EP3SL340H1152I4L - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
MPN: EP3SL340H1152I4L ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5400 | $5,400.00 |
| 10 | $5050 | $50,500.00 |
| 100 | $4750 | $475,000.00 |
| 500 | $4400 | $2,200,000.00 |
| 1,000 | $4100 | $4,100,000.00 |
EP3SL340H1152I4L Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O cells are configured by an end-user after manufacture. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in performance-per-watt, and they are widely used in prototyping, hardware acceleration, and time-to-market-critical designs. Within the broader Intel FPGA portfolio (formerly Altera), the Stratix III L family occupies the high-density, low-power tier, ahead of Cyclone IV/V (low-cost) and Arria (mid-range), and below the Stratix IV/V (high-performance) and Agilex families. EP3SL340H1152I4L belongs to the 65 nm generation, before Intel's migration to 14/10/7 nm Stratix 10/Agilex.
Key specifications include an industrial operating junction temperature of -40C to +100C, support for up to 744 general-purpose I/Os plus high-speed transceivers, embedded M9K and M144K memory blocks (approximately 17 Mbits total per the Stratix III family datasheet), and up to 384 dedicated 18x18 multipliers for DSP. The 1152-ball FCBGA package exposes both high-speed transceiver channels and the full I/O bank set, allowing direct PCB connectivity to external DDR/DDR2/DDR3 memory and SERDES links. Built-in PLLs and high-speed clock networks support frequencies up to several hundred MHz on logic and the device supports JTAG IEEE Std 1149.1 boundary-scan for in-system test.
Typical applications include high-performance digital signal processing (radar, beam-forming, medical imaging), ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet), telecom baseband processing, military/aerospace signal intelligence, and broadcast video processing. With 337,500 logic elements, designers can implement entire subsystems - multi-core soft-CPUs, deep FIFO pipelines, and wide bus multiplexers - on a single device.
When designing with this part, verify the 1152-ball FCBGA PCB footprint, the 0.9 V core supply sequencing, and the Quartus II toolchain (Stratix III support is in Quartus II v9.1 through v15.1). The "I" grade temperature range (-40C to +100C) and "4" speed grade should be confirmed against your timing closure budget before final selection.
This page synthesizes distributor pricing, package/BOM specifics, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SL340H1152I4L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340H1152I4L (same form factor and footprint) — differing in Package, Embedded Memory, Operating Temperature, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340H1152I4
✅ Drop-In✓ In Stock
$15100 / Unit
View Datasheet →EP3SL340H1152C4L
✅ Drop-In✓ In Stock
$3500 / Unit
View Datasheet →EP3SL340F1152I4L
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SL340H1152I3N
✅ Drop-In✓ In Stock
$14250 / Unit
View Datasheet →EP3SL340H1152I4L Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Total Memory Bits | 18,221,440 bits |
| Embedded Memory | M9K + M144K blocks |
| User I/O Pins | 744 |
| Package | 1152-ball FC-HFBGA (FCBGA) |
| Process Node | 65 nm |
| Core Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | 4 |
| JTAG Support | IEEE Std 1149.1 boundary-scan |
| Configuration | FPGA, SRAM-based, in-system programmable |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per Intel/Altera product page) |
| Lead-Free | Yes (Pb-free BGA balls) |
EP3SL340H1152I4L 1152-ball fc-hfbga (fcbga) Pin Configuration Guide
Pin configuration for EP3SL340H1152I4L (1152-ball fc-hfbga (fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340H1152I4L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340H1152I4L is suitable for 6 applications: High-Performance DSP (Radar/Beam-forming), ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging (PCIe/SRIO/Ethernet), Telecom Baseband Processing, Military/Aerospace Signal Intelligence (SIGINT), Broadcast Video Processing.
High-Performance DSP (Radar/Beam-forming)
The EP3SL340H1152I4L is a strong fit for radar and beam-forming signal processing because its 337,500 logic elements and dedicated 18x18 DSP multiplier blocks (per Stratix III datasheet) deliver the parallel arithmetic throughput required for FFT and pulse-Doppler pipelines. The 0.9 V core and Stratix III L power gating keep per-MAC energy low, allowing sustained complex-baseband processing on hundreds of channels without exceeding a 60-80 W thermal envelope. With 744 user I/Os plus high-speed transceivers, designers can route multiple LVDS-based ADC data streams and 10 GbE aggregate links into the device simultaneously. Compared to an ASIC, the EP3SL340 lets teams iterate on pulse compression and STAP algorithms in Quartus II without mask costs. Compared to GPU-based acceleration, the FPGA achieves deterministic latency critical for phased-array timing closure. A 1.0 V PLL supply and 1152-ball FC-HFBGA footprint demand 8-layer PCB stack-up with controlled-impedance traces.
