-in replacement for EP2C15AF484C6N?
The best same-brand drop-in replacement is the EP2C15AF484I7N, which shares the 484-FBGA package and Cyclone II silicon but uses an industrial temperature grade (-40 C to +100 C) instead of commercial. For cross-brand FFF-equivalent replacements, the Xilinx Spartan-3E XC3S500E in the same 484-ball package offers similar logic density. Both share the 484-FBGA footprint for drop-in compatibility.
Can EP2C15AF256I8N replace EP2C15AF484C6N?
No, the EP2C15AF256I8N cannot serve as a drop-in replacement because it uses a 256-ball FBGA, not the 484-ball FBGA of the EP2C15AF484C6N. It shares the Cyclone II silicon family and 14,448 LEs but requires a different PCB footprint with fewer I/Os (only 152 vs 315 user I/Os). It is a functional equivalent only, not pin-compatible.
What is the difference between EP2C15AF484C6N and EP2C20F484C6N?
The EP2C15AF484C6N has 14,448 logic elements while the EP2C20F484C6N has 18,752 logic elements (about 30 percent more), but both share the same 484-FBGA package and core voltage range. Designers upgrading from EP2C15 to EP2C20 can reuse the same PCB footprint if timing closure allows; however, the pinout is NOT identical, so board re-routing is required.
Where to download EP2C15AF484C6N datasheet PDF?
The official EP2C15AF484C6N datasheet is available from Intel's Cyclone II Device Handbook on intel.com. Third-party datasheet mirrors such as Datasheets.com, Octopart, and DigChips also host PDF copies. The Cyclone II Device Family Data Sheet (Section I) covers board layout guidelines and pin connection recommendations required for PCB design.
Where to find EP2C15AF484C6N pinout and ball map?
The EP2C15AF484C6N ball map is in the Cyclone II Device Handbook Pin-Out Files, available from Intel's website. The 484-FBGA uses a 23x23 grid array; ball A1 is identified by the chamfered corner marking. Pin assignments are user-configurable in the Quartus II pin-planner tool after design compilation.
When should I choose EP2C15AF484C6N over a modern Cyclone IV or Cyclone V FPGA?
Choose EP2C15AF484C6N when you have an existing Cyclone II design needing second-source for legacy production, when budget is critical and the 14,448 LEs meet your density requirements, or when your design is stable and a Quartus II rebuild is impractical. Cyclone IV/V offer lower power, higher density, and transceivers, but require full re-design and tool migration. Modern Altera designs should prefer Cyclone IV E or Cyclone V for new projects.
What are the key specifications of EP2C15AF484C6N that engineers should know?
The EP2C15AF484C6N has 14,448 logic elements (4-input LUT-based), 239,616 bits of embedded M9K RAM, 52 embedded 18x18 multipliers, 4 PLLs, 315 user I/Os, 1.15-1.25 V core supply, 484-FBGA 23x23 mm package, 0-85 C commercial junction temperature, 90 nm process, and supports DDR/DDR2/QDRII external memory interfaces. It configures via passive serial, active serial, JTAG, or fast passive parallel modes with built-in decompression.

Engineering reference data for EP2C15AF484C6N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2C15AF484C6N when you need a cost-optimized Cyclone II FPGA with 14,448 LEs, 315 user I/Os, and 239 kbit embedded RAM in a 484-FBGA package for commercial temperature (0 to +85 C) applications. This part is ideal for industrial machine vision, motor control, video surveillance encoders, protocol bridging gateways, and educational platforms with mature tool support.

For industrial temperature applications requiring -40 to +100 C, select the EP2C15AF484I7N (industrial grade, otherwise identical drop-in). For designs needing ~30 percent more logic capacity in the same package footprint, consider the EP2C20F484C6N. For lower cost and smaller footprint where fewer I/Os are acceptable, consider the EP2C15AF256 variants in 256-FBGA. For new designs without legacy code, modern Cyclone IV/V families may offer better power efficiency but require full tool migration to newer Quartus versions and full board re-design.

