Intel

EP2S90F780C5N - Stratix II FPGA, 90K LE, 780-FBGA | Intel

MPN: EP2S90F780C5N ✗ End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 780-ball FBGA, 29 x 29 mm, 1.0 mm pitch, lead-free Package 609.76 MHz Speed 4,520,488 Memory
From $198 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $268.5 $2,685.00
25 $252 $6,300.00
100 $225 $22,500.00
500 $198 $99,000.00
ℹ️ All prices are in USD

EP2S90F780C5N Overview

The Intel (formerly Altera) EP2S90F780C5N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) with 90,960 logic elements, 4,520,488 bits of embedded memory, and a 1.2 V core supply, housed in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm ball pitch. It is built on a 90 nm CMOS process and operates with an internal frequency up to 609.76 MHz, supporting high-performance digital logic, DSP, and memory-intensive applications.

What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit above general-purpose microcontrollers in the digital design hierarchy: they can implement arbitrary parallel logic, custom processor cores, hardware accelerators, and high-bandwidth data-path pipelines that an ASIC would otherwise handle, but with the advantage of in-system reprogrammability. The Stratix II family in particular pioneered the adaptive logic module (ALM) architecture, replacing the traditional 4-input LUT with an 8-input fracturable LUT for higher logic efficiency.

Key features of the EP2S90F780C5N include up to 534 user I/O pins, embedded multiplier blocks suitable for DSP, dedicated high-speed serial interfaces, and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device integrates PLLs for clock management and offers robust configuration options through JTAG, Passive Serial, Fast Passive Parallel, and Active Serial modes.

Architecturally, the Stratix II ALM can implement any 7-input LUT plus a small auxiliary function, dramatically reducing logic-area waste compared to older 4-LUT architectures. TriMatrix embedded memory blocks (M512, M4K, M-RAM) provide distributed RAM, ROM, FIFO, and shift-register functions, while DSP blocks deliver dedicated multiply-accumulate throughput. The 90 nm process, 1.2 V core, and 1.0 V/1.2 V selectable I/O standards balance performance and power.

Typical applications include telecommunications baseband processing, high-speed image and video processing, ASIC prototyping, military and aerospace signal processing, and industrial control systems. With 534 I/O and ~4.5 Mbit of block RAM, the EP2S90F780C5N handles large data-plane buffers and multiple parallel interfaces.

Design consideration: Stratix II devices are now in their mature lifecycle. Designers targeting new designs should verify availability and consider Cyclone IV/V or MAX 10 as modern, lower-cost alternatives where the EP2S90's logic density is not required.

This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, lifecycle guidance, and practical design notes not consolidated in the manufacturer datasheet alone.

Drop-in alternatives for EP2S90F780C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2S90F780C5N (same form factor and footprint) — differing in Package, RoHS Status, Speed Grade, Operating Temperature, Logic Elements.

Intel
Package: 780-FBGA (FC-FBGA), 29 mm x 29 mm
Operating Temperature: 0 C to +85 C (TJ)
Logic Elements: 132,540
Compare with EP2S90F780C5N →
Intel
Package: 780-FBGA (29 x 29 mm), 1.0 mm pitch
RoHS Status: Compliant (lead-free FBGA)
Operating Temperature: 0 °C to 85 °C (Commercial)
Compare with EP2S90F780C5N →
Intel
Package: 780-ball FBGA (FC-FBGA), 29 mm x 29 mm
RoHS Status: unknown
Speed Grade: C4
Compare with EP2S90F780C5N →
Intel
Package: 780-FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch
Operating Temperature: 0 °C to 85 °C (commercial)
Compare with EP2S90F780C5N →
Altera
RoHS Status: RoHS non-compliant (per alterachips listing)
Operating Temperature: 0 C to 85 C (Commercial)
Compare with EP2S90F780C5N →
Intel
Package: FBGA-780 (29 x 29 mm, 1.0 mm pitch)
RoHS Status: Lead-free (per datasheet)
Speed Grade: -4 (I4 suffix)
Compare with EP2S90F780C5N →
Altera
Package: 780-BBGA (FineLine BGA, 29 x 29 mm, 1 mm pitch)
Logic Elements: 90,960 LE
Compare with EP2S90F780C5N →
Intel
Package: 780-BGA (29x29 mm)
RoHS Status: Compliant
Speed Grade: I4 (industrial, -4)
Compare with EP2S90F780C5N →
Intel
Package: 780-BBGA, FCBGA
Speed Grade: C (commercial)
Operating Temperature: Commercial (0C to +85C) per -C suffix
Compare with EP2S90F780C5N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2S90F780C5

