EPF10K30AQI208-3 - FLEX 10KA FPGA, 30K Gates, 208-PQFP | Altera
MPN: EPF10K30AQI208-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $26.75 | $2,675.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.9 | $18,900.00 |
EPF10K30AQI208-3 Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnects after manufacture. The FLEX 10KA family was Altera's first embedded programmable logic family delivering System-on-a-Programmable-Chip (SOPC) integration, combining a logic array with an embedded array block (EAB) used for memory, multipliers, or specialized functions. Architecturally, an FPGA sits within the broader category of programmable logic -> logic IC -> integrated circuit -> semiconductor.
The EPF10K30AQI208-3 is fabricated on a 0.30 µm CMOS process and operates from a 3.3 V core supply. It supports a maximum internal frequency of 125 MHz and is designed for 3.3 V PCI-compliant I/O with built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990. The industrial temperature grade (-40 °C to +85 °C) makes this part suitable for harsher environments than the commercial-only EPF10K30AQC208-3 variant.
Typical applications include telecommunications line cards, industrial control and factory automation, glue logic replacement for ASICs, PCI interface bridging, and legacy system upgrades where a 3.3 V, 5 V-tolerant I/O FPGA is required. Designers often select the FLEX 10KA family for new system bring-up because of its mature toolchain (Quartus), predictable timing, and long-term availability through the Altera-to-Intel transition.
When designing with the EPF10K30AQI208-3, plan I/O assignments carefully because the PQFP package has limited power/ground pin count, which can constrain signal integrity for high-speed designs. Use the IEEE 1149.1 boundary-scan chain for board-level testing and consider the EPF10K30EQC208-3 (FLEX 10KE) as a drop-in migration path when higher performance or more LE capacity is needed.
This page synthesizes distributor pricing, same-brand drop-in alternatives from the FLEX 10KA/10KE family, and design notes not collated in the original FLEX 10KA datasheet.
Drop-in alternatives for EPF10K30AQI208-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30AQI208-3 (same form factor and footprint) — differing in Family, Process Technology, Package, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30AQC208-3
✅ Drop-In✓ In Stock
$15.4 / Unit
View Datasheet →EPF10K30EQI208-3
✅ Drop-In✓ In Stock
$19.8 / Unit
View Datasheet →EPF10K30EQC208-3
✅ Drop-In✓ In Stock
$26.1 / Unit
View Datasheet →EPF10K30AQI208-3N
✅ Drop-In✓ In Stock
$28.9 / Unit
View Datasheet →EPF10K30AQC208-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.1 / Unit
View Datasheet →EPF10K30EQC208-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.95 / Unit
View Datasheet →EPF10K30AQI208-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KA |
| Logic Elements / Cells | 1,728 |
| Total RAM Bits | 12,288 |
| Typical Gates | 30,000 |
| User I/O Count | 147 |
| Number of Logic Blocks/Elements | 1,728 |
| Supply Voltage | 3.3 V |
| Process Technology | 0.30 µm CMOS |
| Maximum Internal Frequency | 125 MHz |
| Propagation Delay | 0.6 ns |
| Package Type | 208-BFQFP (Power Quad Flat Pack) |
| Number of Pins | 208 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Temperature Grade | Industrial |
| JTAG Support | IEEE Std. 1149.1-1990 Boundary-Scan |
| I/O Standard | 3.3 V PCI compliant, 5 V-tolerant options |
EPF10K30AQI208-3 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank-specific assignment per datasheet) |
| Pin 2 | I/O — User I/O pin |
| Pin 3 | I/O — User I/O pin |
| Pin 4 | I/O — User I/O pin |
| Pin 5 | I/O — User I/O pin |
| Pin 6 | VCCINT — Internal core supply voltage (3.3 V) |
| Pin 7 | GND — Ground |
| Pin 8 | I/O — User I/O pin |
| Pin 9 | I/O — User I/O pin |
| Pin 10 | I/O — User I/O pin |
| Pin 11 | I/O — User I/O pin |
| Pin 12 | I/O — User I/O pin |
| Pin 13 | I/O — User I/O pin |
| Pin 14 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Pin 15 | TMS — JTAG Test Mode Select |
| Pin 16 | TCK — JTAG Test Clock |
| Pin 17 | nSTATUS — Configuration status (open-drain) |
| Pin 18 | nCONFIG — Configuration start (active-low) |
| Pin 19 | CONF_DONE — Configuration complete (open-drain) |
| Pin 20 | MSEL0 — Configuration mode select 0 |
| Pin 21 | MSEL1 — Configuration mode select 1 |
| Pin 22 | DCLK — Configuration clock |
| Pin 23 | DATA0 — Configuration data input |
| Pin 24 | VCCIO — I/O supply voltage (3.3 V) |
| Pin 25 | GND — Ground |
| Pin 26 | I/O — User I/O pin |
| Pin 27 | I/O — User I/O pin |
| Pin 28 | I/O — User I/O pin |
| Pin 29 | CLK0 — Dedicated clock input 0 |
| Pin 30 | CLK1 — Dedicated clock input 1 |
| Pin 31 | I/O — User I/O pin |
| Pin 32 | I/O — User I/O pin |
| Pin 33 | I/O — User I/O pin |
| Pin 34 | I/O — User I/O pin |
| Pin 35 | I/O — User I/O pin |
| Pin 36 | I/O — User I/O pin |
| Pin 37 | I/O — User I/O pin |
| Pin 38 | VCCINT — Internal core supply voltage (3.3 V) |
| Pin 39 | GND — Ground |
| Pin 40 | I/O — User I/O pin |
Typical Applications
EPF10K30AQI208-3 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, PCI Bridge and Interface Logic, Legacy ASIC Replacement, Glue Logic Consolidation, Test and Measurement Equipment.
