EP4CGX15BF14I8N - Cyclone IV GX FPGA, 14.4K LE, FBGA-169 | Intel
MPN: EP4CGX15BF14I8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $58.2 | $582.00 |
| 100 | $51.4 | $5,140.00 |
| 500 | $46.8 | $23,400.00 |
| 1,000 | $42.1 | $42,100.00 |
EP4CGX15BF14I8N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits in the system hierarchy between fixed-function ASICs (application-specific integrated circuits) and software-driven microcontrollers. Within programmable logic, FPGAs offer higher logic density, faster parallel I/O, and deterministic hardware timing compared with CPLDs (Complex Programmable Logic Devices) or general-purpose MCUs. The Cyclone IV GX family in particular extends the low-cost Cyclone IV E/IV GX architecture with integrated 3.125 Gbps transceivers, targeting cost-sensitive serial-interface applications.
Key features of the EP4CGX15BF14I8N include up to 72 user I/O pins, 16 dedicated 18x18 multipliers for DSP functions, two PLLs, support for DDR/DDR2/QDRII external memory interfaces, and up to 9 transceiver channels running up to 3.125 Gbps. The device operates from a 1.2V core supply with separate VCC_PLL, VCC_GXB (transceiver), and I/O bank rails. Configuration is supported through JTAG, Active Serial, or Passive Serial modes using the dedicated configuration pins.
Architecturally, the EP4CGX15BF14I8N uses SRAM-based logic cells (each containing a 4-input LUT and a register), M9K embedded RAM blocks, and hard IP blocks for transceivers, PLLs, and external memory controllers. This combination delivers deterministic high-speed serial performance with low static power typical of the 60nm node.
Typical applications for the EP4CGX15BF14I8N include low-cost video bridge and protocol-conversion cards, industrial machine-vision interfaces, motor-control front ends, low-density telecom line cards, and consumer display controllers. The integrated transceivers support PCIe Gen1 x1, CPRI, OBSAI, GbE, and Serial RapidIO without external PHY devices, which reduces BOM cost and PCB area.
When designing with the EP4CGX15BF14I8N, follow Intel's PCB layout guidelines for FBGA-169 fan-out: use 0.5mm-pitch microvia stack-ups on the top layer and length-match all GXB serial pairs to within 0.127mm (5 mil) per the transceiver channel-to-channel skew budget. Provide separate decoupling for VCCINT, VCCA, and VCCGXB rails to suppress simultaneous switching noise that would otherwise couple into the transceiver phase-locked loops.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical layout notes not aggregated on a single manufacturer or distributor page.
Drop-in alternatives for EP4CGX15BF14I8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX15BF14I8N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Transceivers, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX15BF14I7N
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View Datasheet βEP4CGX15BF14I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Series | Cyclone IV |
| Logic Elements (LE) | 14,400 |
| Embedded Memory (bits) | 552,960 |
| Embedded RAM Blocks | M9K x 72 |
| DSP (18x18 Multipliers) | 16 |
| PLLs | 2 |
| Maximum User I/O | 72 |
| Transceiver Channels | Up to 9 |
| Max Transceiver Data Rate | 3.125 Gbps |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Package | 169-pin FBGA (F14, 14x14 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | 8 |
| RoHS Status | Compliant |
EP4CGX15BF14I8N 169-pin fbga (f14, 14x14 mm) Pin Configuration Guide
Pin configuration for EP4CGX15BF14I8N (169-pin fbga (f14, 14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX15BF14I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX15BF14I8N is suitable for 6 applications: Low-Cost PCIe Gen1 Endpoint Card, Industrial Machine Vision Interface, Motor Control and Drive Front End, Video Protocol Bridge / Display Controller, Low-Density Wireless Base Station (CPRI/OBSAI), Consumer Display and Projection Controller.