✅ Drop-In ⚠️ 参数待验证
Altera
📦 780-ball FBGA
Stratix II · Stratix II FPGA · 90,960 · 4,548 · 4,520,488 · 534 · 1.15 V to 1.25 V

✓ In Stock

$1100 / Unit

View Datasheet →

EP2S90F780C4N

✅ Drop-In
Intel
📦 780-ball FBGA
Stratix II · 90,960 · 4,548 · 4,520,488 · 534 · 90 nm CMOS · 1.15 V to 1.25 V

✓ In Stock

$365 / Unit

View Datasheet →

EP2S90F780C4

✅ Drop-In ⚠️ 参数待验证
Intel
📦 780-ball FBGA
Stratix II · Intel (formerly Altera) · 90,960 · 4,548 · 4,520,488 · 534 · 90 nm · 1.15 V to 1.25 V

✓ In Stock

$3050 / Unit

View Datasheet →

EP2S130F780C5N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 780-ball FBGA
Stratix II · 132,540 · 6,627 · 6,747,840 · 534 · 1.15 V to 1.25 V · 609.76 MHz · 0 °C to 85 °C (Commercial)

✓ In Stock

$2150 / Unit

View Datasheet →

EP2S130F780C5

✅ Drop-In ⚠️ 参数待验证
Intel
📦 780-ball FBGA
Stratix II · 132,540 · 6627 · 534 · 6,737,280 · 252 · 90 nm CMOS · 1.15 V to 1.25 V (typ. 1.2 V)

✓ In Stock

$2295 / Unit

View Datasheet →

EP2S90F780C5N Maximum Ratings & Electrical Characteristics

Family Stratix II
Logic Elements 90,960
Adaptive Logic Modules (ALMs) 45,960
Embedded Memory Bits 4,520,488
Embedded Multipliers (18x18) 384
Maximum User I/O 534
Process Technology 90 nm CMOS
Core Supply Voltage 1.2 V
Internal Frequency (max) 609.76 MHz
Operating Temperature Range 0C to 85C (TJ, commercial)
Speed Grade C5
Package 780-ball FBGA, 29 x 29 mm, 1.0 mm pitch, lead-free
Mounting Type Surface Mount
Configuration Method JTAG, Passive Serial, Fast Passive Parallel, Active Serial
RoHS Status Lead-free (per datasheets.com listing)

EP2S90F780C5N 780-ball fbga, 29 x 29 mm, 1.0 mm pitch, lead-free Pin Configuration Guide

Pin configuration for EP2S90F780C5N (780-ball fbga, 29 x 29 mm, 1.0 mm pitch, lead-free package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

780-ball fbga, 29 x 29 mm, 1.0 mm pitch, lead-free package pinout diagram for EP2S90F780C5N

No detailed pinout data available for EP2S90F780C5N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2S90F780C5N is suitable for 6 applications: Telecommunications Baseband Processing, ASIC Prototyping and Emulation, High-Speed Image and Video Processing, Military and Aerospace Signal Processing, Industrial Control and Test Instrumentation, Software-Defined Radio (SDR) Platforms.

🌐

Telecommunications Baseband Processing

The EP2S90F780C5N fits telecom baseband designs because of its 90,960 logic elements and 384 embedded 18x18 multipliers, which deliver the parallel multiply-accumulate throughput needed for channelization, FEC decoding, and baseband demodulation. The 4.52 Mbit of TriMatrix block RAM buffers symbol-rate data across multiple antenna streams while the 534 user I/O mates to external DDR/QDR memories and high-speed ADCs/DACs. Designers benefit from Quartus II's pre-verified DSP Builder IP cores for FFTs, Viterbi, and Turbo decoders that target Stratix II silicon.

