EP2S90F780I4NAB - Stratix II FPGA, 90K LEs, 780-FBGA | Intel
MPN: EP2S90F780I4NAB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1390 | $1,390,000.00 |
EP2S90F780I4NAB Overview
What is a Stratix II FPGA? The Stratix II is a 90 nm FPGA architecture that introduced the adaptive logic module (ALM) - an 8-input fracturable look-up-table building block that replaced the older 4-input LUT paradigm and delivers roughly 50% higher logic utilization. FPGAs sit at the top of the programmable-logic hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> SoC FPGA. They are the dominant platform for high-throughput parallel DSP, high-speed serial I/O aggregation, and ASIC prototyping.
Key features include 12 transceiver blocks supporting up to 3.125 Gbps per channel, dedicated DSP blocks for 18x18 multipliers, distributed and block RAM, and on-chip PLLs. The 780-FBGA package exposes 534 user I/O - one of the highest pin counts in the Stratix II family - making it suitable for I/O-rich designs such as multi-port line cards, video processing pipelines, and large ASIC prototypes. The device supports DDR/DDR2/QDR memory interfaces through dedicated DQS pins.
The Stratix II architecture uses 1.2V core supply with 0.8/1.2/1.5/1.8/2.5V tolerant I/O banks, enabling mixed-voltage interfacing without external level shifters. Internal signal integrity is improved by the ALM's fracturable LUT, which lets the place-and-route tool pack two smaller functions into one ALM and reduces routing congestion on dense 90K-LE designs.
Typical applications include telecom line cards with multi-gigabit serial interfaces, ASIC prototyping for sub-30-million-gate designs, broadcast video processing, military/aerospace signal processing, and high-speed data acquisition. The 90 nm process offers a favorable cost-per-LE for legacy designs in long-lifecycle defense and industrial programs.
When designing with this device, ensure the Quartus II design software version supports the Stratix II device family (Quartus II 9.1 SP2 or earlier is the last officially supported release). Verify DDR2 interface timing against the specific speed grade (I4 = -4 industrial), and use the ALTDDIO megafunction for source-synchronous interfaces to meet setup/hold margins.
This page synthesizes distributor pricing, same-package Stratix II alternatives, and practical design notes not aggregated in the manufacturer datasheet, helping engineers make a faster sourcing and selection decision.
Drop-in alternatives for EP2S90F780I4NAB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S90F780I4NAB (same form factor and footprint) — differing in Package, RoHS Status, Mounting Type, Logic Elements, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S130F780I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$210 / Unit
View Datasheet →EP2S90F780I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$188 / Unit
View Datasheet →EP2S90F780C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP2S90F780C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$365 / Unit
View Datasheet →EP2S60F672I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$220 / Unit
View Datasheet →EP2S90F780I4NAB Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Series | Stratix II |
| Logic Elements | 90,960 |
| Total RAM Bits | 4,520,448 (4.5 Mbit) |
| User I/O Count | 534 |
| Core Voltage | 1.15 V to 1.25 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I4 (industrial, -4) |
| Package | 780-BGA (29x29 mm) |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Transceivers | 12 channels up to 3.125 Gbps |
| DSP Blocks | Dedicated 18x18 multipliers |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2S90F780I4NAB 780-bga (29x29 mm) Pin Configuration Guide
Pin configuration for EP2S90F780I4NAB (780-bga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S90F780I4NAB.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S90F780I4NAB is suitable for 6 applications: Telecom Line Card Aggregation, ASIC Prototyping, Broadcast Video Processing, Military and Aerospace Signal Processing, High-Speed Data Acquisition, Industrial Control and Factory Automation.
Telecom Line Card Aggregation
The EP2S90F780I4NAB is well suited to telecom line-card aggregation designs where multi-gigabit serial channels and high logic density are required. Its 12 embedded transceivers support up to 3.125 Gbps per channel, enabling OC-48/STM-16 and 1G/2G Ethernet aggregation without external PHY devices. The 90,960 logic elements provide ample headroom for packet classification, traffic shaping, and custom MAC processing. The 534 user I/O pins permit direct connection to network processors, fabric ASICs, and DDR/DDR2 packet buffers, with on-chip DQS phase-shift circuitry eliminating external delay lines. Designers should use the ALTGXB megafunction in Quartus II 9.1 to configure the transceivers and the ALTDDIO megafunction for source-synchronous interfaces to keep timing margins within specification.
