EP3SL340H1152I4 - Stratix III L FPGA 337.5K LE 1152-BGA | Intel
MPN: EP3SL340H1152I4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17269.01 | $17,269.01 |
| 10 | $17050 | $170,500.00 |
| 100 | $16500 | $1,650,000.00 |
| 500 | $15800 | $7,900,000.00 |
| 1,000 | $15100 | $15,100,000.00 |
EP3SL340H1152I4 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs) connected via programmable interconnect and surrounded by I/O blocks; modern high-end FPGAs like the Stratix III L family also embed hardened memory controllers, transceivers, DSP blocks, and PLLs to enable complete system-on-chip designs without external ASICs. FPGAs sit hierarchically within the broader taxonomy: programmable logic device -> programmable logic IC -> digital IC -> semiconductor -> integrated circuit.
Key features of the EP3SL340H1152I4 include 744 user I/O pins, embedded multiplier blocks (18x18), high-speed LVDS pairs, dedicated DDR/DDR2/DDR3 memory controllers with hard PHY, and up to 12 embedded transceivers depending on configuration. The 1152-ball HBGA package uses Intel's flip-chip BGA technology for low inductance power distribution and high signal integrity at multi-hundred-MHz fabric speeds.
The Stratix III L variant specifically targets lower static power compared to the standard Stratix III family while preserving high-performance fabric features such as adaptive logic modules (ALMs), M9K and M144K memory blocks, and DSP blocks with hardware multipliers and accumulators. This positions the EP3SL340H1152I4 for power-sensitive applications that still demand hundreds of thousands of logic elements.
Typical applications include high-end wireline telecom line cards, software-defined radio (SDR) baseband processing, military radar signal processing, ASIC prototyping and emulation platforms, high-performance DSP pipelines, broadcast video processing, and medical imaging accelerators. The 337.5K LE capacity supports complete protocol stacks plus parallel processing dataplanes on a single device.
Designers should provide a multi-rail power system (typically 1.1 V core, 2.5 V/3.3 V aux, and dedicated PLL analog supplies) with bulk decoupling and high-frequency ceramic bypass near the BGA balls. Thermal management is critical because the flip-chip BGA dissipates up to 25-30 W at full fabric utilization, often requiring a heatsink and controlled airflow. Signal integrity must be considered for the high-speed LVDS and transceiver channels.
This page synthesizes distributor pricing, parametric alternatives, and PCB thermal/layout notes not consolidated in the manufacturer datasheet. Pricing references distributor stock data as of 2026-09-09.
Drop-in alternatives for EP3SL340H1152I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340H1152I4 (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Operating Temperature Grade, Embedded Memory.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL340H1152I3
β Drop-Inβ In Stock
$13234.64 / Unit
View Datasheet βEP3SL340H1152I3N
β Drop-Inβ In Stock
$14250 / Unit
View Datasheet βEP3SL340H1152C4N
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$1245 / Unit
View Datasheet βEP3SL340H1152C4
β Drop-Inβ In Stock
$11000 / Unit
View Datasheet βEP3SL340H1152C3
β Drop-Inβ In Stock
$2550 / Unit
View Datasheet βEP3SL340H1152C2N
β Drop-Inβ In Stock
$3400 / Unit
View Datasheet βEP3SL340H1152C2
β Drop-Inβ In Stock
$15800 / Unit
View Datasheet βEP3SL340H1152I4 Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Logic Elements (LE) | 337,500 |
| Embedded Memory | 18,821,440 bits |
| User I/O Pins | 744 |
| Logic Array Blocks (LABs) | 13,500 |
| Operating Frequency | 717 MHz (max fabric speed) |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Package | 1152-ball FCBGA / HBGA |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I4: -40C to +100C junction) |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, LVTTL |
| Memory Interface Hard IP | DDR / DDR2 / DDR3 SDRAM controllers with PHY |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3SL340H1152I4 1152-ball fcbga / hbga Pin Configuration Guide
Pin configuration for EP3SL340H1152I4 (1152-ball fcbga / hbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340H1152I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340H1152I4 is suitable for 7 applications: Wireline Telecom Line Cards, Software-Defined Radio (SDR) Baseband, Military Radar Signal Processing, ASIC Prototyping and Emulation, High-Performance DSP Pipelines, Broadcast Video Processing, High-Speed Industrial Test & Measurement.