🖥️

ASIC Prototyping and Emulation

With 90,960 logic elements and 4.52 Mbit of embedded memory, the EP2S90F780C5N acts as a multi-million-gate ASIC prototyping vehicle, partitioning large SoC designs across multiple FPGAs via TDM or HTILE-style logic-sharing interfaces. Its 780-ball FBGA exposes 534 user I/O, which supports enough off-chip bandwidth to maintain real-time verification of CPU cores, peripherals, and memory subsystems. Quartus II's TimeQuest timing analyzer and incremental compile flow let design teams iterate the prototype quickly, while the Stratix II ALM preserves high logic utilization compared to 4-LUT families.

🎥

High-Speed Image and Video Processing

The EP2S90F780C5N supports real-time HD video pipelines because its 534 user I/O and TriMatrix memory deliver the bandwidth needed for multi-channel Camera Link, LVDS, or HDMI ingest, while the 384 DSP blocks accelerate 2D convolution, Sobel edge detection, and motion-estimation kernels at full frame rate. Designers use parallel pixel pipelines across the ALM fabric, distributing frame buffers across M4K and M-RAM blocks to avoid off-chip memory bottlenecks. Quartus II's Video and Image Processing (VIP) suite provides ready-made IP for color space conversion, scaling, and deinterlacing that maps directly to the ALM and DSP resources.

✈️

Military and Aerospace Signal Processing

The EP2S90F780C5N's commercial 0-85C range can be extended via the EP2S90F780I5N industrial-grade counterpart for ruggedized signal-processing applications in radar, electronic warfare, and avionics where MIL-STD-810 environmental qualification is required. The 90K LE capacity and 384 DSP blocks enable pulse-compression, beamforming, and synthetic-aperture-radar (SAR) back-projection at real-time rates, while the lead-free FBGA withstands typical aerospace reflow profiles. Designers use the Stratix II hardened PCI Express and SERDES blocks to feed digitized antenna arrays back to mission processors.

🏭

Industrial Control and Test Instrumentation

The EP2S90F780C5N suits industrial test and measurement platforms because its parallel logic and high I/O count allow simultaneous control of multi-axis motor drivers, simultaneous sampling of ADC channels, and real-time computation of control loops in PLLs and DSP blocks. The 4.52 Mbit of embedded RAM holds real-time waveform captures and PID coefficients without external memory, while the 780-BGA provides sufficient I/O for parallel bus interfaces to legacy industrial peripherals. Quartus II's Nios II soft-core lets designers integrate a processor for supervisory control on the same fabric.

📡

Software-Defined Radio (SDR) Platforms

The EP2S90F780C5N is well-matched to wideband SDR front-ends because its 384 18x18 multipliers and TriMatrix block RAM implement multi-rate FIR filtering, digital down/up-conversion, and channelizer polyphase filterbanks in real time at sample rates up to hundreds of MSPS. The 534 user I/O accommodates parallel LVDS ADC/DAC interfaces, while the dedicated PLLs provide multiple synchronized sample clocks for MIMO architectures. Designers can pair the FPGA with RF tuners and use Quartus II DSP Builder to generate fixed- or floating-point datapaths that exploit the Stratix II DSP block architecture efficiently.

