EP3SE50F780I4LG - Stratix III E FPGA 47.5K LE | Intel (Altera)
MPN: EP3SE50F780I4LG ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2725 | $27,250.00 |
| 100 | $2580 | $258,000.00 |
| 250 | $2475 | $618,750.00 |
| 500 | $2380 | $1,190,000.00 |
EP3SE50F780I4LG Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement custom digital circuits using configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as DSP blocks and memory. FPGAs occupy the mid-tier of digital logic hierarchy: below fixed-function ASICs in volume cost but above discrete logic ICs in integration density. The Stratix III generation introduced the ALM (Adaptive Logic Module) architecture, which combines 8-input fracturable lookup tables and dedicated adders to deliver higher effective logic capacity per LE than the ALM predecessors.
Key features of the EP3SE50F780I4LG include 47,500 logic elements, 19,000 ALMs, 5.49 Mbit embedded RAM, 488 maximum user I/Os, and high-speed transceivers supporting multi-gigabit serial interfaces. The device integrates dedicated DSP blocks for high-performance fixed- and floating-point arithmetic, hard PCI Express Gen1/Gen2 IP cores, and external memory interfaces supporting DDR3 with dedicated DQS phase-shift circuitry. These features collectively enable single-chip implementation of complex DSP pipelines, high-throughput memory controllers, and protocol bridging functions.
The EP3SE50F780I4LG is fabricated on a 65 nm TSMC process and combines a programmable fabric with embedded hard IP blocks. The 780-FCBGA flip-chip BGA package provides 488 signal balls allocated between user I/O banks, high-speed transceiver channels, configuration pins, clock inputs, and power/ground. The 1.1 V core supply with separate VCCPD (I/O pre-driver) and VCCIO (I/O driver) rails allows the FPGA to interface with multiple logic standards simultaneously. Compared with Stratix IV (40 nm) and Stratix V (28 nm) successors, the Stratix III E remains a cost-effective mid-density solution with mature Quartus II tool support.
Typical applications include high-performance digital signal processing in wireless base stations, software-defined radio (SDR) front-ends, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, Gigabit Ethernet), radar and beam-forming arrays, broadcast video processing, and ASIC prototyping. The high DSP block count and transceiver bandwidth make this device well suited to designs where parallel DSP pipelines must be combined with chip-to-chip serial links. The 5.49 Mbit embedded RAM also serves as on-chip buffering for packet processing in networking line cards.
When designing with this device, ensure that PCB layout meets the FCBGA via-in-pad and microvia stack-up requirements specified in the Altera Stratix III Device Handbook. The flip-chip BGA requires precise BGA escape routing and matched-length traces for high-speed transceiver channels; failing to honor the reference stack-up will degrade SERDES eye margins. Thermal management is mandatory because the FCBGA junction-to-ambient thermal resistance is limited, and high transceiver utilization can push junction temperature close to the +100 C industrial limit.
This page consolidates distributor inventory, lifecycle status, drop-in alternative analysis, and PCB design guidance for engineers evaluating or sourcing the EP3SE50F780I4LG.
Drop-in alternatives for EP3SE50F780I4LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F780I4LG (same form factor and footprint) — differing in Package, Family, Logic Elements, Process Technology, DSP Blocks.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F780I4L
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE110F780I4LN
✅ Drop-In✓ In Stock
$1920 / Unit
View Datasheet →EP3SE260H780I4LG
✅ Drop-In✓ In Stock
$2580 / Unit
View Datasheet →EP3CLS70F780I7N
✅ Drop-In✓ In Stock
$880 / Unit
View Datasheet →EP3SE50F780I4L
✅ Drop-In✓ In Stock
$1198.5 / Unit
View Datasheet →EP3SE50F780I4
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →EP3SE50F780I4LG Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Family | Stratix III |
| Logic Elements | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 |
| Embedded Memory | 5.49 Mbit |
| Maximum User I/Os | 488 |
| Package | 780-ball FCBGA (FBGA-780) |
| Operating Supply Voltage (Core) | 1.1 V |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40 C to +100 C |
| Process Node | 65 nm |
| DSP Blocks | Yes (dedicated, count not in source data) |
| High-Speed Transceivers | Multi-gigabit, count not in source data |
| Lead-Free / RoHS | Yes (G suffix = Pb-free) |
| Packaging | Tray |
| Memory Type | Embedded SRAM block RAM |
EP3SE50F780I4LG 780-ball fcbga (fbga-780) Pin Configuration Guide
Pin configuration for EP3SE50F780I4LG (780-ball fcbga (fbga-780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F780I4LG.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F780I4LG is suitable for 7 applications: Wireless Base Station DSP, Software-Defined Radio (SDR) Front-End, High-Speed Protocol Bridging, ASIC Prototyping and Emulation, Radar and Beam-Forming Arrays, Broadcast Video Processing, Industrial Motor Control.