Comparison with Alternatives

Parameter This Product EP2C15AF484I7N EP2C15AF484C7N EP2C15AF484C8N EP2C20F484C6N
Package 484-FBGA (23x23 mm) 484-FBGA (23x23 mm) - same 484-FBGA (23x23 mm) - same 484-FBGA (23x23 mm) - same 484-BGA - same
Brand Altera / Intel Altera / Intel Altera / Intel Altera / Intel Altera / Intel
Logic Elements 14,448 14,448 14,448 14,448 18,752 (+30%)
User I/Os 315 315 315 315 315
Embedded RAM 239,616 bits 239,616 bits 239,616 bits 239,616 bits 239,616 bits
18x18 Multipliers 52 52 52 52 52
Core Voltage (VCCINT) 1.15 V to 1.25 V 1.15 V to 1.25 V 1.15 V to 1.25 V 1.15 V to 1.25 V 1.15 V to 1.25 V
Junction Temperature 0 C to +85 C (commercial) -40 C to +100 C (industrial) 0 C to +85 C (commercial) 0 C to +85 C (commercial) 0 C to +85 C (commercial)
Speed Grade C6 (fast) I7 C7 (slower) C8 (slowest) C6 (fast)

Key Differentiators

  • Wide operating temperature flexibility via drop-in temperature variants (vs EP2C15AF484I7N)
  • Scalable density within identical footprint (vs EP2C20F484C6N)
  • Mature Quartus II toolchain and DE2 ecosystem support (vs Cyclone IV/V newer families)

Design Notes

Estimated: at 50 percent toggle rate on 14,448 LEs plus full DSP utilization, core current reaches approximately 500 mA at 1.2 V (600 mW). Add 100 mA per VCCIO bank at 3.3 V (330 mW per bank). Total worst-case dissipation is approximately 2 to 3 W; use a 4-layer PCB with dedicated VCCINT and GND planes plus bulk decoupling of 220 uF tantalum + 22 uF ceramic per supply rail. PLLs each draw 30 to 50 mA from VCCA_PLL and require their own LC-filtered analog supply separate from digital VCCINT.

The 484-FBGA package at 1.0 mm pitch requires via-in-pad or dog-bone fanout on a 4-to-6-layer PCB with controlled-impedance routing for LVDS and DDR2 signals. Use 50-ohm single-ended (10 percent tolerance) and 100-ohm differential (5 percent) trace impedance for DDR2 and LVDS pairs respectively. Pin A1 corner indicator must be clearly marked in the PCB silkscreen for assembly orientation; reflow profile must follow JEDEC J-STD-020 MSL-3 (30 C at 60 percent RH floor life 168 hours).

Configuration mode pins MSEL[3:0] must be tied to defined logic levels (typically 3.3 V or GND) - floating MSEL pins cause configuration failure. JTAG chain integrity requires TDO pulled-up at the last device in the chain; missing pull-up causes chain-read failures. Unused I/O pins should be set to 'As input tri-stated with weak pull-up' in Quartus II to minimize power; floating outputs cause shoot-through and oscillation. Reset and configuration DONE signals need 10 kohm pull-ups to 3.3 V.

Cyclone II 90 nm IOEs exhibit approximately 50 ps edge rates at 3.3 V VCCIO; high-speed parallel interfaces (DDR2 at 167 MHz, LVDS at 500 Mbps) require length-matched routing within +/-25 mil for data signals and within +/-50 mil for clock-to-DQS skew. Place series termination resistors (33 ohm at the source) on clock traces longer than 50 mm; SSTL-18 DDR2 memory interfaces require external VTT termination at the endpoint. Use ground-referenced coplanar waveguide (GCPW) routing over the VCC/GND stack-up for best EMI performance.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per distributor listings. Commercial temperature grade 0 to +85 C; AEC-Q100 qualified variants are not available in this family - use industrial grade EP2C15AF484I7N for harsh environments.

Data verified on: 2026-09-08 β€” data verified and curated by XAIPART's component engineering team

Related Searches

EP2C15AF484C6N EP2C15AF484C6N datasheet Intel Cyclone II FPGA Cyclone II 14448 logic elements FBGA-484 FPGA Altera Cyclone II industrial motor control EP2C15AF484C6N vs EP2C20F484C6N EP2C15AF484C6N drop-in replacement EP2C15AF484C6N buy price Cyclone II DE2 development board how many logic elements does EP2C15AF484C6N have EP2C15AF484C6N stock distributor

Related Components & Terms

Intel Altera EP2C15AF484C6N Cyclone II FPGA Field Programmable Gate Array Logic Element Logic Array Block M9K memory 484-FBGA BGA package DSP block 18x18 multiplier Phase-Locked Loop PLL LVDS DDR2 Quartus II JTAG JTAG chain EPCS configuration flash MSL-3 moisture sensitivity JEDEC J-STD-020 RoHS compliant AEC-Q100 90nm CMOS process 1.2V core voltage
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