What is the EP2S90F780C5N and what family does it belong to?
The EP2S90F780C5N is a high-density FPGA from Intel's (formerly Altera's) Stratix II family, built on a 90 nm CMOS process and containing 90,960 logic elements. According to the Stratix II device handbook, it integrates 4,520,488 bits of embedded memory and up to 534 user I/O, making it suitable for DSP, telecom, and high-throughput parallel processing. The 'N' suffix denotes a lead-free, RoHS-compliant package finish.
What package does the EP2S90F780C5N use and what are its dimensions?
The EP2S90F780C5N is supplied in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with a 1.0 mm ball pitch, as recorded in the Stratix II device handbook. The 'F780' ordering code explicitly maps to the 780-pin FBGA variant. This large BGA requires multilayer PCB construction with microvia or via-in-pad technology for reliable assembly at 1 mm pitch.
What is the core voltage and operating temperature of the EP2S90F780C5N?
The EP2S90F780C5N operates from a 1.2 V core supply with selectable I/O standards (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), and its commercial-grade junction temperature range is 0C to 85C TJ. Industrial (-40C to 100C TJ) and military variants use different ordering codes such as the EP2S90F780I5N for industrial applications.
Where to buy the EP2S90F780C5N online and what is the current price?
As of 2026-09-09, EP2S90F780C5N stock is scarce because the part is flagged Obsolete in the GlobalSpec distributor database. Verified suppliers include Xecor, Microchip-Price, IC-Components, and semiconductor-electronics.com (per Octopart's listing of 23 distributors). Unit pricing in the open market ranges roughly $250-$320 at qty 1-10; XAIPART tier-1 reference pricing is $285 each.
What is the lead time for the EP2S90F780C5N?
Lead time for the EP2S90F780C5N is unpredictable because it is marked Obsolete; franchised Intel/Altera distributors no longer carry factory-fresh inventory. Brokers and independent distributors (Xecor, IC-Components) typically quote 4-12 weeks for new-old-stock (NOS) or refurbished units, with prices volatile. Designers should qualify a Stratix IV or Cyclone V drop-in alternative and avoid single-source reliance on this EOL part.
Is the EP2S90F780C5N in stock anywhere?
Stock availability is limited and intermittent as of 2026-09-09. Independent distributors and obsolete-component brokers (Xecor, IC-Components, Microchip-Price) periodically list small quantities, often as factory-new surplus. For volume production, treat the EP2S90F780C5N as effectively unavailable from franchised sources - always validate the supplier's chain-of-custody documentation to mitigate counterfeit risk.
EP2S90F780C5N vs EP2S90F780C4N - which should I choose?
Both parts share the same 780-ball FBGA package, 90,960 logic elements, and 4.52 Mbit memory, differing only in speed grade. The 'C5' speed grade is faster (higher Fmax) than 'C4', so EP2S90F780C5N is preferred when timing closure is critical; EP2S90F780C4N is acceptable when margin is comfortable and cost or availability favors it. Both are obsolete; choose C5 if available, then C4, then migrate to a Stratix IV equivalent.
EP2S90F780C5N vs EP2S130F780C5N - which is better for high-density designs?
The EP2S130F780C5N contains 132,540 logic elements versus the EP2S90F780C5N's 90,960, sharing the same 780-ball FBGA footprint and Stratix II family. For designs that fit within 90K LE, the EP2S90 is the lower-cost option. For designs needing 100K-130K LE or larger memory, the EP2S130F780C5N is the same-package upgrade path. Both share pinout compatibility, simplifying migration.
When should I choose the EP2S90F780C5N over a Cyclone IV or Cyclone V device?
Choose the EP2S90F780C5N only when you have legacy code targeting the Stratix II ALM architecture or when long-term production designs require exact second-source continuity of an obsolete part. For new designs, Intel's Cyclone V or MAX 10 offer lower cost, lower power, and active lifecycle support at the expense of logic density - the Cyclone V 5CGXFC7C7F23C8N tops out at 149K LE but in a smaller, cheaper package.
What is the best drop-in replacement for the obsolete EP2S90F780C5N?
Within the Stratix II family, the EP2S90F780C4N is the closest drop-in alternative: identical 780-ball FBGA package, identical 90,960 logic elements and 4.52 Mbit memory, but a slower C4 speed grade (par1 PARAM_MATCH 90). The EP2S130F780C5N offers the same footprint with higher logic density (132K LE) for design growth, while the EP2S90F780I5N is the industrial-temperature variant. For migration to active-lifecycle silicon, the Stratix IV EP4SGX230KF40C2N is functionally similar but uses a different package.
Can the EP2S90F780I5N replace the EP2S90F780C5N?
The EP2S90F780I5N can replace the EP2S90F780C5N on the same 780-ball FBGA footprint with identical 90,960 logic elements and 4.52 Mbit memory. The difference is operating temperature: 'C5' is commercial 0C-85C, 'I5' is industrial -40C-100C, with the same speed grade 5. The drop-in replacement is acceptable for designs needing industrial temperature headroom at the cost of slightly higher unit pricing.
Where to download the EP2S90F780C5N datasheet PDF?
The official Stratix II device handbook is hosted at intel.com as the authoritative datasheet for the EP2S90F780C5N. Third-party mirrors (datasheets.com, Octopart, GlobalSpec) also host the PDF. XAIPART links to the manufacturer-hosted PDF to ensure the latest revision; engineers should also reference AN 306 (Stratix II transceiver guidelines) and AN 341 (external memory interface) for application-level design.
Where can I find the EP2S90F780C5N pinout (ball map)?
The 780-ball FBGA pinout for the EP2S90F780C5N is published in the Stratix II Device Handbook, Chapter 9 'Package Information'. Intel provides per-package ball maps for every I/O bank and dedicated pin (PLL, JTAG, configuration, clock). Use Quartus II Pin Planner to load the .qsf pin assignment file directly - this is the recommended workflow because manual pin mapping of a 780-ball BGA is error-prone.
Hey Google, what can replace an obsolete EP2S90F780C5N?
The best drop-in replacement for the obsolete EP2S90F780C5N (780-ball FBGA, 90K LE) is the EP2S90F780C4N (same family, same footprint, slower C4 speed grade, param_match 90%, same Stratix II architecture). The EP2S130F780C5N offers higher density (132K LE) on the same 780-BGA. For active-lifecycle migration, use the Stratix IV EP4SGX230 family or Cyclone V 5CGXFC7, accepting a package change.
What are the key specifications of the EP2S90F780C5N that engineers should know?
The EP2S90F780C5N key specs are: 90,960 logic elements (45,960 ALMs), 4,520,488 embedded memory bits across TriMatrix blocks, up to 534 user I/O, 384 embedded 18x18 multipliers for DSP, 1.2 V core supply, 90 nm CMOS process, 609.76 MHz internal Fmax, 780-ball FBGA at 29 x 29 mm, commercial 0C-85C temperature, lead-free finish. Lifecycle: Obsolete per GlobalSpec distributor records (2026-09-09).

