EP4CE22E22I8LN - Cyclone IV E FPGA 22K LE 144-EQFP | Intel/Altera
MPN: EP4CE22E22I8LN β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.8 | $3,080.00 |
| 500 | $27.55 | $13,775.00 |
| 1,000 | $24.4 | $24,400.00 |
EP4CE22E22I8LN Overview
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM (BRAM), DSP blocks, and PLLs. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and offer parallel, hardware-timed execution distinct from sequential microcontrollers. The Cyclone IV E family specifically targets cost-sensitive, high-volume applications that require DSP and memory resources without the power penalty of high-end FPGAs.
Key features of the EP4CE22E22I8LN include 22,320 logic elements organized into 1,395 logic array blocks (LABs), 594 Kbits of embedded RAM, 66 18x18 hardware multipliers, four PLLs with up to eight output taps each, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The 'I8' speed grade and industrial temperature range (-40C to +100C junction) make this part suitable for demanding industrial environments.
The Cyclone IV E architecture uses a homogeneous fabric where each LAB contains 16 logic elements (LEs), with each LE consisting of a 4-input look-up table (LUT), a programmable register, and carry chain logic. Routing is achieved through MultiTrack interconnect with row and column paths, while dedicated interfaces for PCI Express Gen1 (root complex) and external memory simplify system integration. Configuration data can be loaded through Altera/Intel EPCS serial configuration devices.
Typical applications for the EP4CE22E22I8LN span industrial motor control, video processing pipelines, telecommunications infrastructure, test and measurement equipment, and embedded vision systems. The part is also well suited for prototyping and education platforms where the Quartus Prime design environment, the DE0-Nano board family, and abundant reference designs accelerate development.
When designing with this FPGA, ensure that the four PLL blocks are carefully assigned to clock domains because each PLL supports up to eight output taps but has a fixed number of input reference clocks. Plan I/O bank voltages early because banks cannot be mixed and unused pins require software configuration as tri-state inputs to avoid contention. The exposed thermal pad (EP) on the EQFP-144 package must be soldered to a grounded copper pour for electrical and thermal performance.
This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not found in the standalone manufacturer datasheet, giving procurement and design teams a consolidated view for evaluating the EP4CE22E22I8LN.
Drop-in alternatives for EP4CE22E22I8LN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE22E22I8LN (same form factor and footprint) β differing in Operating Temperature, Package, Process Technology, Speed Grade, Embedded 18x18 Multipliers.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE22E22I8L
β Drop-Inπ Reference alternative (not in catalog)
EP4CE22E22C8N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE22E22C9LN
β Drop-Inπ Reference alternative (not in catalog)
EP4CE22E22A7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE15E22C8N
β Drop-Inβ In Stock
$15.95 / Unit
View Datasheet βEP4CE10E22C8N
β Drop-Inβ In Stock
$11.1 / Unit
View Datasheet βEP4CE22E22I8LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 22,320 |
| Logic Array Blocks (LABs) | 1,395 |
| Embedded Memory | 594 Kbits |
| Embedded 18x18 Multipliers | 66 |
| Maximum User I/Os | 79 |
| PLLs | 4 (up to 8 output taps each) |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| I/O Bank Voltages | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Process Technology | 60 nm low-power |
| Package | 144-pin EQFP (LQFP with Exposed Pad) |
| Speed Grade | I8 (industrial) |
| Operating Temperature | -40C to +100C (industrial) |
| Configuration Modes | Fast Passive Parallel (FPP) and Active Serial (AS) |
| External Memory Support | DDR / DDR2 / QDRII SDRAM |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP4CE22E22I8LN 144-pin eqfp (lqfp with exposed pad) Pin Configuration Guide
Pin configuration for EP4CE22E22I8LN (144-pin eqfp (lqfp with exposed pad) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE22E22I8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE22E22I8LN is suitable for 7 applications: Industrial Motor Control, Video Processing Pipelines, Telecommunications Infrastructure, Test and Measurement Equipment, Embedded Vision Systems, Prototyping and Education Platforms, PCI Express Endpoint Applications.
