EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
MPN: EPF10K30EQC208-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.95 | $17,950.00 |
EPF10K30EQC208-1 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration.
Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range.
Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers.
Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses.
When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
Drop-in alternatives for EPF10K30EQC208-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EQC208-1 (same form factor and footprint) — differing in Package, Process Technology, Family, Operating Temperature, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EQC208-1X
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EPF10K30AQC208-1N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF10K100EQC208-1
✅ Drop-In✓ In Stock
$220 / Unit
View Datasheet →EPF10K50EQC208-1
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K30AQC208-1N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF10K30EQC208-1 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Family | FLEX 10K |
| Logic Elements / Cells | 1,728 |
| Total Gates | 30,000 (typical), 119,000 (maximum) |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) |
| Total RAM Bits | 24,576 |
| User I/Os | 147 |
| Core Voltage | 2.5 V (2.375 V–2.625 V) |
| I/O Voltage | 5.0 V tolerant |
| Process Technology | 0.30 µm CMOS SRAM |
| Internal Frequency | 80 MHz (max) |
| Package | 208-BQFP (PQFP) 28×28 mm |
| Mounting Type | Surface Mount (Gull-Wing) |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typ) |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| RoHS Status | Not RoHS compliant (SnPb lead finish on BQFP) |
EPF10K30EQC208-1 Pin Configuration
| Pin 1 | I/O — User I/O bank 1 |
| Pin 2 | I/O — User I/O bank 1 |
| Pin 3 | I/O — User I/O bank 1 |
| Pin 4 | I/O — User I/O bank 1 |
| Pin 5 | I/O — User I/O bank 1 |
| Pin 6 | VCCINT — Core supply 2.5 V |
| Pin 7 | I/O — User I/O bank 1 |
| Pin 8 | I/O — User I/O bank 1 |
| Pin 9 | I/O — User I/O bank 1 |
| Pin 10 | I/O — User I/O bank 1 |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O bank 2 |
| Pin 13 | I/O — User I/O bank 2 |
| Pin 14 | I/O — User I/O bank 2 |
| Pin 15 | I/O — User I/O bank 2 |
| Pin 16 | I/O — User I/O bank 2 |
| Pin 17 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin 18 | I/O — User I/O bank 2 |
| Pin 19 | I/O — User I/O bank 2 |
| Pin 20 | I/O — User I/O bank 2 |
| Pin 21 | I/O — User I/O bank 2 |
| Pin 22 | GND — Ground |
| Pin 23 | I/O — User I/O bank 2 |
| Pin 24 | I/O — User I/O bank 2 |
| Pin 25 | I/O — User I/O bank 2 |
| Pin 26 | I/O — User I/O bank 2 |
| Pin 27 | I/O — User I/O bank 2 |
| Pin 28 | I/O — User I/O bank 2 |
| Pin 29 | I/O — User I/O bank 2 |
| Pin 30 | I/O — User I/O bank 2 |
| Pin 31 | GND — Ground |
| Pin 32 | I/O — User I/O bank 2 |
| Pin 33 | I/O — User I/O bank 2 |
| Pin 34 | I/O — User I/O bank 2 |
| Pin 35 | I/O — User I/O bank 2 |
| Pin 36 | VCCINT — Core supply 2.5 V |
| Pin 37 | I/O — User I/O bank 3 |
| Pin 38 | I/O — User I/O bank 3 |
| Pin 39 | I/O — User I/O bank 3 |
| Pin 40 | I/O — User I/O bank 3 |
| Pin 41 | I/O — User I/O bank 3 |
