EP4CGX15BF14C7N - Cyclone IV GX FPGA, 14.4K LE, 169-FBGA
MPN: EP4CGX15BF14C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $20.85 | $20,850.00 |
EP4CGX15BF14C7N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to implement arbitrary digital logic - from simple glue logic to complete processor subsystems - by configuring an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs sit at the same level as Application-Specific Integrated Circuits (ASICs) in the integrated circuit taxonomy (FPGA -> programmable logic -> digital IC -> semiconductor) but offer far lower NRE cost and instant turnaround, making them ideal for low-to-medium volume production, prototyping, and design iteration.
Key features of the EP4CGX15BF14C7N include 56 embedded 18x18 multipliers, 4 PLLs, dedicated 3.125 Gbps transceiver channels, and support for external memory interfaces including DDR2. The 169-FBGA package exposes 72 general-purpose I/Os and supports a variety of I/O standards (LVDS, LVCMOS, SSTL, HSTL). The C7 speed grade places it in the mid-speed commercial tier; the I7 (industrial) and C8/C6 (faster/slower commercial) variants share the same die.
Typical applications include industrial video bridging, machine-vision interfaces, low-cost PCIe endpoint cards, motor-control encoder interfaces, and serial-protocol bridging (UART/SPI/I2C to high-speed LVDS). The integrated transceivers are particularly useful for designs requiring low-latency multi-gigabit serial links without external PHY chips. Design considerations include the need for a dedicated configuration memory (typically an EPCS or EPCQ serial flash), a 3.3 V auxiliary supply for the configuration subsystem, and careful PCB layout to maintain signal integrity on the high-speed transceiver channels. According to Intel Cyclone IV Device Handbook, the EP4CGX15BF14C7N operates across the commercial 0C to 85C junction temperature range and supports JTAG-based in-system programming via the Quartus Prime design tool. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone IV GX family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX15BF14C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX15BF14C7N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX15BF14C7
β Drop-Inβ In Stock
$21.4 / Unit
View Datasheet βEP4CGX15BF14C6N
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View Datasheet βEP4CGX15BF14C8N
β Drop-Inβ In Stock
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View Datasheet βEP4CGX15BF14A7N
β Drop-Inβ In Stock
$31.05 / Unit
View Datasheet βEP4CGX15BF14I7N
β Drop-Inβ In Stock
$23.1 / Unit
View Datasheet βEP4CGX15BF14C7N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone IV GX |
| Logic Elements | 14,400 |
| Embedded Memory | 552,960 bits |
| User I/Os | 72 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Package | 169-FBGA (FineLine BGA) |
| Speed Grade | C7 (commercial) |
| Operating Temperature | 0C to 85C (commercial) |
| Embedded Multipliers (18x18) | 56 |
| PLLs | 4 |
| Transceivers | Up to 3.125 Gbps |
| Memory Interface Support | DDR2 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP4CGX15BF14C7N 169-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP4CGX15BF14C7N (169-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX15BF14C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX15BF14C7N is suitable for 6 applications: Industrial Video Bridging, Low-Cost PCIe Endpoint Card, Motor Control Encoder Interface, Serial Protocol Bridge (UART/SPI/I2C to LVDS), LED Video Wall Controller, Medical Device Interface.
Industrial Video Bridging
The EP4CGX15BF14C7N is well-suited to industrial video bridging designs where multi-protocol conversion is required between image sensors and host processors. Its 14,400 logic elements combined with 56 embedded 18x18 multipliers and 3.125 Gbps transceivers enable real-time conversion of LVDS, MIPI CSI-2, and sub-LVDS camera data into parallel data for downstream processors. With 552,960 bits of embedded memory and 4 PLLs, the device handles line buffer storage and pixel clock generation without external components, fitting a 169-FBGA footprint compatible with space-constrained machine-vision PCBs.
Recommended
Low-Cost PCIe Endpoint Card
The EP4CGX15BF14C7N supports PCIe Gen1 x1 endpoint functionality via its integrated transceivers, eliminating the need for an external PHY chip in cost-sensitive add-in cards. The 72 user I/Os allow direct connection to bus switches, peripherals, and management EEPROMs. With 14,400 logic elements, the FPGA fits simple protocol-bridging applications such as UART/SPI to PCIe converters, IO controller cards, and data acquisition front-ends. The 169-FBGA package reduces board area relative to larger Cyclone IV packages while retaining transceiver capability.
Recommended
Motor Control Encoder Interface
In industrial servo and stepper drive systems, the EP4CGX15BF14C7N captures incremental encoder quadrature signals, BiSS, EnDat, or SSI absolute encoder protocols, and converts them to real-time fieldbus traffic (EtherCAT, Profinet, CANopen). Its 4 PLLs generate precise sampling clocks, while 72 user I/Os provide direct connection to encoder channels, end-of-travel sensors, and drive enable lines. The C7 commercial speed grade supplies adequate timing margin for 16 MHz encoder sampling, and the 169-FBGA package supports the harsh thermal environment of enclosed motor drives.
