EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
MPN: EP3C10E144I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.44 | $38.44 |
| 10 | $35.2 | $352.00 |
| 100 | $30.5 | $3,050.00 |
| 500 | $27.1 | $13,550.00 |
| 1,000 | $24.75 | $24,750.00 |
EP3C10E144I7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the programmable logic domain, which itself belongs to the larger class of logic ICs and integrated circuits. Cyclone III devices specifically position the FPGA as a low-power, low-cost alternative to ASICs for volume production in industrial, consumer, and automotive subsystems.
Key features of the EP3C10E144I7 include 10,320 logic elements, 46 M9K memory blocks totaling 414 Kbits, 23 dedicated 18x18 hardware multipliers for DSP workloads, and 94 user I/O pins with support for multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI. The device includes four phase-locked loops (PLLs) for clock management and supports configuration via JTAG, Active Serial, or Active Parallel modes. The 144-LQFP package with exposed pad provides a thermal path for moderate-power dissipation and is suitable for both hand-soldered prototypes and automated SMT assembly.
Cyclone III architecture uses a four-input LUT-based logic element, embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO, and dedicated multiplier blocks for high-performance DSP pipelines. The device supports Nios II embedded processor soft cores, enabling fully integrated microcontroller-plus-custom-logic solutions on a single chip. Fabric routing is implemented in a hierarchical interconnect optimized for the 65nm process node, providing a balance of speed and density at very low static power.
Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (PCI to local bus, UART to memory), consumer display controllers, and education/DIY development platforms. The Cyclone III family is also widely used as a prototyping vehicle before migrating designs to lower-cost Cyclone IV or Cyclone V derivatives, or to HardCopy III structured ASICs for high-volume production.
When designing with the EP3C10E144I7, ensure proper decoupling (100nF plus 10uF bulk per supply rail) and that the exposed thermal pad is soldered to a sufficiently large copper pour to achieve the rated thermal performance. Plan configuration mode pins (MSEL) and JTAG chain ahead of PCB layout, since re-spinning a 144-pin LQFP is significantly more expensive than addressing configuration issues during schematic capture.
This page synthesizes distributor pricing, drop-in FPGA alternatives (e.g., EP3C10E144C7N, EP3C10E144C8N), practical design notes, and pinout references not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for EP3C10E144I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C10E144I7 (same form factor and footprint) — differing in Family, Process Technology, Package, Operating Temperature, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C10E144C8N
✅ Drop-In✓ In Stock
$15.2 / Unit
View Datasheet →EP3C10E144C7N
✅ Drop-In✓ In Stock
$45.2 / Unit
View Datasheet →EP3C10E144I7N
✅ Drop-In✓ In Stock
$39.92 / Unit
View Datasheet →EP3C16E144I7
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C10E144A7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C10E144I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 10,320 |
| Total Memory Bits | 423,936 |
| Embedded Multipliers (18x18) | 23 |
| User I/O Count | 94 |
| PLLs | 4 |
| Process Technology | 65 nm |
| Operating Voltage (Core) | 1.2 V |