Telecommunications Line Cards
The EPF10K30AQI208-3's 30K-gate capacity and 147 user I/Os make it well suited for telecom line card glue logic, including T1/E1 framing, HDLC controllers, and low-speed serial multiplexing. The industrial -40 °C to +85 °C temperature range enables deployment in central office and outside-plant cabinets. The 208-pin PQFP package exposes sufficient I/O for parallel backplane interfaces, while the 3.3 V PCI-compliant I/O simplifies interfacing with standard bus ASICs. The FLEX 10KA's 12,288 bits of embedded RAM provide FIFO buffers for data rate adaptation, and the JTAG boundary-scan chain simplifies board-level test of dense BGA-equivalent line card designs.
Recommended
Industrial Control and Factory Automation
For PLC backplanes and motor control boards, the EPF10K30AQI208-3's industrial temperature rating and 1,728 logic elements deliver reliable state-machine implementation for conveyor sequencing, sensor fusion, and PWM generation. The 125 MHz internal frequency supports real-time encoder feedback loops, while 3.3 V I/O with 5 V tolerance allows direct interfacing to legacy 5 V sensors and drivers commonly found in factory environments. The 0.30 µm CMOS process provides robust noise immunity, and the PQFP package withstands the thermal cycling of industrial enclosures. Designers can use the embedded array blocks (EABs) for lookup-table-based waveform synthesis or to implement soft-processor cores for HMI control.
Recommended
PCI Bridge and Interface Logic
The EPF10K30AQI208-3 was explicitly designed for 3.3 V PCI-compliant applications and includes pull-up clamping diodes on a per-pin basis. With 147 user I/Os and 30K gates, it can implement a full custom PCI target or bridge device alongside bus arbitration logic. The 125 MHz core frequency is comfortable for 33 MHz PCI operation with margin for bus turn-around timing. The 208-PQFP provides enough I/O for 32-bit data plus control signals, and the JTAG IEEE 1149.1 boundary scan supports PCI bus conformance testing. For new designs, the FLEX 10KE upgrade (EPF10K30EQC208-3) maintains the same 208-pin footprint and PCI compliance while delivering higher performance.
Recommended
Legacy ASIC Replacement
The EPF10K30AQI208-3 is frequently used as a cost-effective replacement for obsolete ASICs in long-lifecycle systems such as medical instruments, test equipment, and avionics sub-systems. The 30K-gate capacity matches the typical complexity of small-to-medium ASICs, and the FLEX 10KA's deterministic timing simplifies re-validation against the original ASIC specification. The 12,288 bits of embedded RAM replicate common ASIC functions like register files, scratch-pad memory, and microcode storage. Industrial temperature grade and PQFP package compatibility mean existing PCB layouts can be reused without mechanical changes, dramatically reducing the cost of legacy product re-spins.
Recommended
Glue Logic Consolidation
Replacing dozens of 74-series TTL or CMOS logic chips with a single EPF10K30AQI208-3 reduces board area, improves reliability by eliminating inter-chip wiring, and simplifies design changes through software re-programming rather than PCB respins. The 1,728 logic elements can implement counters, address decoders, state machines, bus arbiters, and custom peripherals in a single device. The 147 user I/Os comfortably handle the consolidation of 15-20 discrete logic packages. Industrial temperature rating enables deployment in harsh environments where discrete logic would otherwise need expensive military-screening. The JTAG chain provides board-level interconnect testing that discrete logic cannot.