Wireline Telecom Line Cards
The EP3SL340H1152I4's 337,500 logic elements and 18.8 Mbit embedded memory make it a strong fit for high-density wireline telecom line cards such as OTN cross-connects, carrier Ethernet switches, and multi-port packet processors. Its hard DDR3 memory controllers support high-bandwidth look-up tables and packet buffers at line rate. The 744 user I/Os accommodate multiple 10G/40G SerDes interfaces plus parallel fabric connections to NPUs. The Stratix III L variant's lower static power is critical in central-office chassis where dozens of FPGAs share a backplane with constrained cooling budgets. The I4 industrial temperature grade (-40C to +100C junction) supports outdoor cabinet deployments in addition to climate-controlled CO environments.
Recommended
Software-Defined Radio (SDR) Baseband
The EP3SL340H1152I4's combination of DSP blocks, embedded multipliers (18x18 hardware multipliers), and 18.8 Mbit block RAM is well-suited to multi-channel SDR baseband processing for LTE, 5G NR, and military waveforms. The 717 MHz fabric speed enables sample-rate processing in the hundreds of MSPS range with parallel channelization. Its high I/O count supports multi-antenna MIMO configurations, and the industrial temperature grade allows deployment in outdoor base-station enclosures. The Stratix III L family was widely adopted in 4G base-station baseband designs and continues to serve 5G small-cell deployments where the fabric density matches the channel count. Engineers pair the FPGA with high-speed ADC/DAC front-ends and use the DDR3 hard controllers for ADC buffer capture.
Recommended
Military Radar Signal Processing
Military phased-array radar systems require FPGA-based beamforming and pulse-Doppler processing that demands hundreds of thousands of logic elements with deterministic latency. The EP3SL340H1152I4's 337,500 LEs and high fabric clock rate are well-matched to radar pulse processing and FFT pipelines operating on multi-hundred-MSPS data streams. The industrial temperature grade and flip-chip BGA package suit ruggedized military housings subject to thermal cycling. The Stratix III family's embedded memory supports range-Doppler map storage on-chip, reducing external memory traffic. Additionally, the device's high I/O count accommodates multiple optical or copper links to RF front-ends. The L variant's lower static power is valued in unmanned and battery-backed radar installations.
Recommended
ASIC Prototyping and Emulation
The EP3SL340H1152I4 is a workhorse for ASIC prototyping and emulation platforms, where its 337,500 logic elements can map portions of a multi-million-gate ASIC design. Multiple EP3SL340H1152I4 devices are typically combined on a logic-emulation motherboard to provide 1-2 MLE of capacity per chassis. The flip-chip BGA package supports high-speed board-to-board interconnect via LVDS, enabling fast FPGA-to-FPGA pin mapping. The DDR3 hard memory controllers simplify ASIC memory-subsystem modeling. Engineers can partition ASIC RTL into Stratix III L FPGAs and verify full-chip operation at near-real-time clock speeds, dramatically reducing silicon re-spins.
Recommended
High-Performance DSP Pipelines
Medical imaging (CT, MRI, ultrasound), seismic processing, and broadcast video codecs use the EP3SL340H1152I4 to implement massively parallel DSP pipelines that exceed CPU/GPU performance per watt. The Stratix III L family provides dedicated DSP blocks with hardware multipliers and accumulators that achieve hundreds of GMACS of DSP throughput at 717 MHz. The 18.8 Mbit embedded memory supports sliding-window and FFT intermediate buffers on-chip, avoiding external memory bottlenecks. The high I/O count interfaces to high-speed ADC front-ends and DDR3 sample buffers. For ultrasound beamforming specifically, the fabric's deterministic latency is essential for coherent summation across array channels.
Recommended
Broadcast Video Processing
Broadcast video switchers, multi-viewers, and 4K/8K video processing engines leverage the EP3SL340H1152I4's logic density to implement color-space conversion, scaling, deinterlacing, and overlay composition in real time. The fabric can drive multiple HDMI/DisplayPort/SDI output channels simultaneously with very low latency. DDR3 hard memory controllers support frame-buffer storage for pipelined video processing at 60-120 Hz refresh rates. The industrial temperature grade suits OB (outside broadcast) vans and field production trucks subject to wide temperature swings. The 744 user I/Os handle multiple parallel video data buses plus auxiliary audio and control channels without external muxing.
