EPF81500AQC240-2 - FLEX 8000 FPGA 1296 LE 240-BFQFP | Altera
MPN: EPF81500AQC240-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $90.83 | $90.83 |
| 10 | $82.5 | $825.00 |
| 100 | $74.2 | $7,420.00 |
| 500 | $67.9 | $33,950.00 |
| 1,000 | $61.4 | $61,400.00 |
EPF81500AQC240-2 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically reconfigured after manufacture to implement arbitrary digital logic functions. FPGAs sit hierarchically between programmable logic devices (CPLDs) and application-specific integrated circuits (ASICs), combining high gate density, parallel processing, and rapid time-to-market. The FLEX 8000 family uses a continuous interconnect architecture where horizontal and vertical routing tracks span the entire device, providing predictable timing and uniform routing delays.
Key features include 1,296 logic elements, 162 LABs, 181 user I/Os, embedded SRAM configuration cells, in-system programmability through a ByteBlaster or BitBlaster interface, and operation from a single 5 V supply. The device supports JTAG boundary-scan testing (IEEE 1149.1) and a 4-bit or 8-bit parallel configuration mode, allowing fast on-board programming.
Architecturally, the EPF81500AQC240-2 is built on a CMOS SRAM process with 5.0 V tolerant I/O cells. Each LAB contains eight Logic Elements (LEs) consisting of a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains for fast arithmetic and wide fan-in operations. This structure makes the device suitable for implementing register-rich glue logic, state machines, and small-to-medium bus interfaces.
Typical applications include telecom interface prototyping, industrial control glue logic, bus-bridging glue logic between microprocessors and peripherals, and replacement of multiple discrete MSI/LSI logic packages. The BFQFP-240 footprint with 32 mm × 32 mm body provides through-hole-compatible gull-wing leads for legacy designs and easy rework during prototyping.
When designing with this device, plan for configuration memory retention: the SRAM cells require a configuration download on every power-up via a serial EPROM, JTAG, or parallel controller. The 5 V supply rail requires proper decoupling with 0.1 µF and 10 µF capacitors close to the VCC pins to suppress switching noise.
This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and Octopart, together with drop-in same-brand FLEX 8000 variants, and practical design notes not collated on any single manufacturer page.
Drop-in alternatives for EPF81500AQC240-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF81500AQC240-2 (same form factor and footprint) — differing in Package, Configuration Method, Process Technology, Speed Grade, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF81500AQC240-3
✅ Drop-In✓ In Stock
$21.75 / Unit
View Datasheet →EPF81188AQC240-2
✅ Drop-In✓ In Stock
$27.1 / Unit
View Datasheet →EPF81188AQC240-3
✅ Drop-In✓ In Stock
$30 / Unit
View Datasheet →EPF81188AQC240-4
✅ Drop-In✓ In Stock
$18.2 / Unit
View Datasheet →EPF81500AGC280-3
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EPF81500AQC240-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements | 1296 |
| Number of Logic Array Blocks (LABs) | 162 |
| Number of I/Os | 181 |
| Supply Voltage | 4.75 V to 5.25 V |
| Speed Grade | -2 |
| Package | 240-BFQFP (240-pin Fine-pitch QFP, 32x32 mm) |
| Mounting Type | Surface Mount (gull-wing leads) |
| Configuration Memory | SRAM (volatile, requires configuration download on power-up) |
| Configuration Mode | Serial (BitBlaster) or parallel JTAG |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Process Technology | CMOS SRAM, 5 V tolerant I/O |
| JTAG Support | IEEE 1149.1 boundary-scan |
EPF81500AQC240-2 240-bfqfp (240-pin fine-pitch qfp, 32x32 mm) Pin Configuration Guide
Pin configuration for EPF81500AQC240-2 (240-bfqfp (240-pin fine-pitch qfp, 32x32 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF81500AQC240-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF81500AQC240-2 is suitable for 6 applications: Legacy Telecom Interface Bridging, Industrial Control Glue Logic Replacement, Bus-Bridging for Legacy Microprocessor Systems, Medical Equipment Long-Life Spare Parts, Aerospace Avionics Legacy Spares, Military Communication Equipment.
Legacy Telecom Interface Bridging
The EPF81500AQC240-2 fits telecom interface bridging because its 181 user I/Os and 1296 logic elements can implement multi-channel UART, SPI, and parallel bus bridges simultaneously. At 5 V tolerance, it interfaces directly with legacy telecom line cards that still use TTL or 5 V CMOS peripherals without level shifters. The 162 LABs support wide parallel data paths for TDM bus termination. Design tip: use the dedicated global clock networks for synchronous serial bit-clock distribution to keep skew within one LAB across the device.