Low-Cost PCIe Gen1 Endpoint Card
The EP4CGX15BF14I8N is well matched to PCIe Gen1 x1 endpoint designs because its GXB transceivers implement the PCIe PCS and PMA hard IP up to 2.5 Gbps without an external PHY. With 14,400 LEs and 72 user I/Os, the device can host a soft IP core plus DMA engine and a custom driver interface in a single chip. Place the EP4CGX15BF14I8N between a downstream root complex and an application-specific I/O connector, length-matching the PCIe transmit pair to within 0.127mm. Compared with a discrete PHY plus CPLD implementation, this single-chip solution saves approximately 40% board area and 30% BOM cost while delivering the deterministic latency PCIe requires.
Recommended
Industrial Machine Vision Interface
The EP4CGX15BF14I8N's industrial temperature range (-40C to +100C) and integrated transceivers up to 3.125 Gbps make it an excellent fit for industrial camera link and CoaXPress interface bridges. The 16 18x18 multipliers support real-time Bayer demosaic and edge-detection pipelines, while 552,960 bits of embedded RAM buffer line-scan image data. Place the FPGA between the image sensor front end and an Ethernet or USB3 uplink, with the GXB channels driving the serial PHY. Its low static power, characteristic of the 60nm node, allows sealed enclosure designs without active cooling, and the FBGA-169 footprint supports compact vision-module form factors.
Recommended
Motor Control and Drive Front End
In three-phase motor-drive front ends, the EP4CGX15BF14I8N provides high-resolution PWM generation, encoder interface, and current-sense ADC sampling at deterministic latency. Its 2 PLLs and 16 dedicated 18x18 multipliers implement field-oriented control (FOC) math, while the 72 user I/Os handle Hall sensors, QEI inputs, and gate-driver enables. The industrial temperature grade supports under-hood and outdoor industrial cabinet installations. Place the device between the MCU supervisory controller and the gate driver stage, decoupling VCCINT and VCCA separately to keep switching noise out of the PLL domain. Compared with an MCU-only solution, the FPGA parallel pipeline drops control-loop latency by typically 60%.
Recommended
Video Protocol Bridge / Display Controller
The EP4CGX15BF14I8N serves as a low-cost video bridge between HDMI, DisplayPort, LVDS, and MIPI DSI sources and sinks, leveraging its multi-standard I/O banks and integrated transceivers. The 72 user I/Os accommodate parallel RGB, LVDS pairs, and I2C/HDMI DDC sideband channels simultaneously. With 552,960 bits of embedded RAM the device can implement a one-frame FIFO buffer for rate-matching. Place the FPGA between the source connector and the panel TCON, with separate VCCIO rails per I/O bank. The FBGA-169 footprint supports compact dongle-style adapters used in conference-room and digital-signage equipment.
Recommended
Low-Density Wireless Base Station (CPRI/OBSAI)
The EP4CGX15BF14I8N's GXB transceivers support CPRI and OBSAI link rates up to 3.072 Gbps, making it a viable baseband-to-radio bridge for small-cell and picocell base stations. The 14,400 logic elements accommodate the CPRI framing, IQ data buffering, and a soft Ethernet or SERDES backhaul interface. Industrial temperature grade supports outdoor small-cell deployments. Place the device between the baseband SoC and the radio front end, with separate VCCGXB rail and Pi-filter isolation to keep phase noise out of the transceiver PLL. Compared with an ASSP CPRI chip, this FPGA implementation allows protocol customization for proprietary radio formats.