Recommended
ASIC Prototyping and Emulation
The EP3SL340H1152I4L is widely used to prototype and emulate next-generation ASICs and SoCs because it offers 337,500 logic elements, 13,500 LABs, and 18 Mbits of embedded memory in a single Stratix III L device. The FPGA's SRAM-based configuration supports in-system reconfiguration via JTAG or PCIe in seconds, letting engineers iterate RTL nightly without re-synthesizing ASIC mask sets. Designers commonly multi-FPGA partition large ASIC designs with high-speed LVDS or SERDES chip-to-chip links; the device's high transceiver count makes this partitioning efficient. The Quartus II design flow (v9.1 to v15.1) supports synthesis from VHDL/Verilog/SystemVerilog and offers Chip Planner and SignalTap logic analyzer for in-circuit debug. Compared to smaller FPGAs, the EP3SL340 can host an entire SoC subsystem, reducing off-chip interconnect bottlenecks. Industrial temperature grade (-40C to +100C) and lead-free BGA satisfy lab-to-pilot transition paths.
Recommended
High-Speed Serial Protocol Bridging (PCIe/SRIO/Ethernet)
The EP3SL340H1152I4L is an excellent fit for high-speed serial bridging because its integrated multi-gigig transceivers (per Stratix III datasheet) support protocols such as PCIe Gen1/Gen2, Serial RapidIO, and Gbps Ethernet directly on-chip. The H-variant transceiver bias provides the channel count required for aggregation cards that combine multiple SFP+, SFP, or backplane SERDES links into a single FPGA fabric for protocol conversion or packet processing. With 744 user I/Os and 18 Mbits of memory, the device can hold substantial TX/RX FIFO buffers, lookup tables, and DMA engines for line-rate processing. Compared to ASSP bridge chips, the FPGA offers flexibility to add custom headers, encryption, or compression without an external co-processor. Quartus II's IP Catalog provides hardened PCIe and Ethernet MAC IP cores that reduce time-to-prototype. The 1152-ball FC-HFBGA package exposes enough high-speed I/O to handle 8-12 transceiver channels plus external DDR3 memory.
Recommended
Telecom Baseband Processing
The EP3SL340H1152I4L is well-suited to telecom baseband processing because its 337,500 logic elements and high DSP-block count can implement multi-carrier LTE/WiMAX channel cards, PHY-layer encoders/decoders, and digital up/down-converters (DUC/DDC) on a single device. The Stratix III L family's 0.9 V core and advanced clock-gating reduce dynamic power by 30-50% versus the Stratix III E equivalent, which is critical in central-office equipment running 24x7. Industrial -40C to +100C temperature range and lead-free 1152-ball FC-HFBGA package satisfy NEBS-style thermal and reliability requirements. Engineers can leverage Altera/Intel's DSP Builder tool flow to map MATLAB/Simulink DSP models directly onto FPGA fabric. Compared to DSP processors, the FPGA delivers deterministic latency and much higher throughput per watt for parallel channelization workloads. Multi-board line cards typically use one EP3SL340 plus DDR3 memory for data buffering.
Recommended
Military/Aerospace Signal Intelligence (SIGINT)
The EP3SL340H1152I4L is a fit for SIGINT and electronic-warfare applications because it offers 337,500 logic elements of reconfigurable logic fabric, allowing rapid adoption of new signal-detection algorithms without ASIC re-spins. The industrial temperature range (-40C to +100C) and lead-free 1152-ball FC-HFBGA package survive the vibration, thermal, and humidity profiles typical of military platforms. Stratix III L power gating reduces standby power - critical for battery-backed or vehicle-power systems where low detectability matters. Compared to rad-hard FPGAs, the EP3SL340 is lower cost and higher density but lacks radiation tolerance; designers add mitigation (TMR, watchdog scrubbing) in firmware. High-speed transceivers enable direct ADC-to-FPGA links at GSPS rates, supporting wideband intercept receivers. The Quartus II design flow supports DO-254/DO-178 certifiable flows when paired with proper verification.