Recommended
Industrial Control Glue Logic Replacement
The EPF81500AQC240-2 replaces dozens of 74-series MSI logic packages on legacy industrial control boards, reducing PCB area by up to 70%. With 1,296 logic elements, it implements PLC ladder-replacement logic, encoder interface state machines, and PID control loops in a single device. The 240-BFQFP package supports through-hole rework, valuable when servicing long-life industrial systems with 15-20 year field-deployment horizons.
Recommended
Bus-Bridging for Legacy Microprocessor Systems
The EPF81500AQC240-2's 181 I/Os and 5 V tolerance make it an ideal bus-bridge between legacy 8051, 68k, or PowerPC microprocessors and modern peripherals. The 1,296 logic elements comfortably implement wait-state insertion, byte-swapping, and interrupt-controller functions. The SRAM configuration allows firmware updates via JTAG in the field, supporting long-life medical and avionics systems where PCB rework is impractical.
Recommended
Medical Equipment Long-Life Spare Parts
The EPF81500AQC240-2 serves medical equipment manufacturers maintaining FDA-locked BOMs for diagnostic imaging and patient monitoring systems. Because re-validation cost dominates replacement cost, legacy FPGAs remain in production spare parts inventories for 15+ years. The 240-BFQFP package is hand-solderable, simplifying field service. Rochester Electronics and authorized aftermarket channels stock this part for medical OEMs as of 2026-09-12.
Recommended
Aerospace Avionics Legacy Spares
The EPF81500AQC240-2 supports avionics DO-254-certified systems where design re-validation is prohibitively expensive. Its 5 V tolerance interfaces with legacy cockpit displays, flight-control sensors, and navigation receivers. The 162 LABs and JTAG boundary-scan simplify production testing per DO-254 objectives. Pin-compatible FLEX 8000 variants allow sourcing flexibility for long-tail avionics support programs spanning decades.
Recommended
Military Communication Equipment
The EPF81500AQC240-2 enables MIL-STD-188 and tactical radio interface logic in military communication equipment, where 5 V tolerance and robust 240-BFQFP mechanical packaging are valued. With 1,296 logic elements, the device implements encryption handshake state machines, link-layer protocols, and signal-conditioning glue logic. JTAG boundary-scan satisfies military testability requirements, and authorized aftermarket supply channels ensure long-term availability for defense procurement programs.
Recommended
Recommended Products Summary
Engineering reference data for EPF81500AQC240-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81500AQC240-3 | EPF81188AQC240-2 | EPF81188AQC240-3 | EPF81188AQC240-4 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 240-BFQFP | 240-BFQFP | 240-BFQFP | 240-BFQFP | 240-BFQFP |
| Logic Elements | 1296 | 1296 | 1188 | 1188 | 1188 |
| Number of LABs | 162 | 162 | 148 | 148 | 148 |
| User I/Os | 181 | 181 | 177 | 177 | 177 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Speed Grade | -2 (faster) | -3 | -2 | -3 | -4 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest logic density within FLEX 8000 240-BFQFP family (vs EPF81188AQC240-2)
- Faster speed grade -2 reduces timing closure pressure (vs EPF81500AQC240-3)
- Maximum I/O count within the FLEX 8000 BFQFP family (vs EPF81188AQC240-2)
Design Notes
The EPF81500AQC240-2 requires a tightly regulated 5 V supply (4.75 V to 5.25 V) with bulk decoupling of 33 µF tantalum and 0.1 µF ceramic capacitors placed within 6 mm of every VCC and GND pin pair. Because FLEX 8000 devices exhibit high inrush current during configuration (up to 300 mA peak), use a soft-start circuit on the regulator to prevent supply collapse. Estimated: configuration inrush current 300 mA peak based on typical FLEX 8000 family datasheet values.
Configuration memory is volatile SRAM - the EPF81500AQC240-2 must be reconfigured on every power-up via a serial configuration EPROM (EPC1, EPC1441) or JTAG download. Designs that forget this step appear to 'brick' on power-up. Always include a configuration clock source and confirm the nCONFIG and nSTATUS pins have proper pull-ups. Do not assume factory pre-configuration - this part ships unconfigured.
Estimated: at 100% logic utilization with 5.0 V supply and 25 MHz clock, typical FLEX 8000 power dissipation is around 1.2 W to 1.8 W, requiring copper pour on inner PCB layers to maintain junction temperature below 125 C. The 240-BFQFP package (theta_JA approximately 25 C/W on a 4-layer JEDEC test board) provides moderate thermal headroom; designs operating above 70 C ambient should include thermal vias under the exposed die flag area or use forced-air cooling.
Compliance Information
RoHS/REACH compliance not explicitly documented in the Verified Web Data for this legacy FLEX 8000 part. AEC-Q100 not applicable for FPGA logic devices.