Recommended
ASIC Prototyping
The EP2S90F780I4NAB is widely used for ASIC prototyping of sub-30-million-gate designs because its 90,960 logic elements - combined with the Stratix II ALM architecture's 50% area advantage over 4-LUT FPGAs - deliver usable capacity approaching 1.5 million ASIC gates. The 4.5 Mbit of embedded RAM supports register files and FIFO buffers, and the dedicated 18x18 multipliers accelerate DSP verification of MAC arrays and FFT engines. The 534 user I/O permit prototyping of large SoCs with multiple memory buses, peripheral controllers, and external ASIC companion chips. For ASIC prototype bring-up, designers should partition the design by clock domain and use the Quartus II LogicLock feature to maintain stable floorplan across design iterations, then verify timing closure on the I4 speed grade against the target ASIC's worst-case corner.
Recommended
Broadcast Video Processing
The EP2S90F780I4NAB is a strong fit for broadcast video processing systems such as SD/HD-SDI routers, format converters, and video walls. The 90,960 logic elements handle real-time multi-stream SDI de/embedding, color-space conversion, and frame-rate conversion. The dedicated DSP blocks accelerate chroma resampling and motion estimation, while the 4.5 Mbit block RAM provides line buffers for video pipeline delay lines. The 534 user I/O support direct connection to multiple SDI PHY chips, DDR2 frame buffers, and control plane processors. Power estimation for a full HD-SDI router design with 8 input streams is approximately 8-10W at 100% utilization; designers should provide a minimum 4-layer PCB stack-up with a continuous ground plane to manage the 3.125 Gbps transceiver EMI and maintain signal-integrity compliance per SMPTE 259M/292M.
Recommended
Military and Aerospace Signal Processing
The EP2S90F780I4NAB's industrial temperature grade (-40C to +100C) and high-density logic make it suitable for military and aerospace signal-processing platforms such as radar front-end pre-processors, electronic warfare subsystems, and software-defined radio modems. The 12 transceivers support digital IF and JESD204B-class interfaces to ADCs/DACs, while the 4.5 Mbit block RAM provides high-bandwidth data buffers for FFT and pulse-compression pipelines. The 780-BGA package is available with MIL-PRF-38535 screening on some variants, making the Stratix II family a recognized choice for long-lifecycle defense programs. For aerospace designs, designers should perform single-event upset (SEU) analysis on configuration RAM and implement Triple Module Redundancy (TMR) on critical state machines, and use the Quartus II Error Detection CRC feature to monitor configuration integrity in-flight.
Recommended
High-Speed Data Acquisition
The EP2S90F780I4NAB fits high-speed data acquisition systems used in test & measurement, medical imaging, and scientific instrumentation. Its 12 transceivers interface directly to multi-Gsps ADCs and DACs via LVDS or sub-LVDS serial links, while the 4.5 Mbit block RAM provides acquisition buffers between the ADC and downstream DMA engines. The 534 user I/O permit direct connection to parallel ADC banks, DDR2/QDR-II+ memory for deep capture, and high-bandwidth PCIe or RocketIO links to host processors. For a typical 4-channel 1 Gsps acquisition design, designers should use the ALTSYNC_RX megafunction for source-synchronous ADC capture, the ALTDDIO megafunction for double-data-rate sampling, and apply Quartus II's TimeQuest timing analyzer to validate setup/hold margins against the ADC's aperture window.
Recommended
Industrial Control and Factory Automation
The EP2S90F780I4NAB serves industrial control platforms requiring deterministic real-time processing - such as multi-axis motion controllers, PLC backplanes, and machine-vision inspection systems. The 90,960 logic elements host multiple EtherCAT, PROFINET, or SERCOS III master/slave stacks in parallel, while the dedicated 18x18 multipliers accelerate servo-loop PID and state-space control computations at sub-microsecond cycle times. The 4.5 Mbit block RAM and 12 transceivers permit direct connection to industrial cameras, encoder chains, and high-speed backplane links. The industrial -40C to +100C temperature grade supports deployment in unconditioned factory cabinets. For motion-control design, designers should use the Quartus II DSP Builder to model the control loop, then verify the FPGA implementation against the target servo bandwidth (typically 1-4 kHz) and tune the cycle time to the EtherCAT distributed-clock synchronization requirement.