Recommended
Consumer Display and Projection Controller
The EP4CGX15BF14I8N supports consumer pico-projector, LED-wall, and large-format LCD controllers where it acts as a TCON replacement with built-in LED driver PWM generation. Its M9K blocks store gamma correction LUTs, while the 16 multipliers implement scaling and warping pipelines. Although the device itself is industrial-grade, the FBGA-169 footprint and Quartus Prime reference designs enable consumer OEMs to add product differentiation while leveraging Intel's verified PCIe/DisplayPort IP. Place the FPGA between the media processor SoC and the panel backplane, with the GXB channels carrying high-speed serial display data.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX15BF14I8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX15BF14I7N | EP4CGX15BF14C8N | EP4CGX15BF14C7N | EP4CGX15BF14C6N | EP4CGX15BF14A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-pin FBGA (F14, 14x14 mm) | 169-pin FBGA (F14, 14x14 mm) - same | 169-pin FBGA (F14, 14x14 mm) - same | 169-pin FBGA (F14, 14x14 mm) - same | 169-pin FBGA (F14, 14x14 mm) - same | 169-pin FBGA (F14, 14x14 mm) - same |
| Logic Elements | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| Embedded Memory (bits) | 552,960 | 552,960 | 552,960 | 552,960 | 552,960 | 552,960 |
| DSP (18x18 Multipliers) | 16 | 16 | 16 | 16 | 16 | 16 |
| Transceivers / Max Data Rate | Up to 9 ch / 3.125 Gbps | Up to 9 ch / 3.125 Gbps | Up to 9 ch / 3.125 Gbps | Up to 9 ch / 3.125 Gbps | Up to 9 ch / 3.125 Gbps | Up to 9 ch / 3.125 Gbps |
| Speed Grade | -8 | -7 (faster) | -8 (same) | -7 (faster) | -6 (fastest) | -7 (faster) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | Automotive grade |
| Approx. Unit Price (qty-1) | $62.50 | $72.30 | $58.40 | $67.20 | $78.50 | $84.10 |
Key Differentiators
- Industrial temperature grade at standard speed grade pricing (vs EP4CGX15BF14C8N)
- Speed-grade -8 cost-versus-performance sweet spot (vs EP4CGX15BF14I7N)
- Integrates high-speed transceivers vs. Cyclone IV E non-transceiver family (vs EP4CE15F14I8N (Cyclone IV E))
Design Notes
The 169-pin FBGA package uses 0.5 mm pitch microvia land pattern. Use a 4-6 layer stack-up with HDI (high-density interconnect) microvias on the top layer to fan out the BGA. Estimated: 0.5 mm-pitch BGA fan-out requires at least 2 breakout layers plus a power plane; 6-layer 1+4+1 stack-up typically supports this part without via-in-pad penalty. Follow Intel Cyclone IV GX hardware reference design AN 532 for exact via pattern dimensions.
Decouple VCCINT, VCCA, VCCPD, and VCCGXB rails with separate bulk capacitors (10 uF + 100 nF + 10 nF) close to each pin group. The transceiver VCCGXB rail is particularly sensitive to ripple; place a Pi-filter (ferrite bead + 10 uF + 100 nF) at the regulator output to isolate the GXB supply from simultaneous switching noise on the core supply. Estimated: total quiescent current for VCCINT is approximately 300 mA at 1.2V; VCCGXB consumes an additional 200-500 mA depending on channel count and data rate.
Length-match all GXB serial transmit and receive pairs to within 0.127 mm (5 mil) on the PCB per the transceiver channel-to-channel skew budget. Use 100-ohm differential impedance for GXB lanes and 90-ohm for LVDS pairs. Series-couple GXB lines with 0.1 uF AC-coupling capacitors as close to the transmit pins as possible. For PCIe Gen1 (2.5 Gbps), maintain -8 dB return loss up to 1.25 GHz on the channel per Intel Cyclone IV GX hardware reference design guidelines.
Do not leave the MSEL[2:0] configuration mode pins floating; tie them to VCCPD or GND with 4.7 kohm resistors to select the correct Active Serial / Passive Serial / JTAG-only configuration mode. Misconfigured MSEL pins are the leading cause of configuration failure on first prototypes. Also ensure the nCONFIG, nSTATUS, and CONF_DONE pins have proper pull-ups as specified in the Cyclone IV Device Handbook, and that JTAG TCK, TMS, TDI, TDO pinout matches the programming header (10-pin or 20-pin) on your board.
Compliance Information
RoHS and REACH compliant per Intel Cyclone IV product family declaration. The 'N' suffix in the part number denotes lead-free (Pb-free) assembly. Standard Cyclone IV GX family is not AEC-Q100 qualified - for automotive grade choose EP4CGX15BF14A7N.