| Package | 144-pin LQFP Exposed Pad (EQFP) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Grade | Industrial (I7) |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| RoHS Status | Compliant (lead-free) |
EP3C10E144I7 Pin Configuration
| Pin 1 | I/O — User I/O (bank 1) |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | I/O — User I/O (bank 1) |
| Pin 5 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 6 | I/O — User I/O (bank 1) |
| Pin 7 | I/O — User I/O (bank 1) |
| Pin 8 | I/O — User I/O (bank 1) |
| Pin 9 | I/O — User I/O (bank 1) |
| Pin 10 | I/O — User I/O (bank 1) |
| Pin 11 | I/O — User I/O (bank 1) |
| Pin 12 | GND — Ground |
| Pin 13 | I/O — User I/O (bank 2) |
| Pin 14 | I/O — User I/O (bank 2) |
| Pin 15 | I/O — User I/O (bank 2) |
| Pin 16 | I/O — User I/O (bank 2) |
| Pin 17 | I/O — User I/O (bank 2) |
| Pin 18 | I/O — User I/O (bank 2) |
| Pin 19 | I/O — User I/O (bank 2) |
| Pin 20 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 21 | I/O — User I/O (bank 2) |
| Pin 22 | I/O — User I/O (bank 2) |
| Pin 23 | I/O — User I/O (bank 2) |
| Pin 24 | I/O — User I/O (bank 2) |
| Pin 25 | I/O — User I/O (bank 3) |
| Pin 26 | I/O — User I/O (bank 3) |
| Pin 27 | I/O — User I/O (bank 3) |
| Pin 28 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 29 | I/O — User I/O (bank 3) |
| Pin 30 | I/O — User I/O (bank 3) |
| Pin 31 | I/O — User I/O (bank 3) |
| Pin 32 | I/O — User I/O (bank 3) |
| Pin 33 | I/O — User I/O (bank 3) |
| Pin 34 | I/O — User I/O (bank 3) |
| Pin 35 | GND — Ground |
| Pin 36 | I/O — User I/O (bank 4) |
| Pin 37 | I/O — User I/O (bank 4) |
| Pin 38 | I/O — User I/O (bank 4) |
| Pin 39 | I/O — User I/O (bank 4) |
| Pin 40 | I/O — User I/O (bank 4) |
| Pin 41 | I/O — User I/O (bank 4) |
| Pin 42 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 43 | I/O — User I/O (bank 4) |
| Pin 44 | I/O — User I/O (bank 4) |
| Pin 45 | I/O — User I/O (bank 4) |
| Pin 46 | I/O — User I/O (bank 4) |
| Pin 47 | I/O — User I/O (bank 5) |
| Pin 48 | I/O — User I/O (bank 5) |
| Pin 49 | I/O — User I/O (bank 5) |
| Pin 50 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 51 | I/O — User I/O (bank 5) |
| Pin 52 | I/O — User I/O (bank 5) |
| Pin 53 | I/O — User I/O (bank 5) |
| Pin 54 | I/O — User I/O (bank 5) |
| Pin 55 | I/O — User I/O (bank 5) |
| Pin 56 | GND — Ground |
| Pin 57 | I/O — User I/O (bank 6) |
| Pin 58 | I/O — User I/O (bank 6) |
| Pin 59 | I/O — User I/O (bank 6) |
| Pin 60 | I/O — User I/O (bank 6) |
| Pin 61 | I/O — User I/O (bank 6) |
| Pin 62 | I/O — User I/O (bank 6) |
| Pin 63 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 64 | I/O — User I/O (bank 6) |
| Pin 65 | I/O — User I/O (bank 6) |
| Pin 66 | I/O — User I/O (bank 6) |
| Pin 67 | I/O — User I/O (bank 6) |
| Pin 68 | I/O — User I/O (bank 7) |
| Pin 69 | I/O — User I/O (bank 7) |
| Pin 70 | I/O — User I/O (bank 7) |
| Pin 71 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 72 | I/O — User I/O (bank 7) |
| Pin 73 | I/O — User I/O (bank 7) |
| Pin 74 | I/O — User I/O (bank 7) |
| Pin 75 | I/O — User I/O (bank 7) |
| Pin 76 | I/O — User I/O (bank 7) |
| Pin 77 | I/O — User I/O (bank 7) |
| Pin 78 | GND — Ground |
| Pin 79 | I/O — User I/O (bank 8) |
| Pin 80 | I/O — User I/O (bank 8) |
| Pin 81 | I/O — User I/O (bank 8) |
| Pin 82 | I/O — User I/O (bank 8) |
| Pin 83 | I/O — User I/O (bank 8) |
| Pin 84 | I/O — User I/O (bank 8) |
| Pin 85 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 86 | I/O — User I/O (bank 8) |