Wireless Base Station DSP
The EP3SE50F780I4LG's 47,500 logic elements, 19,000 ALMs, and dedicated DSP blocks make it well suited for wireless base-station baseband processing such as LTE PHY-layer channel estimation, FFT/iFFT, and crest-factor reduction. Its 5.49 Mbit embedded block RAM serves as on-chip buffering for symbol-rate data between FFT cores and channel decoders, reducing the need for external SRAM. The integrated high-speed transceivers enable CPRI or OBSAI fronthaul links to remote radio heads at multi-gigabit line rates without external PHY chips.
Recommended
Software-Defined Radio (SDR) Front-End
The Stratix III E device's parallel DSP fabric combined with multi-gigabit transceivers enables wideband SDR front-end implementations on the EP3SE50F780I4LG. Engineers can instantiate digital down-converters, channelizers, and polyphase filter banks directly in the FPGA fabric, with the on-chip transceivers handling ADC-to-FPGA JESD204B links or Ethernet-based signal distribution. Compared with a discrete DSP/ASIC architecture, the FPGA approach allows field-updatable modulation schemes and waveform libraries without hardware respins.
Recommended
High-Speed Protocol Bridging
The EP3SE50F780I4LG integrates hard PCI Express Gen1/Gen2 IP cores, multi-gigabit transceivers, and DDR3 controllers, making it a natural choice for protocol-bridging cards that convert between PCIe, Serial RapidIO, Gigabit Ethernet, and custom backplane fabrics. The 488 user I/Os available on the 780-FCBGA package provide ample margin for multiple lanes plus parallel side-band signaling. Bridging applications benefit from the FPGA's ability to perform real-time protocol translation, header parsing, and traffic shaping without CPU intervention.
Recommended
ASIC Prototyping and Emulation
Designers use the EP3SE50F780I4LG as a building block in multi-FPGA ASIC prototyping platforms because the 47.5K LE fabric, 5.49 Mbit embedded RAM, and high-speed transceivers allow large SoC sub-blocks to be partitioned onto a single device. The 780-FBGA package exposes the maximum number of FPGA-to-FPGA interconnect pins needed for time-domain-multiplexed emulation. Quartus II synthesis and place-and-route maturity ensures predictable compile times, and Stratix III device models are well-supported by Synopsys VCS and Cadence Palladium co-emulation flows.
Recommended
Radar and Beam-Forming Arrays
The EP3SE50F780I4LG suits phased-array radar and beam-forming signal processing because the dedicated DSP blocks perform complex-MAC operations efficiently, while the multi-gigabit transceivers stream digitized antenna data between array elements and the central processor. The 5.49 Mbit of on-chip memory provides temporary sample storage for pulse-compression filters and adaptive beam-weight computation. Industrial -40 C to +100 C temperature range supports outdoor radar installations and naval/airborne platforms where commercial-temperature parts would be unsuitable.
Recommended
Broadcast Video Processing
The 47,500 LE / 19,000 ALM capacity of the EP3SE50F780I4LG comfortably fits broadcast video processing functions such as 3G-SDI / HD-SDI multiplexing, color-space conversion, frame-rate conversion, and real-time overlay generation. The high-speed transceivers can ingest and emit multi-rate SDI streams up to 3 Gbps, while the abundant general-purpose I/Os interface to external HDMI, DisplayPort, or composite video encoders. On-chip block RAM serves as line buffers for deinterlacing and scaling algorithms.