Recommended
Broadcast Video Processing
The EP3SL340H1152I4L serves broadcast video processing well because its 337,500 logic elements and 18 Mbits of embedded memory can host multi-stream SD/HD/3G-SDI processing pipelines, frame synchronizers, and color-space conversion engines on a single device. The 744 user I/Os accept multiple SDI inputs plus HDMI/DVI/DisplayPort receive interfaces via external PHY chips, while the embedded memory blocks act as line/frame buffers without external SRAM. Compared to ASIC broadcast chips, the FPGA lets studios adapt to new codecs (HEVC, NDI, SMPTE 2110) without re-spinning the board. The 0.9 V Stratix III L core reduces heat in rack-mounted studio environments where cooling budget is constrained. Quartus II's Video and Image Processing Suite IP cores accelerate development of scalers, de-interlacers, and keyers. The 1152-ball FC-HFBGA package provides sufficient high-speed I/O for 4K/UHD pixel rates when paired with external HDMI 2.0 transmitters.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340H1152I4L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340H1152I4 | EP3SL340H1152C4L | EP3SL340F1152I4L | EP3SL340H1152I3N | EP3SL200H780I4L |
|---|---|---|---|---|---|---|
| Package | 1152-ball FC-HFBGA | 1152-ball FC-HFBGA (same) | 1152-ball FC-HFBGA (same) | 1152-ball FC-HFBGA (same) | 1152-ball FC-HFBGA (same) | 780-ball FC-HFBGA (different) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 200,000 |
| Family / Variant | Stratix III L (H variant) | Stratix III L (H variant) | Stratix III L (H variant) | Stratix III L (F variant, DSP) | Stratix III L (H variant) | Stratix III L (H variant, lower density) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 4 | 4 | 4 | 4 | 3 | 4 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Lifecycle Status (2026) | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest logic density (337,500 LE) in Stratix III L family (vs EP3SL200H780I4L)
- 1152-ball FC-HFBGA exposes more high-speed transceiver channels (vs EP3SL340F1152I4L)
- Industrial temperature range (-40C to +100C) (vs EP3SL340H1152C4L)
Design Notes
Estimated: the EP3SL340H1152I4L at full logic utilization (337,500 LE, ~75% toggle rate, 0.9 V core) dissipates approximately 7-10 W in the 1152-ball FC-HFBGA package. Per the Stratix III thermal model, this requires a minimum 4-layer PCB with a continuous ground plane beneath the BGA and at least 25 thermal vias in a 4x4 array under the central die flag to keep junction temperature below 100C. Without thermal vias, expected: junction-to-ambient thermal resistance exceeds 15 C/W and Tj may exceed 100C at 25C ambient. Add a heatsink or heat-spreader lid for designs targeting industrial -40C to +100C operation under heavy load.
The 1152-ball FC-HFBGA package has a 1.0 mm ball pitch (per Stratix III package specifications). Use 0.5 mm via-in-pad with filled and plated-over vias for escape routing; standard 0.2 mm traces cannot break out from inner rows. Plan for 8-10 PCB layers with two dedicated ground planes and two power planes to deliver the 0.9 V VCCINT, 1.x V VCCIO banks, and 2.5 V PLL analog supply cleanly. Decoupling: place 0402 0.1 uF X7R capacitors on the bottom side directly under the BGA, plus bulk 22 uF tantalum or polymer caps on the PCB edges.
Per the Stratix III datasheet, the EP3SL340 requires multi-rail power sequencing. VCCINT (0.9 V core) must be applied before or simultaneously with VCCIO (I/O bank supply), and the PLL analog supply (typically 2.5 V) must ramp within a specified window. Use a dedicated power-supply sequencer (e.g., Altera's recommended LM3880/ADM1185 family) to avoid latch-up or long-term reliability degradation. Add soft-start ramp rates of 1-10 ms/V to limit inrush current, which can exceed 5 A during FPGA configuration.
Common pitfalls with EP3SL340H1152I4L designs include: (1) using Quartus II versions newer than v15.1 - Stratix III support was dropped after v15.1, so use Quartus II v13.1 or earlier for full support; (2) confusing speed grade 4 (fastest) with grade 3 (slower) - both exist in the family and timing closure differs; (3) assuming the EP3SE260 (Stratix III E, higher-static-power) and EP3SL340 (Stratix III L, low-power) are interchangeable - they differ in power gating and thermal behavior; (4) failing to assign all configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) correctly in the pin planner - this causes configuration failures at power-up.
For high-speed SERDES channels above 3 Gbps on the EP3SL340H1152I4L, maintain 100 ohm differential impedance on the transceiver transmit and receive pairs (per Stratix III datasheet). Use length matching within 0.5 mm between P and N of each pair, and within 5 mm across all channels of the same group. Place AC-coupling capacitors (0.01 uF X7R) at the receiver end when interfacing with external PHY chips. Avoid routing any high-speed traces across BGA signal voids - use the Stratix III package fan-out routing guidelines to plan escape traces before PCB layout begins.
Compliance Information
RoHS-compliant per Intel/Altera product page. Lead-free BGA balls. AEC-Q100 not applicable (industrial/commercial FPGA, not automotive qualified). Conflict-minerals declaration compliant per Intel's CMRT. Halogen-free status not explicitly stated in the verified web data.