Engineering reference data for EP2S90F780C5N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2S90F780C5N when you have a legacy Stratix II design that requires exact bit-for-bit second-source continuity and you cannot accept the risk of migrating to a different FPGA family. For new designs, prefer the EP2S90F780C4N if timing closure is comfortable and you need a marginally more available part; choose the EP2S130F780C5N on the identical 780-BGA when your design grows past 90K LE, since it shares the same pinout and reflow profile. For active-lifecycle silicon, migrate to the Stratix IV EP4SGX230 family (different package) or Cyclone V 5CGXFC7 - these are not drop-in but offer factory support and lower cost. Always validate obsolete-part supply chain via franchised distributors before committing to production.

Comparison with Alternatives

Parameter This Product EP2S90F780C5 EP2S90F780C4N EP2S90F780C4 EP2S130F780C5N EP2S130F780C5
Brand Intel Intel Intel Intel Intel Intel
Package 780-ball FBGA, 29x29 mm, 1.0 mm pitch 780-ball FBGA - same 780-ball FBGA - same 780-ball FBGA - same 780-ball FBGA - same 780-ball FBGA - same
Family Stratix II Stratix II Stratix II Stratix II Stratix II Stratix II
Logic Elements 90,960 90,960 - same 90,960 - same 90,960 - same 132,540 (+46%) 132,540 (+46%)
Embedded Memory 4,520,488 bits 4,520,488 bits - same 4,520,488 bits - same 4,520,488 bits - same 6,747,840 bits (+49%) 6,747,840 bits (+49%)
Speed Grade C5 C5 - same C4 (slower ~10-15%) C4 (slower ~10-15%) C5 - same C5 - same
Embedded 18x18 Multipliers 384 384 - same 384 - same 384 - same 504 (+31%) 504 (+31%)
Operating Temperature 0C to 85C (commercial) 0C to 85C - same 0C to 85C - same 0C to 85C - same 0C to 85C - same 0C to 85C - same
Lead-Free (N suffix) Yes No (SnPb finish) Yes No (SnPb finish) Yes No (SnPb finish)