Recommended
Industrial Motor Control
The EP3SE50F780I4LG's industrial temperature grade (-40 C to +100 C), 488 user I/Os, and DSP blocks make it suitable for multi-axis industrial motor controllers and servo drives. The FPGA fabric can implement multi-axis field-oriented control (FOC), space-vector PWM, and encoder-interface logic in parallel. High-speed transceivers enable EtherCAT, PROFINET, or SERCOS III industrial Ethernet links to the motion controller without an external PHY. The wide operating temperature range supports deployment in factory automation cabinets and outdoor motor enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F780I4LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F780I4L | EP3SE110F780I4LN | EP3SE260H780I4LG | EP3CLS70F780I7N | EP3SE50F780I4L | EP3SE50F780I4 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (FCBGA-780) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Cyclone III LS | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | 106,500 | 106,500 | 254,400 | 70,080 | 47,500 | 47,500 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.2 V | 1.1 V | 1.1 V |
| Operating Temperature | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | -40 C to +85 C | -40 C to +100 C | -40 C to +100 C |
| Lead-Free / RoHS | Yes (LG suffix, Pb-free green) | Yes (L suffix) | Yes (LN suffix) | Yes (LG suffix) | Yes (N suffix) | Yes (L suffix, Pb-free non-green) | No (SnPb ball finish) |
Key Differentiators
- Mid-density Stratix III E with industrial temperature grade (vs EP3CLS70F780I7N)
- Drop-in upgrade path to higher-density Stratix III E dies in same package (vs EP3SE110F780I4L)
- RoHS-compliant LG variant (vs EP3SE50F780I4)
- Pin-compatible with EP3SE110/SE260 family (vs EP3SE260H780I4LG)
Design Notes
The 780-FCBGA package requires via-in-pad (VIP) PCB construction with microvias and at least 4-6 PCB layers to escape the 1.0 mm pitch ball grid. The Stratix III Device Handbook recommends a 1-6-1 or 2-4-2 stack-up with a dedicated ground plane beneath the FPGA and matched 50 ohm single-ended or 100 ohm differential trace impedance for high-speed transceiver channels. Failing to use VIP or microvias will force escape traces between BGA balls, which is not physically possible at 1.0 mm pitch.
Stratix III E devices require multiple rails: 1.1 V VCC (core), 1.1 V or 1.2 V VCCPD (I/O pre-driver), per-bank VCCIO (1.2 V to 3.3 V), VCCA (PLL analog), and dedicated transceiver PLLs. Decoupling must follow the Stratix III PowerPlay Early Power Estimator (EPE) output: typically a few dozen 0.1 uF X7R MLCCs placed adjacent to each ball group, plus bulk tantalum or polymer capacitors at the voltage regulator outputs. Power sequencing must be observed per the device handbook to avoid latch-up.
The 780-FCBGA package has a theta_JA of approximately 8-12 C/W with a properly designed thermal via array underneath the exposed die region. Industrial deployments should keep junction temperature below 100 C; high transceiver utilization combined with high toggle rates can easily push dissipation beyond 10 W. Design the PCB with a thermal via farm under the package (typically 100-200 thermal vias), and consider attaching a heatsink with thermal interface material if the application runs near full capacity.
Common mistakes when designing with the EP3SE50F780I4LG: (1) omitting the configuration mode resistor network (MSEL pins) which prevents the FPGA from booting; (2) failing to connect nCONFIG, nSTATUS, and CONF_DONE to a pull-up and status LED; (3) using incorrect JTAG chain ordering when the FPGA shares the JTAG bus with other devices; (4) leaving unused transceiver channels floating instead of tying them to VCCR/VCCT per handbook guidance; (5) ignoring the nCEO/nCE chain when using multiple FPGAs on the same board.
Compliance Information
RoHS compliant per Altera/Intel product family page (LG suffix = Pb-free green compound). AEC-Q100 not applicable - FPGAs are not automotive-qualified unless explicitly ordered with an automotive part number. Conflict-mineral statement available via Intel supplier responsibility portal.
