EP2C20F484C7N - Cyclone II FPGA, 18,752 LEs, 484-FBGA | Intel
MPN: EP2C20F484C7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $72.22 | $72.22 |
| 10 | $65.5 | $655.00 |
| 100 | $56.8 | $5,680.00 |
| 500 | $49.2 | $24,600.00 |
| 1,000 | $42.5 | $42,500.00 |
EP2C20F484C7N Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as memory and PLLs into a single silicon die. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and are widely used as glue logic, co-processors, and prototype ASICs in digital systems. The Cyclone II family sits in the low-cost, low-power tier of the Intel FPGA portfolio, targeting volume applications where cost-per-logic-element is the dominant selection criterion.
Key features include 52 embedded 18x18 multipliers, four general-purpose PLLs, 315 maximum user I/Os, and support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. The device supports up to 1.5 Mbits of on-chip memory distributed across M4K blocks, enabling high-throughput FIFO and buffering operations without external SRAM.
Cyclone II devices use a 4-input look-up table (LUT)-based architecture with embedded multiplier blocks and M4K RAM blocks, providing an efficient balance between logic density and DSP performance. The 90 nm process delivers competitive static and dynamic power characteristics for the family, with multiple low-power modes accessible through the Quartus II design software. Configuration is supported via active serial (AS), passive serial (PS), and JTAG modes using industry-standard EPCS configuration devices.
Typical applications include industrial motor control, video processing pipelines, telecommunications line cards, consumer electronics display controllers, and education/hobbyist development platforms. The combination of moderate logic density, abundant I/O, and an FBGA-484 footprint makes it well suited to mid-complexity designs requiring parallel interfaces and on-chip DSP capability.
When designing with this device, allocate sufficient PCB area for the 1 mm pitch FBGA-484 footprint and route all 315 user I/Os through at least four signal layers. Use the Quartus II design software with the Cyclone II device library to validate timing closure and resource utilization before committing to layout. The estimated EOL date of 2026 (per industry cross-reference data) means new designs should evaluate Cyclone IV or Cyclone V replacements for long-term production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2C20F484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C20F484C7N (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Configuration Modes, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C20F484C7
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EP2C20F484C6N
✅ Drop-In✓ In Stock
$68.1 / Unit
View Datasheet →EP2C20F484C6
✅ Drop-In✓ In Stock
$65.31 / Unit
View Datasheet →EP2C15AF484C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.85 / Unit
View Datasheet →EP2C20F484C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 18,752 |
| Embedded Memory Bits | 239,616 bits |
| Maximum User I/Os | 315 |
| Number of CLBs | 1172 |
| Total RAM Bits | 239616 |
| Embedded 18x18 Multipliers | 52 |
| PLLs | 4 |
| Maximum Internal Clock Frequency | 450 MHz |
| Process Technology | 90 nm CMOS |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | -7 |
| Package | 484-ball FineLine BGA (FBGA-484), 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix, Pb-free matte tin) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| I/O Standard Support | LVTTL, LVCMOS, SSTL, LVDS |
EP2C20F484C7N 484-ball fineline bga (fbga-484), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2C20F484C7N (484-ball fineline bga (fbga-484), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C20F484C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C20F484C7N is suitable for 6 applications: Industrial Motor Control, Video Processing Pipeline, Telecommunications Line Card Glue Logic, Consumer Display Controller, Education and Development Platform, Legacy Industrial Replacement / EOL Bridging.
Industrial Motor Control
The EP2C20F484C7N fits industrial motor-control applications because its 52 embedded 18x18 multipliers deliver sufficient DSP throughput for field-oriented control (FOC) loops, while the 315 user I/Os in the FBGA-484 package expose the PWM channels, encoder inputs, and communication ports needed to drive a 3-phase inverter. With four PLLs and a 450 MHz internal clock, the device closes the 16 kHz current-loop and 1-4 kHz position-loop timing budgets with margin. Compared to a microcontroller, the FPGA offers deterministic parallel processing for multi-axis drives where two or three motors must be controlled simultaneously.
Recommended
Video Processing Pipeline
The EP2C20F484C7N handles entry-level video processing pipelines including color-space conversion, scaling, and on-screen display (OSD) overlay. The 239,616 bits of M4K embedded RAM provide line buffers sized for VGA-to-720p frame rates, while the 52 multipliers accelerate FIR filters for image sharpening and noise reduction. The 315 I/Os in FBGA-484 connect directly to LVDS/TTL camera interfaces and DVI/HDMI bridge chips, eliminating the need for an external memory controller in modest-bandwidth designs.
Recommended
Telecommunications Line Card Glue Logic
The EP2C20F484C7N functions as glue logic on telecommunications line cards, bridging framers, SERDES devices, and network processors through its 315 I/Os. The Cyclone II fabric implements custom TDM bus multiplexers, HDLC controllers, and alarm-monitoring state machines at clock rates up to 450 MHz. Four PLLs generate independent clocks for the TDM backplane, framer reference, and processor interface. The FBGA-484 package and 90 nm CMOS process provide a cost-effective solution for medium-volume line cards compared to high-end Stratix devices.