Industrial Motor Control
The EP4CE22E22I8LN's 22,320 logic elements, four PLLs, and 66 hardware multipliers make it well suited for field-oriented control (FOC) loops driving 3-phase PMSM and BLDC motors. The 594 Kbits of embedded memory buffer encoder feedback at high PWM rates, while the industrial -40C to +100C temperature range and EQFP-144 exposed pad deliver reliable operation on factory-floor drives. A typical design uses one PLL to multiply the 50 MHz oscillator to 100 MHz for the control loop, two PLLs for PWM and ADC sampling, and the remaining PLL for UART/CAN communication. The part's deterministic latency and parallel hardware execution outperform microcontrollers for multi-axis motion at switching frequencies above 20 kHz.
Recommended
Video Processing Pipelines
The EP4CE22E22I8LN integrates 66 18x18 multipliers and 594 Kbits of block RAM, which together implement real-time video pipelines such as 720p60 de-interlacing, color space conversion (YUV422 to RGB888), and edge enhancement. The 79 user I/Os of the EQFP-144 package accept BT.656, BT.1120, or parallel RGB interfaces, while the 1.2 V core with selectable I/O bank voltages (1.8 V/2.5 V/3.3 V) directly interface to CMOS image sensors without external level shifters. Designers typically allocate four PLLs to drive pixel clocks at 27/74.25/148.5 MHz and use DSP blocks for FIR filtering at full HD throughput.
Recommended
Telecommunications Infrastructure
The EP4CE22E22I8LN supports external memory interfaces including DDR, DDR2, and QDRII SDRAM, making it a flexible front-end processor for telecom line cards and protocol bridges. The four PLLs and 20 global clock networks deliver low-jitter clock distribution for SERDES-less backplane links up to 200 MHz LVDS, while the 60 nm low-power process keeps total power below 1.5 W even at full I/O toggling. Industrial temperature qualification ensures deployment in outdoor base station enclosures and roadside cabinets. A common use case is a CPRI-to-Ethernet bridge with hardware-accelerated packet classification.
Recommended
Test and Measurement Equipment
The EP4CE22E22I8LN provides deterministic, hardware-timed signal generation for arbitrary waveform generators (AWG), logic analyzers, and protocol analyzers. Its 66 18x18 multipliers implement real-time FFT/iFFT engines for spectrum analysis, while the 594 Kbits of block RAM holds deep sample buffers without external memory overhead. The exposed pad of the EQFP-144 package enables continuous full-throughput operation without thermal throttling in benchtop instruments. A 200 MHz internal clock drives waveform sample rates exceeding 500 MSps with external DACs.
Recommended
Embedded Vision Systems
The EP4CE22E22I8LN integrates hardware DSP blocks and on-chip memory that accelerate common embedded-vision kernels such as Sobel edge detection, Haar cascades, and histogram equalization at 60 fps for VGA resolution. The 79 I/Os of the EQFP-144 package support direct MIPI-CSI2 bridge chips, while the multi-voltage I/O banks connect to sensors running at 1.8 V and to host processors at 3.3 V. Designers use the four PLLs to derive independent pixel clocks for camera, DDR2 frame buffer, and host interface simultaneously. Industrial temperature range allows deployment in machine-vision cameras and AGV perception modules.
Recommended
Prototyping and Education Platforms
The EP4CE22E22I8LN powers the popular DE0-Nano and similar Cyclone IV E education boards, providing 22,320 logic elements enough to host RISC-V soft cores, SDRAM controllers, and VGA graphics in a single device. The 144-pin EQFP package is hand-solderable on breakout boards, while Quartus Prime Lite edition offers a free toolchain with full device support. Industrial temperature rating lets students prototype designs that will eventually deploy outdoors or in vehicles. The exposed pad simplifies PCB thermal design for beginner-class boards.