Recommended
High-Speed Industrial Test & Measurement
ATE (Automated Test Equipment) and high-speed oscilloscope/pattern-generator designs use the EP3SL340H1152I4 for waveform synthesis, timing calibration, and protocol-aware pattern generation across hundreds of test channels. The device's parallel I/O and DDR3 controllers drive pattern memory plus capture buffers at multi-Gbps rates. The fabric density supports per-channel DSP for eye-diagram analysis, jitter decomposition, and equalization. The flip-chip BGA package and high pin count accommodate dense probe-card interconnect. The industrial temperature grade suits factory-floor ATE racks with variable cooling. Engineers pair the FPGA with high-speed DAC/ADC and use the fabric to implement per-pin parametric measurement units.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340H1152I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340H1152I3 | EP3SL340H1152I3N | EP3SL340H1152C4N | EP3SL340H1152C4 | EP3SL340H1152C3 |
|---|---|---|---|---|---|---|
| Package | 1152-ball HBGA (FCBGA) | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same | 1152-ball HBGA (FCBGA) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 337,500 | 337,500 - same | 337,500 - same | 337,500 - same | 337,500 - same | 337,500 - same |
| Speed Grade | I4 (industrial, fastest) | I3 (industrial, ~5-10% slower) | I3 Pb-free (industrial) | C4 (commercial, similar to I4) | C4 (commercial) | C3 (commercial, slower) |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O | 744 | 744 - same | 744 - same | 744 - same | 744 - same | 744 - same |
| Embedded Memory | 18,821,440 bits | 18,821,440 bits - same | 18,821,440 bits - same | 18,821,440 bits - same | 18,821,440 bits - same | 18,821,440 bits - same |
| Core Voltage | 1.1 V | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same |
Key Differentiators
- Highest speed bin (I4) for industrial temperature operation (vs EP3SL340H1152I3)
- Industrial temperature grade (-40C to +100C junction) (vs EP3SL340H1152C4)
- Same die and footprint as lower-cost speed grades (vs EP3SL340H1152C3)
- 337,500 LE fabric matches the largest Stratix III L density (vs EP3SL200H780I4)
Design Notes
Estimated: The EP3SL340H1152I4 in the 1152-ball HBGA flip-chip package can dissipate 10-30 W depending on fabric utilization and clocking. The flip-chip BGA attaches directly to the PCB land pattern, so primary thermal path is through the PCB BGA pads into internal copper planes and the board's heatsink stack. For full-power operation (above ~10 W), a heatsink with thermal interface material is recommended, and chassis airflow should maintain case temperature below 85C. Estimating with theta_JA of ~10 C/W (with 4-layer PCB and minimal airflow) at 15 W yields a 150C junction rise above ambient - clearly inadequate. The I4 industrial junction rating (-40C to +100C) requires careful thermal budgeting; in practice designers use heatsinks plus 1-2 m/s airflow.
The Stratix III L family requires a multi-rail power system: 1.1 V core (typically 15-25 A peak, depending on toggle rate), 2.5 V or 3.0 V analog supply for PLLs, 3.3 V (or 2.5 V) I/O supply, and dedicated configuration/sense pins. Bulk decoupling (220 uF polymer or multiple 22 uF ceramics per rail) plus high-frequency 0.1 uF/1 nF bypass near each BGA power pin cluster is required. Power sequencing must ensure the 1.1 V core is monotonic and does not exceed 1.1 V during ramp; failure to control ramp can stress gate oxide. Use a dedicated Power Management Unit (PMU) such as the LTM4644 or EN6337QI for multi-rail generation.
The 1152-ball HBGA uses 0.8 mm ball pitch, requiring a PCB with high-density interconnect (HDI) build-up. Use microvias (laser-drilled) to escape the BGA balls to inner layers, and ensure the BGA land pattern follows the IPC-7351 BGA guidelines. PCB stackup should include at least 6 layers with dedicated ground and 1.1 V planes on adjacent layers to minimize inductance in the core power delivery network. Differential pair routing for LVDS (100 ohm differential) and high-speed transceiver channels must control impedance to 85-100 ohm differential with matched lengths within 5 ps. Avoid signal vias in the BGA footprint area to maintain reference-plane continuity for the core supply.
Common pitfalls when designing with EP3SL340H1152I4: (1) Using commercial-grade (C-grade) parts in industrial-temperature applications - the speed and temperature drift outside spec; (2) Skipping the JTAG programming header - all Stratix III devices require the JTAG chain (TCK/TMS/TDO/TDI plus VCCIO) for programming, even if using the AS configuration mode; (3) Omitting the configuration device - the EP3SL340 requires an external configuration memory (EPCS64 or compatible) on the PCB; (4) Underestimating transceiver reference clock jitter - the GXB/PLL reference clock must be < 1 ps RMS jitter for multi-gigabit operation; (5) Driving the configuration DONE pin from an external source - this pin is open-drain and must be pulled up to VCCIO with a 5 kohm resistor.
Compliance Information
RoHS compliant per Intel product page; lead-free finish standard for HBGA-1152 package. AEC-Q100 not applicable for FPGAs (automotive qualification is not standard for Stratix III L; Cyclone IV/V families target AEC-Q100). Conflict minerals compliance per Intel's published Conflict-Free Smelter Program disclosure.