Recommended
Consumer Display Controller
The EP2C20F484C7N drives consumer display controllers in LCD TVs, digital photo frames, and projector front-ends by implementing LVDS-to-TTL conversion, gamma correction tables, and frame-rate conversion. The 52 embedded multipliers accelerate 2D image warping, while the 315 I/Os in FBGA-484 fan out to multiple display panel interfaces simultaneously. The -7 commercial speed grade and 0C-85C operating range meet typical consumer-electronics thermal envelopes without active cooling.
Recommended
Education and Development Platform
The EP2C20F484C7N is widely deployed on university and hobbyist FPGA development boards (DE1, DE2, and compatible kits) because its 18,752 logic elements provide ample room for teaching RTL design, CPU core implementation, and digital signal processing exercises. The Cyclone II architecture is fully documented in the legacy Quartus II design software, and the abundant educational materials, reference designs, and textbook examples make this FPGA a staple in embedded-systems curricula worldwide.
Recommended
Legacy Industrial Replacement / EOL Bridging
The EP2C20F484C7N is the target part for legacy industrial designs approaching 2026 EOL, where redesign to Cyclone IV/V is not yet cost-justified. Drop-in stock from authorized distributors extends production availability for 12-24 months while engineering teams complete next-generation designs. The identical FBGA-484 footprint between this part and the EP4CE22F484C7N enables layout-compatible PCBs, so a single board design can be assembled with either generation during the transition window.
Recommended
Recommended Products Summary
Engineering reference data for EP2C20F484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C20F484C7 | EP2C20F484C6N | EP2C20F484C6 | EP2C15AF484C6N |
|---|---|---|---|---|---|
| Package | FBGA-484 (1.0 mm pitch) | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Family | Cyclone II | Cyclone II | Cyclone II | Cyclone II | Cyclone II |
| Logic Elements | 18,752 | 18,752 | 18,752 | 18,752 | 15,408 (-18%) |
| Speed Grade | -7 (commercial, faster) | -7 (same) | -6 (slower) | -6 (slower) | -6 (slower) |
| Embedded 18x18 Multipliers | 52 | 52 | 52 | 52 | 56 (Cyclone II 15 family) |
| Embedded RAM | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits |
| Lead-Free / RoHS | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Approx. Unit Price (qty 1) | $72.22 | Lower (leaded discount) | $58-65 (slower grade) | $50-58 (leaded, slower) | $45-55 (lower density) |
Key Differentiators
- Highest speed grade in FBGA-484 for Cyclone II EP2C20 family (vs EP2C20F484C6N)
- Lead-free / RoHS compliant ball finish (vs EP2C20F484C7)
- Maximum logic density in EP2C family at FBGA-484 (vs EP2C15AF484C6N)
Design Notes
Estimated: the FBGA-484 footprint at 1.0 mm pitch requires a PCB stackup with at least four signal layers and microvia or via-in-pad construction for reliable BGA fanout. Route signal escape traces on the top layer immediately under the BGA using 4-mil traces and 4-mil spacing, with the second layer as a ground plane for return-path continuity. Plan for a 6-6-6 mil (trace-space-pad) design rule; tighter rules require laser-drilled microvias. The device's 315 user I/Os in 484 balls means 169 balls are power/ground/JTAG - ensure adequate decoupling with 0.1 uF X7R capacitors placed within 100 mil of every power pin pair.
Estimated: at the -7 commercial speed grade with 100% logic utilization toggling at 200 MHz, the EP2C20F484C7N dissipates approximately 1.5-2.5 W. The FBGA-484 package's theta_JA is approximately 18-22 C/W on a standard 4-layer JEDEC test board with thermal vias, yielding a junction temperature rise of 30-50 C above ambient. For designs exceeding 70% utilization or sustained 250+ MHz operation, add a thermal via array under the package center pad and consider a small heatsink for enclosed industrial enclosures.
Cyclone II FPGAs require a configuration file (.sof or .pof) loaded at power-on via AS, PS, or JTAG mode. Do not confuse Cyclone II with Cyclone III/IV/V families - configuration schemes, bitstream formats, JTAG IDs, and power-rail sequences are different, so a Cyclone IV bitstream will not program a Cyclone II device. For new designs approaching the 2026 EOL, evaluate the EP4CE22F484C7N (Cyclone IV E) as a footprint-compatible replacement; do not assume existing Quartus II Cyclone II designs will recompile without changes.
Place configuration memory (EPCS4/EPCS16 for AS mode) within 2 inches of the FPGA's DATA0/DCLK/nCONFIG/nSTATUS pins and route with 50-ohm controlled impedance to avoid bitstream corruption. Decouple each VCCINT and VCCIO rail with a 100 uF bulk capacitor plus 0.1 uF and 0.01 uF ceramic capacitors within 50 mil of the respective package balls. Keep PLL analog supply pins (VCC_PLL) isolated with a ferrite bead and dedicated decoupling to minimize jitter on PLL-driven clocks.
Compliance Information
Pb-free matte tin ball finish per 'N' suffix; Halogen Free Compliant per industry cross-reference data; AEC-Q100 not applicable (industrial FPGA, not automotive qualified).