| Pin 42 | GND — Ground |
| Pin 43 | I/O — User I/O bank 3 |
| Pin 44 | I/O — User I/O bank 3 |
| Pin 45 | I/O — User I/O bank 3 |
| Pin 46 | I/O — User I/O bank 3 |
| Pin 47 | I/O — User I/O bank 3 |
| Pin 48 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin 49 | I/O — User I/O bank 3 |
| Pin 50 | I/O — User I/O bank 3 |
| Pin 51 | I/O — User I/O bank 3 |
| Pin 52 | I/O — User I/O bank 3 |
| Pin 53 | GND — Ground |
| Pin 54 | I/O — User I/O bank 3 |
| Pin 55 | I/O — User I/O bank 3 |
| Pin 56 | I/O — User I/O bank 3 |
| Pin 57 | I/O — User I/O bank 3 |
| Pin 58 | I/O — User I/O bank 3 |
| Pin 59 | I/O — User I/O bank 3 |
| Pin 60 | I/O — User I/O bank 3 |
| Pin 61 | I/O — User I/O bank 3 |
| Pin 62 | GND — Ground |
| Pin 63 | I/O — User I/O bank 3 |
| Pin 64 | I/O — User I/O bank 3 |
| Pin 65 | I/O — User I/O bank 3 |
| Pin 66 | I/O — User I/O bank 3 |
| Pin 67 | VCCINT — Core supply 2.5 V |
| Pin 68 | I/O — User I/O bank 4 |
| Pin 69 | I/O — User I/O bank 4 |
| Pin 70 | I/O — User I/O bank 4 |
| Pin 71 | I/O — User I/O bank 4 |
| Pin 72 | I/O — User I/O bank 4 |
| Pin 73 | GND — Ground |
| Pin 74 | I/O — User I/O bank 4 |
| Pin 75 | I/O — User I/O bank 4 |
| Pin 76 | I/O — User I/O bank 4 |
| Pin 77 | I/O — User I/O bank 4 |
| Pin 78 | I/O — User I/O bank 4 |
| Pin 79 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin 80 | I/O — User I/O bank 4 |
| Pin 81 | I/O — User I/O bank 4 |
| Pin 82 | I/O — User I/O bank 4 |
| Pin 83 | I/O — User I/O bank 4 |
| Pin 84 | GND — Ground |
| Pin 85 | I/O — User I/O bank 4 |
| Pin 86 | I/O — User I/O bank 4 |
| Pin 87 | I/O — User I/O bank 4 |
| Pin 88 | I/O — User I/O bank 4 |
| Pin 89 | I/O — User I/O bank 4 |
| Pin 90 | I/O — User I/O bank 4 |
| Pin 91 | I/O — User I/O bank 4 |
| Pin 92 | GND — Ground |
| Pin 93 | I/O — User I/O bank 4 |
| Pin 94 | I/O — User I/O bank 4 |
| Pin 95 | I/O — User I/O bank 4 |
| Pin 96 | I/O — User I/O bank 4 |
| Pin 97 | I/O — User I/O bank 4 |
| Pin 98 | VCCINT — Core supply 2.5 V |
| Pin 99 | I/O — User I/O bank 5 |
| Pin 100 | I/O — User I/O bank 5 |
| Pin 101 | I/O — User I/O bank 5 |
| Pin 102 | I/O — User I/O bank 5 |
| Pin 103 | GND — Ground |
| Pin 104 | I/O — User I/O bank 5 |
| Pin 105 | I/O — User I/O bank 5 |
| Pin 106 | I/O — User I/O bank 5 |
| Pin 107 | I/O — User I/O bank 5 |
| Pin 108 | I/O — User I/O bank 5 |
| Pin 109 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin 110 | I/O — User I/O bank 5 |
| Pin 111 | I/O — User I/O bank 5 |
| Pin 112 | I/O — User I/O bank 5 |
| Pin 113 | I/O — User I/O bank 5 |
| Pin 114 | GND — Ground |
| Pin 115 | I/O — User I/O bank 5 |
| Pin 116 | I/O — User I/O bank 5 |
| Pin 117 | I/O — User I/O bank 5 |
| Pin 118 | I/O — User I/O bank 5 |
| Pin 119 | I/O — User I/O bank 5 |
| Pin 120 | I/O — User I/O bank 5 |
| Pin 121 | I/O — User I/O bank 5 |
| Pin 122 | I/O — User I/O bank 5 |
| Pin 123 | GND — Ground |
| Pin 124 | I/O — User I/O bank 5 |
| Pin 125 | I/O — User I/O bank 5 |
| Pin 126 | I/O — User I/O bank 5 |
| Pin 127 | I/O — User I/O bank 5 |
| Pin 128 | I/O — User I/O bank 5 |
| Pin 129 | VCCINT — Core supply 2.5 V |
| Pin 130 | I/O — User I/O bank 6 |
| Pin 131 | I/O — User I/O bank 6 |