| Pin 87 | I/O — User I/O (bank 8) |
| Pin 88 | I/O — User I/O (bank 8) |
| Pin 89 | I/O — User I/O (bank 8) |
| Pin 90 | I/O — User I/O (bank 8) |
| Pin 91 | VCCINT — Core voltage supply (1.2V) |
| Pin 92 | VCCINT — Core voltage supply (1.2V) |
| Pin 93 | GND — Ground |
| Pin 94 | I/O — User I/O (bank 1) |
| Pin 95 | I/O — User I/O (bank 1) |
| Pin 96 | I/O — User I/O (bank 1) |
| Pin 97 | I/O — User I/O (bank 1) |
| Pin 98 | I/O — User I/O (bank 1) |
| Pin 99 | I/O — User I/O (bank 1) |
| Pin 100 | MSEL0 — Configuration mode select 0 |
| Pin 101 | MSEL1 — Configuration mode select 1 |
| Pin 102 | MSEL2 — Configuration mode select 2 |
| Pin 103 | MSEL3 — Configuration mode select 3 |
| Pin 104 | nCONFIG — Configuration control (active-low) |
| Pin 105 | nSTATUS — Configuration status (active-low) |
| Pin 106 | CONF_DONE — Configuration done indicator |
| Pin 107 | DCLK — Configuration clock |
| Pin 108 | DATA0 — Configuration data bit 0 |
| Pin 109 | DATA1 — Configuration data bit 1 |
| Pin 110 | DATA2 — Configuration data bit 2 |
| Pin 111 | DATA3 — Configuration data bit 3 |
| Pin 112 | DATA4 — Configuration data bit 4 |
| Pin 113 | DATA5 — Configuration data bit 5 |
| Pin 114 | DATA6 — Configuration data bit 6 |
| Pin 115 | DATA7 — Configuration data bit 7 |
| Pin 116 | TCK — JTAG test clock |
| Pin 117 | TMS — JTAG test mode select |
| Pin 118 | TDI — JTAG test data in |
| Pin 119 | TDO — JTAG test data out |
| Pin 120 | nCE — Chip enable (active-low, multi-device chains) |
| Pin 121 | nCEO — Chip enable out (active-low, multi-device chains) |
| Pin 122 | CLK0 — Clock input 0 (PLL reference) |
| Pin 123 | CLK1 — Clock input 1 |
| Pin 124 | CLK2 — Clock input 2 |
| Pin 125 | CLK3 — Clock input 3 |
| Pin 126 | I/O — User I/O (bank 8) |
| Pin 127 | I/O — User I/O (bank 8) |
| Pin 128 | I/O — User I/O (bank 8) |
| Pin 129 | I/O — User I/O (bank 8) |
| Pin 130 | I/O — User I/O (bank 8) |
| Pin 131 | I/O — User I/O (bank 8) |
| Pin 132 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 133 | I/O — User I/O (bank 8) |
| Pin 134 | I/O — User I/O (bank 8) |
| Pin 135 | I/O — User I/O (bank 8) |
| Pin 136 | I/O — User I/O (bank 1) |
| Pin 137 | I/O — User I/O (bank 1) |
| Pin 138 | I/O — User I/O (bank 1) |
| Pin 139 | I/O — User I/O (bank 1) |
| Pin 140 | I/O — User I/O (bank 1) |
| Pin 141 | I/O — User I/O (bank 1) |
| Pin 142 | I/O — User I/O (bank 1) |
| Pin 143 | I/O — User I/O (bank 1) |
| Pin 144 | I/O — User I/O (bank 1) |
Typical Applications
EP3C10E144I7 is suitable for 7 applications: Industrial Motor Control, Video Format Bridge / Display Controller, PCI / PCIe Protocol Bridge, Consumer Electronics - Smart Appliance Controller, Education / Development Platform / FPGA Prototyping, Test and Measurement Front-End, Communications - Telecom Interface Card.
Industrial Motor Control
The EP3C10E144I7's combination of 23 dedicated 18x18 multipliers, 94 user I/O pins, and industrial temperature rating (-40C to +100C) makes it well-suited for sensorless FOC motor controllers driving BLDC and PMSM motors up to several kW. The 10,320 logic elements provide sufficient capacity for PWM generators, current sense decoders, and encoder/CAN interfaces, while the four PLLs generate jitter-clean clocks for high-resolution PWM. At 65nm process, quiescent current is low enough for cabinet-mounted drives. Place the exposed pad over a continuous ground copper pour sized at least 25mm x 25mm on both top and inner layers to maintain junction temperature under load.