Key Differentiators

  • Higher-density drop-in on same 780-BGA footprint (vs EP2S90F780C4N)
  • Faster speed grade over C4 equivalent (vs EP2S90F780C4N)
  • Lead-free finish for RoHS/automotive compliance (vs EP2S90F780C5 (no 'N' suffix))

Design Notes

The 780-ball FBGA at 1.0 mm pitch has a relatively high junction-to-ambient thermal resistance; for sustained high-utilization designs (above ~70% logic utilization at 200+ MHz), design 4+ thermal vias under the central BGA ball grid and at least 8 thermal vias directly beneath the die flag. Stratix II power can exceed 10 W under full DSP load - consider forced airflow or a heatsink attached with thermal interface material. Junction temperature must remain below 85C for the commercial-grade EP2S90F780C5N; use the EP2S90F780I5N for industrial deployments.

A 1.0 mm pitch FBGA requires a multilayer PCB stack-up with HDI microvias or via-in-pad construction for reliable assembly. Recommended stack-up: 8+ layers with 0.5 oz copper outer / 1 oz copper inner, FR-4 high-Tg (Tg >=170C) dielectric, and ENIG surface finish. Use a 4-6 mil BGA pad diameter with solder mask-defined (SMD) pads to reduce bridging risk. Reference Intel AN 224 'Stratix II Board Design Guidelines' for detailed escape routing recommendations.

Stratix II PLLs require clean, isolated power (VCCA_PLL) with a pi-filter (ferrite bead + decoupling caps) and a dedicated ground island connected to the main ground plane at a single point. Place differential clock inputs (CLK[0..15]) within the dedicated clock input region with matched-length, 50 ohm impedance-controlled traces; keep these traces far from switching I/O to avoid coupling. Dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE) must be pulled to their idle states per the configuration scheme chosen in Quartus II Device & Pin Options.

Estimated: this part is marked Obsolete as of 2026-09-09 per the GlobalSpec distributor database - do not commit new high-volume production designs to it. Verify all Stratix II configurations, JTAG IDs, and pinout files in Quartus II v13.1 (the last officially supported IDE for Stratix II); do not use newer Quartus versions, which drop legacy device support. When migrating to Stratix IV or Cyclone V, be aware that ALM-to-LAB mapping and DSP block architectures differ - recompile all IP cores and re-validate timing closure.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance per datasheets.com listing (lead-free 'N' suffix). REACH, halogen-free, and conflict-minerals status not stated in the verified web data; AEC-Q100 not applicable for FPGAs.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

EP2S90F780C5N EP2S90F780C5N datasheet Intel Stratix II EP2S90 FPGA Altera EP2S90F780C5N obsolete 780-ball FBGA Stratix II FPGA EP2S90F780C5N ASIC prototyping EP2S90F780C5N vs EP2S130F780C5N EP2S90F780C5N drop-in replacement EP2S90F780C5N buy price Stratix II 90,960 logic elements EP2S90F780C5N pinout FBGA-780 FPGA telecom baseband processing

Related Components & Terms

Intel Altera EP2S90F780C5N EP2S90F780C5 EP2S90F780C4N EP2S90F780C4 EP2S130F780C5N EP2S130F780C5 Stratix II Field-Programmable Gate Array FPGA logic element Adaptive Logic Module ALM TriMatrix memory embedded 18x18 multiplier DSP block 780-ball FBGA FineLine BGA 1.0 mm pitch 90 nm CMOS 1.2 V core RoHS lead-free AEC-Q100 JTAG PCI Express DDR2 RLDRAM Quartus II
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