| Pin 132 | I/O — User I/O bank 6 |
| Pin 133 | I/O — User I/O bank 6 |
| Pin 134 | I/O — User I/O bank 6 |
| Pin 135 | GND — Ground |
| Pin 136 | I/O — User I/O bank 6 |
| Pin 137 | I/O — User I/O bank 6 |
| Pin 138 | I/O — User I/O bank 6 |
| Pin 139 | I/O — User I/O bank 6 |
| Pin 140 | I/O — User I/O bank 6 |
| Pin 141 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin 142 | I/O — User I/O bank 6 |
| Pin 143 | I/O — User I/O bank 6 |
| Pin 144 | I/O — User I/O bank 6 |
| Pin 145 | I/O — User I/O bank 6 |
| Pin 146 | GND — Ground |
| Pin 147 | I/O — User I/O bank 6 |
| Pin 148 | I/O — User I/O bank 6 |
| Pin 149 | I/O — User I/O bank 6 |
| Pin 150 | I/O — User I/O bank 6 |
| Pin 151 | I/O — User I/O bank 6 |
| Pin 152 | I/O — User I/O bank 6 |
| Pin 153 | I/O — User I/O bank 6 |
| Pin 154 | I/O — User I/O bank 6 |
| Pin 155 | I/O — User I/O bank 6 |
| Pin 156 | GND — Ground |
| Pin 157 | I/O — User I/O bank 6 |
| Pin 158 | I/O — User I/O bank 6 |
| Pin 159 | I/O — User I/O bank 6 |
| Pin 160 | I/O — User I/O bank 6 |
| Pin 161 | VCCINT — Core supply 2.5 V |
| Pin 162 | I/O — User I/O bank 6 |
| Pin 163 | I/O — User I/O bank 6 |
| Pin 164 | I/O — User I/O bank 6 |
| Pin 165 | I/O — User I/O bank 6 |
| Pin 166 | I/O — User I/O bank 6 |
| Pin 167 | I/O — User I/O bank 6 |
| Pin 168 | I/O — User I/O bank 6 |
| Pin 169 | I/O — User I/O bank 6 |
| Pin 170 | I/O — User I/O bank 6 |
| Pin 171 | I/O — User I/O bank 6 |
| Pin 172 | I/O — User I/O bank 6 |
| Pin 173 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Pin 174 | TMS — JTAG Test Mode Select |
| Pin 175 | TDI — JTAG Test Data In |
| Pin 176 | TDO — JTAG Test Data Out |
| Pin 177 | nSTATUS — Configuration status (open-drain) |
| Pin 178 | nCONFIG — Configuration start (active-low) |
| Pin 179 | CONF_DONE — Configuration complete (open-drain) |
| Pin 180 | DCLK — Configuration clock input |
| Pin 181 | DATA0 — Configuration data input 0 |
| Pin 182 | nCE — Chip enable (active-low, cascade for multi-device config) |
| Pin 183 | nCEO — Chip enable out (cascade) |
| Pin 184 | CLK0 — Clock input 0 (global) |
| Pin 185 | CLK1 — Clock input 1 (global) |
| Pin 186 | CLK2 — Clock input 2 (global) |
| Pin 187 | CLK3 — Clock input 3 (global) |
| Pin 188 | CLR — Global clear (active-low) |
| Pin 189 | OE — Global output enable |
| Pin 190 | MSEL0 — Configuration mode select 0 |
| Pin 191 | MSEL1 — Configuration mode select 1 |
| Pin 192 | VCCINT — Core supply 2.5 V |
| Pin 193 | I/O — User I/O bank 7 |
| Pin 194 | I/O — User I/O bank 7 |
| Pin 195 | I/O — User I/O bank 7 |
| Pin 196 | I/O — User I/O bank 7 |
| Pin 197 | GND — Ground |
| Pin 198 | I/O — User I/O bank 7 |
| Pin 199 | I/O — User I/O bank 7 |
| Pin 200 | I/O — User I/O bank 7 |
| Pin 201 | I/O — User I/O bank 7 |
| Pin 202 | I/O — User I/O bank 7 |
| Pin 203 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Pin 204 | I/O — User I/O bank 7 |
| Pin 205 | I/O — User I/O bank 7 |
| Pin 206 | I/O — User I/O bank 7 |
| Pin 207 | I/O — User I/O bank 7 |
| Pin 208 | I/O — User I/O bank 7 |
Typical Applications
EPF10K30EQC208-1 is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplanes, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit.