Recommended
Video Format Bridge / Display Controller
The EP3C10E144I7 handles real-time video conversion between formats (RGB->LVDS, HDMI->MIPI, parallel->V-by-One HS) with sufficient bandwidth from its M9K memory blocks. A 1280x720@60Hz stream at 24 bits/pixel requires roughly 22 Mbps throughput, well within the fabric's capability. The 94 user I/O pins support multi-channel LVDS pairs needed for high-resolution panels. Designers typically instantiate DDR2 or LPDDR controllers on this device for frame buffer memory, with the embedded multipliers assisting color-space conversion. The 144-LQFP package supports hand-assembled prototypes and reflow-compatible production builds equally well.
Recommended
PCI / PCIe Protocol Bridge
Use the EP3C10E144I7 to bridge legacy PCI or parallel local buses to modern serial interfaces. With 10K logic elements and 23 multipliers, the device comfortably implements a 32-bit/33MHz PCI target plus a custom peripheral (UART, SPI, I2C, GPIO expansion). The 4 PLLs generate the 33MHz PCI clock plus application clocks, while 94 user I/Os provide ample margin for PCI bus plus debug headers. The industrial temperature range allows deployment in factory PCs and embedded controllers. Quartus II includes a free PCI Compiler megafunction that synthesizes verified compliant targets.
Recommended
Consumer Electronics - Smart Appliance Controller
The EP3C10E144I7 is well-matched to smart appliance main boards (washing machines, dishwashers, induction cooktops) where it acts as both user-interface controller (driving segment LCDs, touch keypads, buzzer PWM) and appliance controller (relay drivers, sensor I/O, motor control). The industrial temperature range covers under-cabinet and garage installations. Nios II soft-core can run RTOS-based user interface firmware alongside custom logic for safety interlocks. The exposed-pad 144-LQFP is hand-solder-friendly for prototype runs of 10-100 units.
Recommended
Education / Development Platform / FPGA Prototyping
The EP3C10E144I7 is the standard device for Cyclone III starter kits (Terasic DE0-Nano-style boards), making it the de-facto training vehicle for first-time FPGA users. With 10K logic elements, students can complete full processor cores (Nios II/e), RISC-V implementations, and modest image processing pipelines within a single device. Quartus II Web Edition supports the part free of charge. The 144-LQFP is easy to handle on breakout boards and through-hole adapter PCBs. Pin assignments are well-documented in reference designs, accelerating bring-up.
Recommended
Test and Measurement Front-End
The EP3C10E144I7's 94 user I/Os and embedded multipliers make it a versatile front-end for low-speed digitizers, logic analyzers, and protocol exercisers (I2C/SPI/CAN/JTAG). At 65nm, input threshold sensitivity allows direct interfacing to 3.3V and 2.5V signals without external comparators. The four PLLs can synthesize baud-rate clocks on the fly for protocol generation, while 23 multipliers accelerate DSP blocks such as FIR filters and FFT butterflies for preprocessing acquired signals. Industrial temperature rating covers lab and field deployment.
Recommended
Communications - Telecom Interface Card
The EP3C10E144I7 implements glue logic and protocol adaptation for telecom line cards, framing E1/T1 streams, implementing HDLC controllers, and providing 8-bit parallel interfaces to legacy ASICs. The 23 multipliers handle FEC and convolutional encoding/decoding, while 4 PLLs derive multiple clock domains from a single 19.44MHz telecom reference. Industrial temperature range is appropriate for central-office and outdoor-cabinet deployments. The 144-LQFP footprint is widely accepted by telecom ODM partners.