Recommended
Test and Measurement Equipment
The EPF10K30AQI208-3 finds use in bench-top instruments like logic analyzers, protocol analyzers, and arbitrary waveform generators, where 30K gates can implement stimulus generation, capture buffers, and trigger logic. The 12,288 embedded RAM bits provide sample storage, while the 125 MHz internal frequency supports real-time digital signal processing for measurement pre-processing. JTAG boundary-scan simplifies factory self-test routines, and the industrial temperature grade ensures calibration stability across lab and field environments. The 208-PQFP's manageable pin density allows hand-rework and prototype modification without BGA rework challenges, valuable for low-volume instrument production.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30AQI208-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30AQC208-3 | EPF10K30EQI208-3 | EPF10K30EQC208-3 | EPF10K30AQI208-3N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 208-PQFP | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KA | FLEX 10KA - same | FLEX 10KE | FLEX 10KE | FLEX 10KA - same |
| Temperature Grade | Industrial (-40 to +85 °C) | Commercial (0 to +70 °C) | Industrial (-40 to +85 °C) | Commercial (0 to +70 °C) | Industrial (-40 to +85 °C) |
| Logic Elements | 1,728 | 1,728 (same) | 1,728 (same architecture) | 1,728 | 1,728 (same die) |
| User I/Os | 147 | 147 | 147 | 147 | 147 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (FLEX 10KE EOL) | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade (-40 to +85 °C) variant of the FLEX 10KA family (vs EPF10K30AQC208-3)
- FLEX 10KA architecture with 30K gates and 12,288 RAM bits (vs EPF10K30EQI208-3 (FLEX 10KE))
- 147 user I/Os in 208-pin PQFP (vs EPF10K30EQC208-3 (FLEX 10KE))
- Built-in JTAG boundary-scan (IEEE 1149.1-1990) (vs Discrete logic consolidation)
Design Notes
The 208-pin PQFP package has 0.5 mm lead pitch, which is hand-solderable but requires careful reflow profile control for production. Allocate at least four VCCINT (3.3 V core) and four GND pins with low-inductance power planes directly beneath the package. Place 0.1 µF decoupling capacitors within 5 mm of every VCCINT pin and bulk 10 µF tantalum capacitors at the package corners to suppress simultaneous-switching noise (SSN) on the 147 I/O pins during high-fanout transitions.
Do not confuse the FLEX 10KA (EPF10K30A) with the FLEX 10KE (EPF10K30E) at the board level - although the 208-PQFP pinout is identical and they share the same Quartus II toolchain, the 10KE family has different EAB (Embedded Array Block) configurations and I/O standards. Migration requires recompilation of the design but no PCB changes. Also note that the 'I' suffix in EPF10K30AQI208-3 means industrial temperature grade; using the 'C' (commercial) variant EPF10K30AQC208-3 in industrial environments will cause field failures.
The 208-pin PQFP's lead-frame inductance (~5 nH per pin) limits simultaneous-switching performance on heavily loaded I/O banks. For designs exceeding 16 simultaneously-switching outputs at 50 MHz, use series damping resistors (22-33 Ω) close to the FPGA pin, and split I/O assignments across multiple banks to localize switching currents. The FLEX 10KA supports 3.3 V PCI-compliant I/O with built-in clamping diodes; ensure the PCI bus termination scheme matches the impedance of the board (typically 50-65 Ω controlled-impedance traces) to avoid signal-integrity violations at the 33 MHz PCI clock.
The 208-pin PQFP has a thermal resistance (θJA) of approximately 25 °C/W in still air. At maximum logic utilization (~80% of 1,728 LEs switching at 125 MHz), internal dissipation can reach 1.5-2.0 W, leading to a junction temperature rise of 40-50 °C above ambient. For industrial designs operating at +85 °C ambient, the junction approaches +125 °C which is below the typical +150 °C maximum but provides little margin. Consider forced-air cooling or heatsink attachment for continuous full-load operation in sealed enclosures.
Compliance Information
FLEX 10KA family predates widespread RoHS adoption; EPF10K30AQI208-3 (without N suffix) is likely non-RoHS. EPF10K30AQI208-3N variant carries lead-free finish per naming convention but RoHS compliance should be verified from the manufacturer's documentation. Part is obsolete; new designs should target FLEX 10KE or Cyclone equivalents.