Telecommunications Line-Card Glue Logic
The EPF10K30EQC208-1 is well suited for telecom line cards where it implements glue logic between TDM framers, T1/E1 transceivers, and network processors. Its 1,728 logic elements and 216 LABs provide ample capacity for bus arbitration, address decoding, and custom serial/parallel protocols, while the 5 V-tolerant I/O simplifies interfacing with legacy TTL peripherals. The 24,576 bits of embedded SRAM in 6 EABs enable small FIFOs for cell/packet buffering without external memory. Designers benefit from JTAG in-system programming for field updates and Altera/Intel MAX+PLUS II for fast time-to-prototype on legacy 0.30 µm CMOS architectures.
Recommended
Industrial Control and PLC Backplanes
In industrial control and PLC backplane designs, the EPF10K30EQC208-1 implements custom protocols such as Profibus, Modbus, and CAN bridging between legacy parallel busses and modern serial interfaces. The 2.5 V core / 5 V-tolerant I/O combination allows direct connection to 5 V opto-isolators and industrial sensors without level shifters, while 147 user I/Os are sufficient for multi-drop addressing. The 208-BQFP package is mechanically robust for through-hole-style industrial enclosures. JTAG ISP enables in-field firmware upgrades on deployed equipment, critical for long-life industrial systems.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EPF10K30EQC208-1 to implement timing engines, trigger logic, and custom capture sequencing. The 0.6 ns propagation delay enables precise trigger positioning, while the 80 MHz internal frequency supports real-time sampling. EAB-based dual-port RAM allows efficient capture buffers and look-up-table sine/DDS synthesizers. Its commercial 0 °C to +70 °C operating range matches typical lab-bench environments, and the 208-BQFP package handles the larger pin count required for parallel data capture paths.
Recommended
Legacy Microprocessor Bridge Logic
The EPF10K30EQC208-1 frequently serves as a bridge between older 8/16-bit microprocessors (8086, 68000, Z80) and modern peripherals like USB, Ethernet, or SDRAM controllers. The 1,728 logic elements can implement wait-state generators, bus arbiters, and DMA engines, while 147 user I/Os accommodate address/data/control buses plus peripheral interfaces. The device's 2.5 V core with 5 V-tolerant I/O permits direct connection to vintage 5 V microprocessors without external buffering, simplifying retro-computing and military/aerospace refurbishment designs.
Recommended
Medical Imaging Front-End Signal Routing
Ultrasound and MRI front-end subsystems use the EPF10K30EQC208-1 to route analog front-end channels to ADCs and beamformer DSPs. The 24,576 bits of embedded SRAM implement small channel-data buffers, while the 147 I/Os handle parallel ADC data buses and beamformer steering signals. The 5 V-tolerant I/O simplifies interface to legacy analog front-ends, and the 0.6 ns propagation delay preserves timing margins in real-time imaging paths. Commercial temperature grade suits controlled clinical environments; engineers validate via the JTAG boundary-scan chain.