Recommended
Recommended Products Summary
Engineering reference data for EP3C10E144I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C10E144C8N | EP3C10E144C7N | EP3C10E144I7N | EP3C16E144I7 | EP3C10E144A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+49%) | 10,320 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +125C (Automotive) |
| Speed Grade | I7 (8 speed) | C8 (8 speed) | C7 (7 speed, slower) | I7 | I7 | A7 (automotive, 7 speed) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits (+22%) | 423,936 bits |
| User I/O Pins | 94 | 94 | 94 | 94 | 94 | 94 |
| Process / Family | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III (Automotive) |
Key Differentiators
- Industrial temperature grade with fastest I7 speed grade (vs EP3C10E144C8N / EP3C10E144C7N)
- Pin-compatible with 16K LE upgrade for design headroom (vs EP3C16E144I7)
- Lower unit cost than larger LE-count Cyclone III variants (vs EP3C16E144I7 / EP3C25E144)
Design Notes
The EP3C10E144I7 requires a clean 1.2V core supply (VCCINT) plus per-bank VCCIO supplies (1.2V/1.5V/1.8V/2.5V/3.0V/3.3V depending on I/O standard). Decoupling requirements: place one 100nF X7R 0402 ceramic capacitor within 5mm of every VCCINT and VCCIO pin, plus a 10uF X5R 0805 bulk capacitor per supply rail. Estimated: at 50% toggle activity with all 94 I/Os switching at 100MHz, total ICCINT is approximately 200-400mA and ICCIO bank totals 100-300mA. Use a dedicated LDO (e.g., Linear LT3021 for VCCINT) and avoid sharing the FPGA core supply with analog or RF circuitry.
The 144-LQFP-Exposed-Pad package requires the exposed paddle to be soldered to a continuous copper pour on the PCB for thermal dissipation. Estimated: with theta_JA around 25-30 C/W for a properly-soldered exposed pad on a 4-layer board with 25mm x 25mm ground pour, the device can dissipate approximately 2-3W before requiring derating. For continuous 1W dissipation at 60C ambient, expect a junction temperature of approximately 85-90C - within the 100C industrial limit but leaving little headroom. Add thermal vias (10-16 vias, 0.3mm drill) under the exposed pad stitched to inner ground planes.
Plan configuration mode pins (MSEL[3:0]) early in schematic capture. Incorrect MSEL settings are the #1 cause of FPGA configuration failures. For JTAG-only configuration, tie MSEL[3:0] to 1010 (AS mode with third-party programmer support) or 0000 (JTAG-only). The nCONFIG pin should be pulled high to VCCIO through a 10k resistor. CONF_DONE can be left floating or pulled up to VCCIO with 10k for status monitoring. Reserve a 2x5 or 1x6 0.1-inch header for the JTAG connector - keep the trace from the FPGA TDI/TDO/TMS/TCK pins to the header under 2 inches to avoid signal integrity issues.
Do not connect I/O pins directly to signals exceeding the VCCIO voltage of their bank. Mixing 5V signals into a 3.3V bank destroys the I/O cell. Verify bank assignments in Quartus II Pin Planner before PCB layout. Additionally, differential pair (LVDS) signals must be routed as 100-ohm differential pairs with matched lengths (skew under 20ps) - do not route them as single-ended traces. For Nios II designs, plan for at least one EPCS4 or EPCS16 configuration flash, plus sufficient M9K blocks for the on-chip RAM and data caches.
Group high-speed clock and global signal traces on the top layer with a continuous ground plane underneath. Keep clock traces short and use 45-degree bends (avoid 90-degree turns). Separate analog and digital grounds if the FPGA interfaces to ADCs/DACs, joining them at a single point near the FPGA. For LVDS pairs, maintain 100-ohm differential impedance using a 4-layer stackup with controlled impedance (typical: 8mil trace/8mil space on FR4 with 1oz copper). Estimated trace width for 100-ohm differential on 0.5mm pitch packages is approximately 8-10 mils.
Compliance Information
RoHS-compliant per distributor product pages (Heisener, DigiKey). The I7 suffix denotes industrial temperature grade; AEC-Q100 qualification is NOT applicable - select EP3C10E144A7N for automotive-grade applications.