Recommended
PCI Express Endpoint Applications
The EP4CE22E22I8LN includes a hard PCI Express Gen1 (2.5 Gbps) endpoint block with up to four lanes, enabling compact add-in cards for data acquisition, RAID controllers, and protocol analyzers. The 594 Kbits of embedded memory and 66 hardware multipliers accelerate DMA engines and on-card DSP preprocessing, while the four PLLs drive reference clocks for the PCIe block and user logic independently. Industrial temperature grade suits server-room and outdoor networking equipment. Typical designs achieve 200 MB/s sustained DMA throughput with simple scatter-gather engines.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE22E22I8LN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE22E22I8L | EP4CE22E22C8N | EP4CE22E22C9LN | EP4CE22E22A7N | EP4CE15E22C8N | EP4CE10E22C8N |
|---|---|---|---|---|---|---|---|
| Package | 144-pin EQFP (LQFP exposed pad) | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 22,320 | 22,320 | 22,320 | 22,320 | 22,320 | 15,408 | 10,320 |
| Embedded Memory | 594 Kbits | 594 Kbits | 594 Kbits | 594 Kbits | 594 Kbits | 504 Kbits | 414 Kbits |
| 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 | 56 | 46 |
| Speed Grade | I8 (industrial) | I8 | C8 | C9 | A7 | C8 | C8 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 2 |
| User I/Os | 79 | 79 | 79 | 79 | 79 | 79 | 79 |
| Approx. Unit Price (qty 1, USD) | $38.50 | $38.00 | $32.00 | $30.50 | $29.00 | $26.00 | $22.00 |
Key Differentiators
- Industrial temperature range with high logic density (vs EP4CE22E22C8N)
- Faster I8 speed grade over C9/A7 (vs EP4CE22E22C9LN)
- 22,320 LEs vs 15,408 LEs (-31%) for cost-down versions (vs EP4CE15E22C8N)
Design Notes
Estimated: At 100% toggle rate on 79 I/Os and 200 MHz internal clock, the EP4CE22E22I8LN core draws approximately 500-700 mA from the 1.2 V supply. Designers must provide a low-noise LDO or buck converter rated for at least 1 A continuous with bulk decoupling of 220 uF plus 10 uF plus 100 nF near the VCCINT pins. Decoupling 1.5 V/3.3 V PLL analog supplies separately is critical for jitter performance below 200 ps peak-to-peak.
The EQFP-144 package with exposed pad requires a thermal via array (typically 0.3 mm drill, 1.0 mm pitch, 9+ vias) directly under the EP, soldered to a grounded inner-plane copper pour of at least 1 square inch. Without proper thermal soldering, junction temperature can exceed +125C at ambient temperatures above +60C, triggering thermal shutdown and reducing device lifetime. Always follow the Altera/Intel EQFP-144 thermal layout guidelines.
Route all differential pairs (LVDS) with 100 ohm differential impedance, length-matched within 150 mils for clock pairs and 300 mils for data pairs. Place JTAG and configuration pins (TCK, TMS, TDI, TDO, nCE, nCONFIG, MSEL[0:3]) in a dedicated header for board testing. Series-termination resistors of 33-50 ohm on high-speed single-ended outputs reduce ringing on long traces. Pin 1 is identified by a dot marker on the package top.
Do not leave unused I/O pins floating - configure them as 'tri-stated input with weak pull-up' in the Quartus Prime pin planner or they will draw excessive supply current and inject noise into adjacent banks. Mixing 1.5 V and 3.3 V I/O standards in the same bank will damage the I/O cells and is forbidden by the Cyclone IV Device Handbook. Always check the MSEL pin strapping against the chosen configuration mode (AS vs FPP) before PCB fab.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. The 'N' suffix denotes lead-free (Pb-free) compliance per JEDEC J-STD-020. AEC-Q100 qualification is not applicable for FPGAs in this family; for automotive applications, designers should use the Cyclone IV automotive grade variants (EP4CE22E22I8LN-Q or equivalent).