Recommended
Recommended Products Summary
Engineering reference data for EP2S90F780I4NAB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F780I4N | EP2S90F780I4N | EP2S90F780C5N | EP2S90F780C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix II | Stratix II | Stratix II | Stratix II | Stratix II |
| Package | 780-BGA (29x29 mm) | 780-BGA (29x29 mm) - same | 780-BGA (29x29 mm) - same | 780-BGA (29x29 mm) - same | 780-BGA (29x29 mm) - same |
| Logic Elements | 90,960 | 132,540 (+45%) | 90,960 (same) | 90,960 (same) | 90,960 (same) |
| User I/O | 534 | 534 (same) | 534 (same) | 534 (same) | 534 (same) |
| Total RAM | 4.5 Mbit | 6.7 Mbit (+49%) | 4.5 Mbit (same) | 4.5 Mbit (same) | 4.5 Mbit (same) |
| Transceivers | 12 ch up to 3.125 Gbps | 12 ch up to 3.125 Gbps | 12 ch up to 3.125 Gbps | 12 ch up to 3.125 Gbps | 12 ch up to 3.125 Gbps |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I4 (industrial, -4) | I4 (industrial, -4) | I4 (industrial, -4) | C5 (commercial, -5) | C4 (commercial, -4) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest I/O count in the 780-BGA Stratix II family (vs EP2S60F672I4N)
- Optimal density for sub-1.5M gate ASIC prototyping (vs EP2S130F780I4N)
- Industrial temperature grade and speed-grade -4 in the same package (vs EP2S90F780C5N)
Design Notes
The 780-BGA (29x29 mm) package uses a 1.0 mm ball pitch and requires a minimum 4-layer PCB stack-up with a continuous ground plane beneath the device. Estimated: the 3.125 Gbps transceiver channels require 50-ohm controlled-impedance single-ended traces (100-ohm differential) with maximum 200 ps intra-pair skew - use HyperLynx or SiSoft QCD for SI verification before tape-out. Place decoupling as 0402-size 0.1uF X7R within 100 mil of each VCC pin, plus 10uF X5R bulk caps distributed around the package perimeter.
Estimated power dissipation for a fully utilized 90,960-LE design with all 12 transceivers active is approximately 12-15W. The 780-BGA package's theta_JA of approximately 8-10 C/W (with proper thermal via array) gives a junction temperature rise of 100-150C above ambient. A thermal via array of 9-16 vias per BGA ball landing pad, tied to internal ground/power planes, is required for reliable operation. For sealed enclosures, derate junction temperature to 100C max to maintain 100K-hour MTBF.
Do not use the EP2S90F780I4NAB for new designs without verifying Quartus II 9.1 SP2 software availability on your EDA flow - Quartus Prime 15.0 and later do not support Stratix II. The 1.2V core supply requires a POR-controlled ramp of 1 ms to 100 ms; exceeding the maximum VCC ramp rate can trigger in-rush current latch-up. The I4 speed grade corresponds to industrial -40C to +100C operation - do not substitute the C4/C5 commercial speed grades into industrial designs without thermal re-characterization.
The 12 embedded transceivers support PMA-only or PCS+PMA modes, with PMA-only recommended for lowest latency applications. Estimated: the maximum transceiver reach on FR4 backplane is approximately 30 inches at 3.125 Gbps, and approximately 8 inches at the device's maximum 6.375 Gbps rate (in pre-emphasis mode). Source-synchronous interfaces should use ALTDDIO with input delay chains for proper center-aligned capture; use TimeQuest SDC constraints to model board-level skew.
Compliance Information
RoHS compliance and lead-free per manufacturer datasheet. Halogen-free status not explicitly stated in available data. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade IC. NRND status as of 2026.