Recommended
Serial Protocol Bridge (UART/SPI/I2C to LVDS)
For multi-protocol system design, the EP4CGX15BF14C7N serves as a flexible bridge between low-speed serial peripherals (UART, SPI, I2C, GPIO) and high-speed LVDS or differential links. Its 14,400 logic elements accommodate complete protocol stacks including CRC, packet framing, and clock-domain crossing FIFOs, while the 552,960 bits of embedded memory provide buffer storage for protocol translation. With 72 user I/Os, the device can serve 4-6 low-speed peripherals simultaneously, useful in test-and-measurement fixtures and industrial gateways.
Recommended
LED Video Wall Controller
Commercial LED video walls and digital signage controllers benefit from the EP4CGX15BF14C7N's combination of multi-gigabit transceivers, 56 hardware multipliers, and 14,400 logic elements. The device can drive multiple Gigabit Ethernet video input streams (DVI, HDMI bridged, or Art-Net), perform pixel-level color correction and brightness mapping using the embedded multipliers, and output refresh data over LVDS to scan panels. With 72 user I/Os and 4 PLLs, it handles pixel clocks up to 165 MHz for high-resolution panel arrays in compact BGA packaging.
Recommended
Medical Device Interface
The EP4CGX15BF14C7N's low-power 60 nm process and 1.2 V core supply make it suitable for portable medical instrumentation requiring low EMI emissions and battery-friendly operation. The FPGA can handle USB-to-serial bridging, real-time sensor data acquisition from ECG, pulse oximeter, or temperature channels, and LCD/AMOLED display refresh, all in a single chip. With 72 user I/Os and 3.125 Gbps transceiver support, it interfaces to high-resolution image sensors in handheld ultrasound or endoscopy equipment, while the 169-FBGA package suits miniaturized medical PCBs.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX15BF14C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX15BF14C7 | EP4CGX15BF14C6N | EP4CGX15BF14C8N | EP4CGX15BF14A7N | EP4CGX15BF14I7N |
|---|---|---|---|---|---|---|
| Package | 169-FBGA | 169-FBGA - same | 169-FBGA - same | 169-FBGA - same | 169-FBGA - same | 169-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| Speed Grade | C7 | C7 | C6 | C8 | A7 (Automotive) | I7 (Industrial) |
| Embedded Memory | 552,960 bits | 552,960 bits | 552,960 bits | 552,960 bits | 552,960 bits | 552,960 bits |
| User I/Os | 72 | 72 | 72 | 72 | 72 | 72 |
| Transceiver Speed | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C | 0C to 85C | 0C to 85C | -40C to 125C (Automotive) | -40C to 100C (Industrial) |
Key Differentiators
- Lowest-cost drop-in replacement with identical speed grade (vs EP4CGX15BF14C7)
- Faster speed grade for tight timing closure (vs EP4CGX15BF14C8N)
- Industrial temperature range for harsh environments (vs EP4CGX15BF14I7N)
- Automotive-qualified grade available (vs EP4CGX15BF14A7N)
Design Notes
The EP4CGX15BF14C7N requires four supply rails: 1.2 V VCCINT (core), 2.5 V or 3.3 V VCCAUX (PLL and configuration), 3.3 V VCCIO (configuration and JTAG), and 1.2 V/2.5 V/3.3 V VCCPD (pre-driver). According to the Cyclone IV GX Device Handbook, each rail must be decoupled with 0.1 uF X7R ceramic capacitors placed within 5 mm of the relevant balls, plus a single bulk 10 uF-47 uF tantalum or polymer capacitor. Power-on sequencing must follow the datasheet-specified order to avoid latch-up; the VCCINT supply must reach its threshold before VCCAUX to prevent high-current draw from the I/O banks.
Estimated: at full logic utilization (90%) with 100% I/O toggle and 3.125 Gbps transceiver active, the EP4CGX15BF14C7N dissipates approximately 1.5-2 W. The 169-FBGA package has a typical junction-to-ambient thermal resistance (theta_JA) of approximately 18 C/W with a standard 4-layer JEDEC test board, resulting in a junction temperature rise of 27C-36C above ambient. For closed-enclosure designs, mount the package on a 4-layer PCB with a continuous ground plane beneath the BGA and via array stitched to the thermal pad to keep junction temperature below 85C commercial limit.
The 169-FBGA ball pitch is 1.0 mm, requiring laser-drilled or fine-pitch chemical-etch PCB vias for fanout. Use 0.5 mm-diameter micro-vias in a 4-layer stack-up (signal-ground-power-signal) with via-in-pad technology for best high-speed transceiver performance. According to Intel AN 522 PCB layout guidelines for Cyclone IV GX, matched differential-pair length matching within 0.127 mm is required for transceiver channels operating above 1 Gbps, and ground return vias must be placed within 1 lambda of each differential pair via transition.
Do not assume that any EP4CGX15BF14 package variant will work as a drop-in replacement - only the BF14 family shares this 169-ball pinout. The EP4CGX15BF14C7N's JTAG and MSEL configuration pins must be strapped correctly via 4.7 kohm pull-ups or pull-downs to select Active Serial (AS), Passive Serial (PS), or JTAG configuration mode. The MSEL pins cannot be left floating or with weak pull resistors; configuration will fail silently if strapping is incorrect. Always verify configuration mode and pin strapping against the device handbook Table 1 before PCB tape-out.
Compliance Information
RoHS compliant per Intel/Altera product page. Commercial speed grade (C7); for automotive qualification choose EP4CGX15BF14A7N (AEC-Q100).