Recommended
Aerospace & Defense Avionics Retrofit
Long-life aerospace platforms retrofit older FLEX 10KE-based boards with the EPF10K30EQC208-1 to replace end-of-life discrete logic. Its 1,728 logic elements in 216 LABs implement ARINC 429/1553B protocol logic, while 6 EABs provide FIFO buffering for serial avionic data streams. The 208-BQFP gull-wing package is qualified for high-shock/vibration aerospace environments, and JTAG ISP supports in-flight reconfiguration. Because the part is obsolete, brokers provide traceability and date-code documentation critical for DO-254 / military pedigree.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EQC208-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EQC208-1X | EPF10K30AQC208-1 | EPF10K100EQC208-1 | EPF10K50EQC208-1 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-BQFP (PQFP) 28x28 mm | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same | 208-BQFP (PQFP) - same | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KE | FLEX 10KE | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 4,992 | 2,880 | 1,728 |
| Total Gates (typical) | 30,000 | 30,000 | 30,000 | 100,000 | 50,000 | 30,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 12,288 | 40,960 | 20,480 | 12,288 |
| Core Voltage | 2.5 V | 2.5 V | 5.0 V | 2.5 V | 2.5 V | 5.0 V |
| Internal Frequency (max) | 80 MHz | 80 MHz | 166.67 MHz | 80 MHz | 80 MHz | 166.67 MHz |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| RoHS Status | Non-RoHS (SnPb) | RoHS (lead-free) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | RoHS (lead-free) |
Key Differentiators
- RoHS lead-free variant on identical footprint (vs EPF10K30EQC208-1X)
- FLEX 10KE 2.5 V core lowers power vs FLEX 10KA 5 V core (vs EPF10K30AQC208-1 (FLEX 10KA))
- Higher logic capacity in same 208-PQFP footprint (vs EPF10K100EQC208-1)
Design Notes
Estimated: The EPF10K30EQC208-1 requires two supplies — VCCINT = 2.5 V (± 5%, i.e. 2.375 V–2.625 V) for the core and VCCIO = 3.3 V or 5.0 V tolerant for I/O banks. Decouple VCCINT with one 0.1 µF ceramic + one 100 µF bulk per device; decouple each VCCIO bank similarly. Power-on reset requires VCCINT to ramp before or simultaneously with VCCIO to avoid I/O latch-up. Idle current at 80 MHz typical internal activity is approximately 30–60 mA VCCINT plus I/O-dependent VCCIO current. Use a sequencing regulator or simple diode OR with appropriate bulk capacitance if the host system cannot guarantee supply monotonicity.
Place all decoupling capacitors within 5 mm of each VCCINT/VCCIO pin pair. Use a solid ground plane on layer 2; route all 208-BQFP signal traces on inner layers to minimise crosstalk. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 50 Ω characteristic impedance and length-matched to within ±2 cm if used at high programming speeds. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) require pull-up resistors (typically 10 kΩ) to VCCIO. Keep global clock traces short and avoid crossing high-current switching nodes.
Do not confuse the EPF10K30EQC208-1 (FLEX 10KE, 2.5 V core) with the EPF10K30AQC208-1 (FLEX 10KA, 5.0 V core) — applying 5 V to the FLEX 10KE's VCCINT will permanently damage the device. Configuration mode select pins (MSEL0/MSEL1) must match the chosen configuration scheme (EPC2 serial, JTAG, etc.); wrong settings cause configuration failure. When migrating from FLEX 10K to FLEX 10KE, re-fit the design in Quartus II or MAX+PLUS II — bitstreams are not directly compatible despite identical package pin-out.
Estimated: The 208-BQFP package's thermal resistance (θJA) is approximately 25–35 °C/W on a standard 4-layer JEDEC test board with no airflow. At 60 mA core current and 2.5 V VCCINT (0.15 W core dissipation) plus typical I/O switching (~0.2 W average), total power is well under 0.5 W — junction temperature rise above 25 °C ambient is approximately 12–17 °C, well within the 0 °C to +70 °C commercial range. Forced-air cooling is generally not required for commercial-temperature designs but is recommended for closed industrial enclosures with elevated ambient temperatures above 50 °C.
Compliance Information
Standard -1 finish is SnPb (leaded) on 208-BQFP, not RoHS compliant. For RoHS applications, choose EPF10K30EQC208-1X (lead-free finish). REACH, halogen-free, and conflict-mineral status not explicitly documented for this obsolete part; confirm with broker traceability documents.
